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Proper selection of the stability parameter determines the accuracy of dendrite tip kinetics at a single crystal scale. Recently developed sophisticated phase field modelling of a single grain evolution provides evidence that this parameter is not constant during the process. Nevertheless, in the commonly used micro-macroscopic simulations of alloy solidification, it is a common practice to use a constant value of the stability parameter, resulting from the marginal stability theory. This paper aims to address the issue of how this inaccuracy in modelling crystal growth kinetics can influence numerically predicted zones of columnar and equiaxed dendrites and the macro-segregation formation.

Using the original authors’ micro-macroscopic computer simulation model of binary alloy solidification, the calculations have been performed for the Kurz-Giovanola-Trivedi (KGT) crystal growth kinetics with two different values of the stability parameter, and for two different compositions of Al-Cu alloys. The computational model is based on single domain-based formulation of transport equations, which are discretized on control-volume mesh. To identify zones of different grain structures, developing within the two-phase liquid-solid region, an envelope of columnar dendrite tips is tracked on a fixed non-orthogonal, triangular control volume grid. The models of porous and slurry media are used, along with the concept of the switching function, to account for diverse flow resistances in the columnar and equiaxed crystal zones. The numerical predictions are carefully studied to address the question of how the chosen stability parameter influences macroscopic structures of a cast, the most important issue from the engineering point of view.

The carried-out comprehensive numerical analysis shows that the value of the stability parameter of the KGT-constrained dendrite growth model does not have a direct significant impact on the macrosegregation formation. It, however, visibly influences the undercooling along the front, separating different dendritic structures and the size of the undercooled melt region where the equiaxed grains can develop. It also affects the amount of eutectic phase created.

To the best of the authors’ knowledge, this is the first attempt at estimating the influence of some inaccuracies, caused by possible ambiguities in choosing the stability constant of the KGT law, on numerically predicted macroscopic fields of solute concentration, the developing zones of columnar and equiaxed crystals and the macrosegregation patterns.

The purpose of this paper is to endorse the idea of using a special post-calculating front tracking (FT) procedure, along with the enthalpy-porosity front tracking (EP-FT) single continuum model, in order to identify zones of different dendritic microstructures developing in the mushy zone during cooling and solidification of a binary alloy.

The 2D and 3D algorithms of the FT approach along with different crystal growth laws were implemented in macroscopic calculations of binary alloy solidification with the identification of different dendrite zones developing during the process.

Direct comparison of results predicted by the FT model with that based on the concept of the critical value of the solid volume fraction shows the sensitivity of the latter on an arbitrary assumed value of the dendrite coherency point (DCP). Moreover, for a carefully chosen DCP value the second model provides results that are close to those given by the FT-based approach. It is also observed that the macro-segregation pattern obtained by the proposed method is hardly influenced by chosen dendrite tip kinetics.

To the best authors’ knowledge, for the first time the 3D FT model has been used along with the enthalpy porosity approach to simulate the development of zones of different dendrite morphology during binary alloy solidification. And, a weak influence of assumed different dendrite tip kinetics on the macro-segregation pattern has been proved, what justifies this underlying assumption of the EP-FT method.

The paper describes two well‐known and occasionally confused mechanisms for degradation of electronic circuitry. Intended as a tutorial for individuals working in electronic packaging who have limited background in materials and little experience with these mechanisms, the paper defines and describes the two latent shorting phenomena. Major papers and conferences dealing with the phenomena are cited. Electrolytic or electrochemical shorting is an electrical field‐induced mechanism that can destroy the integrity of modern, densely packed circuits operated in the presence of moisture and ionic contaminants. Examples of copper migration to form electroplated shorts in both thick film hybrid multilayer and printed circuit multilayer boards are discussed, and common features to both systems are outlined. Related mechanisms that may occur with the simple electrochemical (metal plating) mechanisms to produce a broad array of electrical isolation breakdowns are also described. The closing of this part of the paper is a brief review of the Sarnoff‐developed RCA/GE multilayer copper materials system. By design this system solves the problems raised regarding thick film copper multilayer latent failure mechanisms. The discussion of whisker growth is limited to proper whiskers, including those that grow without the application of external stress, squeeze whiskers, and whiskers that result from classic electromigration. All of these grow from solid sources in contact with the whisker. The whisker growth direction is not electrical field related. Identification is made of Sn, Cd, Sb and Zn as the materials classically found to grow whiskers at room temperature. Avoiding the use of electroplated films of Cd, Sb and Zn in close proximity to electronic circuitry is encouraged, and the modern requirements that Sn films be used only after melting, or be alloyed with lead, and not on brass substrates are discussed. In more recent literature indium alloys have been identified as room temperature whisker growth systems. Finally, mechanical design to eliminate squeeze whisker shorting that can result from fasteners in contact with the above and other metals is briefly treated.

