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New and ever more demanding applications of microelectronics require advances in design and optimization of components and packages, in relatively short periods of time, while satisfying electrical, thermal, and mechanical specifications, as well as cost and manufacturability expectations, without compromise to reliability and durability. Therefore, time efficient methodologies for detecting, locating and sizing damage early in the product development process are required. In this paper, a novel hybrid methodology, based on a combined use of recent advances in optics and computational modeling, is described and its application is demonstrated by a case study of a microelectronic component subjected to cyclic electro‐thermo‐mechanical loadings. Using the hybrid, optical‐computational approach, displacements and deformations are determined with high spatial resolution and measurement accuracy and provide indispensable data for development, optimization, and thermal management in microelectronics and packaging.

Integrity of surface mount technology (SMT) components depends on their response to temperature changes caused by operating conditions. Temperature induced differential thermal expansions lead to strains in the interconnection structures of active devices. To evaluate these strains, temperature profiles of the interconnected components must be known. In this paper, a methodology for developing thermal models of SMT components is presented using thermal analysis system (TAS) and its application is demonstrated by simulating thermal fields of a representative package. Then, thermomechanical deformations of the package are measured quantitatively using state‐of‐the‐art laser‐based optoelectronic holography (OEH) methodology.