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This study aims to investigate the fatigue crack propagation behavior of SiC particle-reinforced 2124 Al alloy composites under constant amplitude axial loading at a stress ratio of R = 0.1. For this purpose, it is performed experiments and comparatively analyze the results by producing 5, 10, 15 Vol.% SiCp-reinforced composites and unreinforced 2124 Al alloy billets with powder metallurgy (PM) production technique.

With the PM production technique, SiCp-reinforced composite and unreinforced 2124 Al alloy billets were produced at 5%, 10%, 15% volume ratios. After the produced billets were extruded and 5 mm thick plates were formed, tensile and fatigue crack propagation compact tensile (CT) samples were prepared. Optical microscope examinations were carried out to determine the microstructural properties of billet and samples. To determine the SiC particle–matrix interactions due to the composite microstructure, unlike the Al alloy, which affects the crack initiation life and crack propagation rate, detailed scanning electron microscopy (SEM) studies have been carried out.

Optical microscope examinations for the determination of the microstructural properties of billet and samples showed that although SiC particles were rarely clustered in the Al alloy matrix, they were generally homogeneously dispersed. Fatigue crack propagation rates were determined experimentally. While the highest crack initiation resistance was achieved at 5% SiC volume ratio, the slowest crack propagation rate in the stable crack propagation region was found in the unreinforced 2124 Al alloy. At volume ratios greater than 5%, the number of crack initiation cycles decreases and the propagation rate increases.

As a requirement of damage tolerance design, the fatigue crack propagation rate and fatigue behavior of materials to be used in high-tech vehicles such as aircraft structural parts should be well characterized. Therefore, safer use of these materials in critical structural parts becomes widespread. In this study, besides measuring fatigue crack propagation rates, the mechanisms causing crack acceleration or deceleration were determined by applying detailed SEM examinations.

The purpose of this paper is to determine (1) the relationship between microstructure and fatigue cracking behavior and (2) effect of rolling on the process of crack initiation and propagation in FeCrAl alloys.

The qualitative and quantitative fracture studies were performed using scanning electron microscopy and the non-contact optical measurement system (IFMG5).

The results show that the formation of facets, rough facets and parallel stripes in the crack initiation and early crack propagation zones are closely related to the sensitivity of crack behavior to the microstructure of the material. Besides, the rolling process has a significant influence on the small crack initiation and propagation behavior. Quantitative analysis demonstrates that the size of the stress intensity factor and plastic zone size in the rough zone is associated with the rolling process.

The findings of this study have the potential to enhance the understanding of the microstructural crack formation mechanisms in FeCrAl alloys and shed light on the impact of rolling on the long-term and ultra-long fatigue behavior of these alloys. This new knowledge is vital for improving manufacturing processes and ensuring the safety and reliability of FeCrAl alloys used in nuclear industry applications.

This study aims to investigate crack propagation in a moisture-preconditioned soft-termination multi-layer ceramic capacitor (MLCC) during thermal reflow process.

Experimental and extended finite element method (X-FEM) numerical analyses were used to analyse the soft-termination MLCC during thermal reflow. A cross-sectional field emission scanning electron microscope image of an actual MLCC’s crack was used to validate the accuracy of the simulation results generated in the study.

At 270°C, micro-voids between the copper-electrode and copper-epoxy layers absorbed 284.2 mm/mg³ of moisture, which generated 6.29 MPa of vapour pressure and caused a crack to propagate. Moisture that rapidly vaporises during reflow can cause stresses that exceed the adhesive/substrate interface’s adhesion strength of 6 MPa. Higher vapour pressure reduces crack development resistance. Thus, the maximum crack propagation between the copper-electrode and copper-epoxy layers at high reflow temperature was 0.077 mm. The numerical model was well-validated, as the maximum crack propagation discrepancy was 2.6%.

