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Presents a new wire bondable land grid array (LGA) chip scale package called NuCSP. NuCSP is a minimized body size wire bondable package with rigid substrate interposer. The design concept is to utilize the plating bars on the edges of the package substrate as the wire bond fingers. Bond fingers are redistributed inward to an array of plated through hole vias underneath the chip, then are connected to copper pads on the bottom of the package. NuCSP package size is about equal to die size + 3 mm. Using conventional PCB substrate manufacturing with 4/4 mils routing width/space and wire bonding process, NuCSP offers a very low cost package suitable for memory chips and low pin count application specific IC (ASIC) applications. The other advantages are that the use of wirebonding allow NuCSP be applicable for die size, pad count and pitch variations. Because it is wire bondable, NuCSP may be as generic as plastic quad flat pack (PQFP), yet providing smaller body size, lower cost and smaller package electrical parasitic parameters.

Managing the serials budget presents an ongoing challenge to librarians. Today, no other budget item is scrutinized as carefully as serials expenditures. Information carries an ever‐escalating price tag; the process of turning information into a published format is an expensive one. There are people costs, editing costs, printing costs, paper costs, binding costs, packaging costs and fulfillment costs. While our society recognizes access to information as a fundamental right of each individual, librarians today find themselves faced with the loaded problem of deciding what serial tides to cancel or what important new ones to simply not purchase.

To provide an insight and view of the expected directions for microelectronic packaging, at chip level, that ties in current developments to the needs envisaged by emerging technology roadmaps.

The requirements for packaging semiconductor devices have become a new technology driver for the electronics “Final Manufacturing” industry. In line with forecasts and roadmaps, the expected multitude of options are being developed in order to meet the demand of an industry which requires ever more complex devices which exhibit both higher reliability and lower cost.

As application potentials develop, so package cost becomes the driver. In turn, low cost package solutions are becoming the drivers for new technologies such as “last‐mile” fibre optic Telecom systems, 3G phones, bluetooth and sensors. MEMS devices are a key example of how applications are pushing the technologies to create cost effective packaging.

The emerging packaging technologies, currently BGA's and chip size packaging's (CSP), continue to develop to meet the needs of electronic devices, driven by the “smaller, faster, cheaper” paradigm. However the final manufacturing and testing aspects of such needs are often overlooked and as such the test industry faces a number of severe challenges in terms of handling these new package technologies.

By looking at the market trends and how these new technologies are developing, especially with respect to emerging developments in CSP, flip chip and wafer level packaging, solutions for many of the challenges posed can be determined.

This paper provides a market analysis of the trends and directions of the chip packaging industry. It has taken data from a wide number of sources of market information and compared the expectations of each to actual emerging applications. The resulting information is expected to become a benchmark for this aspect of the semiconductor manufacturing industry.

A new solder‐bumped flip chip land grid array (LGA) chip scale package (CSP) called NuCSP is presented in this paper. NuCSP is a minimized body size package with a rigid substrate (interposer). The design concept is to utilize the interposer to redistribute the very fine pitch peripheral pads on the solder‐bumped chip to much larger pitch area‐array pads on the printed circuit board (PCB). Using conventional PCB substrate manufacturing processes, NuCSP offers a very low‐cost package suitable for memory chips and low pin‐count application‐specific ICs (ASICs). Also, NuCSP is surface mount technology (SMT) compatible and can be joined to the PCB with a 6‐mil (0.15mm) thick 63wt %Sn‐37% Pb solder paste.

Plastic ball grid arrays (PBGAs) have been gaining increasing industry acceptance as potentially the lowest cost packages for high pin count applications. The main factors for their success include the inherent low cost of plastic packages, the high yields achievable with existing assembly equipment, the density advantages of an area array and, in many cases, superior electrical performance. The reliability of these packages with respect to solder joint fatigue has been extensively studied; however, little has been published on their reliability with respect to moisture‐related failure mechanisms during assembly, such as popcorning. In this study, two types of plastic ball grid array packages, a 225‐lead full matrix array and a 256‐lead perimeter array, which were preconditioned by baking at 125°C for 24 hours followed by exposure to 85°C and 30% relative humidity for 168 hours, were then subjected to three passes of simulated infra‐red reflow at 1°C/s and 0.67°C/s. Subsequent examination using scanning acoustic microscopy and environmental scanning electron microscopy revealed considerable delamination and cracking in both package types reflowed at the higher ramp rate. This damage originated in the die attach and propagated along the weakest interfaces in the package. At the lower ramp rate, a much smaller amount of delamination was observed. This suggests that there is a critical ramp rate below which popcorn cracking can be inhibited.

Numerous research articles and industry reports are currently available that deal with global sourcing, however, few articles and reports can be specifically found on sourcing packaging materials in the consumer packaged food (CPF) industry. The purpose of this paper is to understand and develop the supplier selection process and overall cost modeling that facilitates the selection of a high‐quality global supplier for low‐cost packaging materials used in large quantities for CPF products.

To gain information relating to packaging material sourcing, a comprehensive literature search was conducted. Additionally, interviews with packaging material sourcing managers and directors were performed at a major global CPF products manufacturer. Knowledge gained from literature, industry interviews and available business data was used to develop a generic strategic outsourcing model and a closed loop business framework for selection of global suppliers of packaging material. This framework utilizes the proposed total cost of ownership model for global sourcing and weighted qualitative criteria matrix demonstrating how it is used in global supplier selection.

The results of this study show a standardized supplier selection process and the total cost of ownership model for a CPF manufacturer which incorporates the different logistic costs such as tariffs, duties, inventory carrying levels and cost of quality. These two models are then merged into a selection matrix to determine with which supplier to enter into a long‐term supply relationship.

The paper combines both the relevant closed loop supplier selection modeling framework and the total cost of ownership model in the selection of supplier for low‐cost high‐volume CPF materials. It adds rigor regarding cost of ownership and emphasizes the need for a strategic rationale when entering into long‐term global supply relationships between CPF products manufacturers and packaging material suppliers.

Illustrates the selection of accounting software packages (AP) by correlating user needs to system specifications. A recommendation report ranks the software in descending order of their correlations to user needs. As a by‐product the system educates the consultant or user by explaining the specifications, making their expectations more realistic and avoiding unpleasant “after the fact” surprises.

The purpose of this paper is to develop a set of affordable retrofit packages that can be applied to existing residential buildings in hot-humid regions to improve occupants’ thermal comfort and reduce energy consumption.

A critical review of relevant literature to identify passive design strategies for improving thermal comfort and reducing energy consumption in hot-humid climates with focus on the building envelope was conducted in addition to a simulation study of an existing building typology in study area.

There is enormous potential to reduce energy costs and improve thermal comfort through building retrofit packages which is a recent concept in developing countries, such as Nigeria. Analysing the results of the retrofit interventions using building energy simulation helped in developing affordable retrofit packages which had optimum effect in improving indoor comfort temperature to the neutral temperature specified for hot humid Nigeria and further down to 3°C less than that of the reference building used. The use of passive design strategies to retrofit the building might help homeowners reduce their annual energy consumption by up to 46.3 per cent just by improving the indoor thermal comfort.

In addition to improving thermal comfort and reducing energy consumption, this research identified affordable retrofit packages and considered its cost implications especially to low-income earners who form a larger population of Lagos, Nigeria, as this was not considered by many previous researchers.

Preface The functions of business divide into several areas and the general focus of this book is on one of the most important although least understood of these—DISTRIBUTION. The particular focus is on reviewing current practice in distribution costing and on attempting to push the frontiers back a little by suggesting some new approaches to overcome previously defined shortcomings.