This study aims to evaluate the influence of pulsed cathodic protection on calcareous deposit formation on structures submerged in the synthetic sea water.

Chronoamperometric and C_HF methods have been used to evaluate the influence of pulsed cathodic protection on decreasing the required cathodic current for protection and also decreasing the surface coverage. The morphology of the formed deposits was evaluated using scanning electron microscopy. Chemical analyses of the formed deposits were performed using energy dispersive X‐ray spectrometer and X‐ray diffraction.

It was observed that pulse frequency influenced both the structure and the composition of the deposits. The most compact aragonite layer was obtained at high frequencies and at a high off‐time. It was clearly shown that by applying currents with less than 100 Hz frequency, the deposits formed on the sample involved CaCO₃ (aragonite) and Mg(OH)₂ (brucite). However, the kinetics of deposits formed when applying pulse current have been improved, compared to deposits formed by conventional cathodic protection. The reason is that large electrode overpotential favors nucleation through a decrease in the energy of nucleus formation. On the other hand, by intensive decrease of surface potential, repulsion of aggressive anions such as SO₄²⁻ and Cl⁻ occurs. These anions inhibit the formation of aragonite deposits.

In order to have a better investigation of electrodeposition processes in the shorter time, the use of more advanced techniques and analysis methods such as XPS is recommended. Furthermore, EHD techniques could be used for measurements of thickness of the layers.

The pulsed cathodic protection method is a relatively new method for the protection of buried and submerged structures. Recently, many researches have investigated that the influence of this technique on increasing the throwing power, decreasing interference effects on neighboring structures and increasing the uniformity of current distribution under cathodic protection.

Very little attention has been paid in the past to the effect of pulsed CP on deposit formation. The present paper, therefore, contributes useful understanding of the mechanism and advantages of such deposits in improving the effectiveness and lowering the operational cost of cathodic protection in use on offshore structures.

This study aims to investigate the influence of polyepoxysuccinic acid sodium (PESA), a green antiscalant, on the nucleation, crystallization and precipitation of magnesium phosphate.

The conductivity method was used to investigate the maximum relative supersaturation of magnesium phosphate across various PESA dosages. Subsequently, a magnesium phosphate scale was prepared using the static scale inhibition method (GB/T16632-1996) and then analyzed via scanning electron microscopy.

The findings showed that PESA extends the induction period of magnesium phosphate crystallization, reduces crystal growth rate and elevates the solution’s relative supersaturation. Notably, PESA exerts a low dosage effect on inhibition of the magnesium phosphate scale, with the optimal dosage identified at 10 mL. Scanning electron microscopy revealed that PESA dispenses a dispersing effect on the magnesium phosphate scale, generating numerous concave, convex and deeper pores on the scale particles’ surface, and thereby significantly enhancing the surface area, especially when using an antiscalant with variable dosages.

This study sheds new light on the impact of PESA, a green antiscalant, on the crystallization and precipitation of magnesium phosphate, thus paving the way for the development of enhanced and eco-friendly scale inhibition strategies in future applications.

This paper aims to study the oxidation kinetics of the nanocrystalline Al ultrathin films. The influence of structure and composition evolution during thermal oxidation will be observed. The reason for the change in the oxidation activation energy on increasing the oxidation temperature will be discussed.

Al thin films are deposited on the silicon wafers as substrates by vacuumed thermal evaporation under the base pressure of 2 × 10⁻⁴ Pa, where the substrates are not heated. A crystalline quartz sensor is used to monitor the film thickness. The film thickness varies in the range from 30 to 100 nm. To keep the silicon substrate from oxidation during thermal oxidation of the Al film, a 50-nm gold film was deposited on the back side of silicon substrate. Isothermal oxidation studies of the Al film were carried out in air to assess the oxidation kinetics at 400-600°C.

The activation energy is positive and low for the low temperature oxidation, but it becomes apparently negative at higher temperatures. The oxide grains are nano-sized, and γ-Al₂O₃ crystals are formed at above 500°C. In light of the model by Davies, the grain boundary diffusion is believed to be the reason for the logarithmic oxidation rate rule. The negative activation energy at higher temperatures is apparent, which comes from the decline of diffusion paths due to the formation of the γ-Al₂O₃ crystals.