This research holds significant implications for the industry by providing valuable insights into the moisture-induced crack propagation mechanisms in soft-termination MLCCs during the reflow process. The findings can be used to optimise the design, manufacturing and assembly processes, ultimately leading to enhanced product quality, improved performance and increased reliability in various electronic applications. Moreover, while the study focused on a specific type of soft-termination MLCC in the reflow process, the methodologies and principles used in this research can be extended to other types of MLCC packages. The fundamental understanding gained from this study can be extrapolated to similar structures, enabling manufacturers to implement effective strategies for crack reduction across a wider range of MLCC applications.

The moisture-induced crack propagation in the soft-termination MLCC during thermal reflow process has not been reported to date. X-FEM numerical analysis on crack propagation have never been researched on the soft-termination MLCC.

The purpose of this paper is to apply the concept of equivalent initial flaw size (EIFS) to the anisotropic nickel-based single crystal (SX) material, and to predict the fatigue life on this basis. The crack propagation law of SX material at different temperatures and the weak correlation of EIFS values verification under different loading conditions are also investigated.

A three-parameter time to crack initial (TTCI) method with multiple reference crack lengths under different loading conditions is established, which include the TTCI backstepping method and EIFS fitting method. Subsequently, the optimized EIFS distribution is obtained based on the random crack propagation rate and maximum likelihood estimation of median fatigue life. Then, an effective driving force based on anisotropic and mixed crack propagation mode is proposed to describe the crack propagation rate in the small crack stage. Finally, the fatigue life of three different temperature ESE(T) standard specimens is predicted based on the EIFS values under different survival rates.

The optimized EIFS distribution based on EIFS fitting - maximum likelihood estimation (MLE) method has the highest accuracy in predicting the total fatigue life, with the range of EIFS values being about [0.0028, 0.0875] (mm), and the mean value of EIFS being 0.0506 mm. The error between the predicted fatigue life based on the crack propagation rate and EIFS distribution for survival rates ranges from 5% to 95% and the experimental life is within two times dispersion band.

This paper systematically proposes a new anisotropic material EIFS prediction method, establishing a framework for predicting the fatigue life of SX material at different temperatures using fracture mechanics to avoid inaccurate anisotropic constitutive models and fatigue damage accumulation theory.

This study provides an analysis of patch repair for cracked aircraft structures. Delamination is a type of damage that affects the patch's behavior. The purpose of this study is to assess the influence of delamination on repair performance.

An analytical and numerical study using the finite element method was conducted for a cracked plate repaired with a patch containing a pre-existing delamination defect. The method for defining the contact pair surfaces and modeling the delamination interaction within the patch interface is specified using the virtual crack closure technique (VCCT) approach.

The efficiency of the repair is measured in terms of the J-integral. The effects of delamination initiation, mechanical loading, crack length and patch stacking sequences are presented. It is noted that in mode I, delamination propagation is only significant at node A. The numerical results are in good agreement with those of the analytical solution found in the literature. It is observed that the patch's behavior is strongly dependent on loading, crack size and stacking sequences in terms of reducing the structure's lifespan, especially in the presence of delamination.

The numerical modeling presented by the VCCT approach is highly valuable for studying delamination evolution. The influence of loading, crack size and stacking sequences on repair performance is discussed in this work.

This paper aims to study the influence of different reinforcement methods on crack monitoring characteristics of eddy current array sensors, and the sensors with two different reinforcement methods, SUS304 reinforcement and permalloy reinforcement, are proposed.

First, the finite element model of the sensor is established to analyze the influence of the reinforcement plate’s electromagnetic parameters on the crack identification sensitivity. Then, the crack monitoring accuracy test of sensors with two reinforcement methods is carried out. Finally, the fatigue crack monitoring experiments with bolt tightening torques of 45 and 63 N · m are carried out, respectively.

In this study, it is found that the crack identification sensitivity of the sensor can be improved by increasing the relative permeability of the reinforcement plate. The crack monitoring accuracy of the sensors with two different reinforcement methods is about 1 mm. And the crack identification sensitivity of the sensor reinforced by permalloy reinforcement plate is significantly higher than that of the sensor reinforced by SUS304 reinforcement plate.

The sensor reinforced by reinforcement plate can work normally under the squeezing action of the bolt, and the crack monitoring sensitivity of the sensor can be significantly improved by using the reinforcement plate with high relative permeability.

