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The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment. Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni₃Sn₄ phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn₄ phase. After the reflow process and thermal aging of different joints, the growth behavior of interfacial layer was different due to the different mechanism of element diffusion of the two substrates. The PC Ni substrate mainly provided Ni atoms through grain boundary diffusion. The Ni₃Sn₄ phase of the Sn0.05Ni/PC Ni joint was finer, and the diffusion flux of Sn and Ni elements increased, so the Ni₃Sn₄ layer of this joint was the thickest. The SC Ni substrate mainly provided Ni atoms through the lattice diffusion. The Sn0.1Ni/SC Ni joint increases the number of Ni atoms at the interface due to the doping of 0.1Ni (wt.%) elements, so the joint had the thickest NiSn₄ layer.

The effects of doping minor Ni on the microstructure evolution of an Sn-xNi (x = 0, 0.05 and 0.1 Wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment was investigated in this study.

Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni₃Sn₄ phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn₄ phase. After the reflow process and thermal aging of different joints, the growth behavior of the interfacial layer was different due to the different mechanisms of element diffusion of the two substrates.

In this study, the effect of doping Ni on the growth and formation mechanism of IMCs of the Sn-xNi/Ni (single-crystal) solder joints (x = 0, 0.05 and 0.1 Wt.%) was investigated.

Crystallization is the process widely used for components separation and solids purification. The systems for crystallization process evaluation applied so far, involve numerous non-invasive tomographic measurement techniques which suffers from some reported problems. The purpose of this paper is to show the abilities of three-dimensional Electrical Capacitance Tomography (3D ECT) in the context of non-invasive and non-intrusive visualization of crystallization processes. Multiple aspects and problems of ECT imaging, as well as the computer model design to work with the high relative permittivity liquids, have been pointed out.

To design the most efficient (from a mechanical and electrical point of view) 3D ECT sensor structure, the high-precise impedance meter was applied. The three types of sensor were designed, built, and tested. To meet the new concept requirements, the dedicated ECT device has been constructed.

It has been shown that the ECT technique can be applied to the diagnosis of crystallization. The crystals distribution can be identified using this technique. The achieved measurement resolution allows detecting the localization of crystals. The usage of stabilized electrodes improves the sensitivity of the sensor and provides the images better suitable for further analysis.

The dedicated 3D ECT sensor construction has been proposed to increase its sensitivity in the border area, where the crystals grow. Regarding this feature, some new algorithms for the potential field distribution and the sensitivity matrix calculation have been developed. The adaptation of the iterative 3D image reconstruction process has also been described.

Molecular dynamics is an emerging simulation technique in the field of machining in recent years. Many researchers have tried to simulate different processing methods of various materials with the theory of molecular dynamics (MD), and some preliminary conclusions have been obtained. However, the application of MD simulation is more limited compared with traditional finite element model (FEM) simulation technique due to the complex modeling approach and long computation time. Therefore, more studies on the MD simulations are required to provide a reliable theoretical basis for the nanoscale interpretation of grinding process. This study investigates the crystal structures, dislocations, force, temperature and subsurface damage (SSD) in the grinding of iron-nickel alloy using MD analysis.

In this study the simulation model is established on the basis of the workpiece and single cubic boron nitride (CBN) grit with embedded atom method and Morse potentials describing the forces and energies between different atoms. The effects of grinding parameters on the material microstructure are studied based on the simulation results.

When CBN grit goes through one of the grains, the arrangement of atoms within the grain will be disordered, but other grains will not be easily deformed due to the protection of the grain boundaries. Higher grinding speed and larger cutting depth can cause greater impact of grit on the atoms, and more body-centered cubic (BCC) structures will be destroyed. The dislocations will appear in grain boundaries due to the rearrangement of atoms in grinding. The increase of grinding speed results in the more transformation from BCC to amorphous structures.

This study is aimed to study the grinding of Fe-Ni alloy (maraging steel) with single grit through MD simulation method, and to reveal the microstructure evolution within the affected range of SSD layer in the workpiece. The simulation model of polycrystalline structure of Fe-Ni maraging steel and grinding process of single CBN grit is constructed based on the Voronoi algorithm. The atomic accumulation, transformation of crystal structures, evolution of dislocations as well as the generation of SSD are discussed according to the simulation results.