It is found that the oxidation kinetics of nanocrystalline Al thin films in air at 400-600°C follows the logarithmic law, and this logarithmic oxidation rate law is related to the grain boundary diffusion. The negative activation energies in the higher temperature range can be attributed to the formation of γ-Al₂O₃ crystal.

The aim of this paper is to investigate the growth behaviours of intermetallic compound (IMC) layers in solid‐liquid interfacial reactions of Sn1.5Cu/Cu in various intensities of high‐magnetic field.

Sn1.5Cu solder was prepared and melted in a vacuum furnace at 873 K and cast into solder bars. Samples were mounted using resin and etched after being carefully polished. Then the IMC layers were observed by using scanning electron microscopy.

The results show that the growth of IMC layers has been accelerated by high‐magnetic field through the comparison of growth kinetics of IMC layers among 0‐2.5 T magnetic filed. IMC grains in high‐magnetic field are much bigger than that in 0 T. By the analyzing of X‐ray diffractometer patterns of IMC layers, it can be found that the orientations of IMC have been changed by magnetic field.

This paper investigates the growth behaviour of IMC layers during the solid‐liquid interfacial reactions of Sn1.5Cu/Cu in a high magnetic field.

The purpose of this study is to reveal the effect of nano-Al₂O₃ particle addition on the nucleation/growth kinetics, microhardness, wear resistance and corrosion resistance of Co–P–xAl₂O₃ nanocomposite plating.

The kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating prepared by electroplating were investigated by electrochemical measurements, scanning electron microscopy, X-ray diffraction, X-ray photoelectron spectroscopy, Vickers microhardness measurement, SRV5 friction and wear tester and atomic force microscopy.

A 12 g/L nano-Al₂O₃ addition in the plating solution can transform the nucleation/growth kinetics of the plating from the 3D progressive model to the 3D instantaneous model. The microhardness of the plating increased with the increase of nano-Al₂O₃ content in plating. The wear resistance of the plating did not adhere strictly to Archard’s law. An even and denser corrosion product film was generated due to the finer grains, with a high corrosion resistance.

The effect of different nano-Al₂O₃ addition on the nucleation/growth kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating was investigated, and an anticorrosion mechanism of Co–P–xAl₂O₃ nanocomposite plating was proposed.

The purpose of this paper is to study the isothermal and nonisothermal crystallisation kinetics of pure polypropylene (PP), 1 kGy pre‐irradiated PP and 1 kGy pre‐irradiated PP/syndiotactic 1,2‐polybutadiene (s‐1,2 PB) (90/10) blends by differential scanning calorimetry.

The Avrami equation, modified Avrami equation, Ozawa equation and the treatment by combining the Avrami and Ozawa equation were used to analyse the isothermal and nonisothermal crystallisation of various samples.

The s‐1,2 PB acted as a heterogeneous nucleation agent during the crystallisation of the PP/s‐1,2 PB blends and accelerated the crystallisation rate. The Avrami exponent n of the blends implied that the isothermal crystallisation kinetics of the blends followed a three‐dimensional growth via heterogeneous nucleation. The modified Avrami equation was limited to describe the nonisothermal crystallisation process of pure PP and 1 kGy pre‐irradiated PP, but it was successful for the blends. The treatment by combining the Avrami and Ozawa equation described appropriately the nonisothermal crystallisation process and obtained the kinetic parameter F(T) with specific physical meaning. The crystallisation activation energy for isothermal crystallisation and nonisothermal crystallisation of the blends was reduced due to the s‐1,2 PB acting as a heterogeneous nucleating agent during the crystallisation of the blends and accelerating the crystallisation rate.

The Avrami equation, modified Avrami equation, Ozawa equation and the treatment by combining the Avrami and Ozawa equation were compared for analysis of the isothermal and nonisothermal crystallisation of samples. The crystallisation activation energy for isothermal crystallisation and nonisothermal crystallisation was also calculated according to the Arrhenius and the Kissinger method.

The fundamental research on the crystallisation properties of PP/s‐1,2‐PB blends is essential to understand the mutual effects of two components on their crystallisation mechanisms, facilitating to improve the mechanical properties of the final materials.

The isothermal and nonisothermal crystallisation behaviours of PP/s‐1,2 PB blends, especially pre‐irradiated PP/s‐1,2 PB blends, have not been studied systematically yet, though PP/s‐1,2 PB blends were promising materials in terms of both PP toughening and the application of s‐1,2 PB thermal plastic elastomer.