This paper aims to study the interfacial delamination found in the boundary of the copper/copper-epoxy layers of a multi-layer ceramic capacitor.

The thermal reflow process of the capacitor assembly and the crack propagation from the initial micro voids presented in the boundary, and later manifested into delamination, were numerically simulated. Besides, the cross section of the capacitor assembly was inspected for delamination cracks and voids using a scanning electronic microscope.

Interfacial delamination in the boundary of copper/copper-epoxy layers was caused by the thermal mismatch and growth of micro voids during the thermal reflow process. The maximum deformation on the capacitor during reflow was 2.370 µm. It was found that a larger void would induce higher vicinity stress, mode I stress intensity factor, and crack elongation rate. Moreover, the crack extension increased with the exerted deformation until 0.3 µm, before saturating at the peak crack extension of around 0.078 µm.

The root cause of interfacial delamination issues in capacitors due to thermal reflow has been identified, and viable solutions proposed. These can eliminate the additional manufacturing cost and lead time incurred in identifying and tackling the issues; as well as benefit end-users, by promoting the electronic device reliability and performance.

To the best of the authors’ knowledge, the mechanism of delamination occurrence in a capacitor during has not been reported to date. The parametric variation analysis of the void size and deformation on the crack growth has never been conducted.

This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue.

The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated.

Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length.

This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints.

The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. The parametric variation of the crack length on stress and fatigue characteristics of solder joints, which has never been conducted, is also studied.

This study presents finite element (FE) and generalized regression neural network (GRNN) approaches for modeling multiple crack growth problems and predicting crack-growth directions under the influence of multiple crack parameters.

To determine the crack-growth direction in aluminum specimens, multiple crack parameters representing some degree of crack propagation complexity, including crack length, inclination angle, offset and distance, were examined. FE method models were developed for multiple crack growth simulations. To capture the complex relationships among multiple crack-growth variables, GRNN models were developed as nonlinear regression models. Six input variables and one output variable comprising 65 training and 20 test datasets were established.

The FE model could conveniently simulate the crack-growth directions. However, several multiple crack parameters could affect the simulation accuracy. The GRNN offers a reliable method for modeling the growth of multiple cracks. Using 76% of the total dataset, the NN model attained an R2 value of 0.985.

The models are presented for static multiple crack growth problems. No material anisotropy is observed.

In practical crack-growth analyses, the NN approach provides significant benefits and savings.

The proposed GRNN model is simple to develop and accurate. Its performance was superior to that of other NN models. This model is also suitable for modeling multiple crack growths with arbitrary geometries. The proposed GRNN model demonstrates its prediction capability with a simpler learning process, thus producing efficient multiple crack growth predictions and assessments.

The interaction between rock mass structural planes and dynamic stress levels is important to determine the stability of rock mass structures in underground geotechnical engineering. In this work, the authors aim to focus on the degradation effects of fracture geometric parameters and unloading stress paths on rock mechanical properties.

A three-dimensional Particle Flow Code (PFC3D) was used for a systematic numerical simulation of the strength failure and cracking behavior of granite specimens containing prefabricated cracks under conventional triaxial compression and triaxial unilateral unloading. The authors demonstrated the unique mechanical response of prefabricated fractured rock under two conditions. The crack initiation, propagation, and coalescence process of pre-fissured specimens were analyzed in detail.

The authors show that the prefabricated cracks and unilateral unloading conditions not only deteriorate the mechanical strength but also have significant differences in failure modes. The degrading effect of cracks on model strength increases linearly with the decrease of the dip angle. Under the condition of true triaxial unilateral unloading, the deterioration effect of peak strength of rock is very significant, and unloading plays a role in promoting the instability failure of rock after peak, making the rock earlier instability failure. Associating with the particle vector diagram and crack coalescence process, the authors find that model failure mode under unilateral loading conditions is obviously distinct from that in triaxial loading. The peak strain in the unloading direction increases sharply, resulting in a new shear slip.

This study is expected to improve the understanding of the strength failure and cracking behavior of fractured rock under unilateral unloading.