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This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly.

In this work, through experiments and numerical simulations, an attempt has been made to increase the fundamental natural frequency of the PCB assembly as high as practically achievable so as to minimize the impacts of dynamic loads acting on it. An optimization tool in the finite element software (ANSYS) was used to search the specified design space for the optimal support location of the six fastening screws.

It is observed that by changing the support locations based on the optimization results the fundamental natural frequency can be raised up to 51.1% and the same is validated experimentally.

Manufacturers of PCBs used in computers fix the support locations based on symmetric feature of the board not on the dynamic behavior of the assembly. This work might lead manufacturers to redesign the location of other surface mount components.

This work provides guidelines for PCB manufacturers to finalize their support locating points which will improve the dynamic characteristics of the PCB assembly during its functioning.

This study provides a novel method to improve the life of PCB based on support locations optimization which includes majority of the surface mount components that contributes to the total mass the PCB assembly.

This paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with different structure parameters under increasingly harsh environment.

A finite element model for a system-in-package module was built with moisture-thermal-mechanical-coupled effects to study the subsequences of hygrothermal conditions.

It was found in this paper that the moisture diffusion path was mainly dominated by hygrothermal conditions, though structure parameters can affect the moisture distribution. At lower temperatures (30°C~85°C), the direction of moisture diffusion was from the periphery to the center of the module, which was commonly found in simulations and literatures. However, at relatively higher temperatures (125°C~220°C), the diffusion was from printed circuit board (PCB) to EMC due to the concentration gradient from PCB to EMC across the EMC/PCB interface. It was also found that there exists a critical thickness for EMC and PCB during the moisture diffusion. When the thickness of EMC or PCB increased to a certain value, the diffusion of moisture reached a stable state, and the concentration on the die surface in the packaging module hardly changed. A quantified correlation between the moisture diffusion coefficient and the critical thickness was then proposed for structure parameter optimization in the design of system-in-package module.

The different moisture diffusion behaviors at low and high temperatures have seldom been reported before. This work can facilitate the understanding of moisture diffusion within a package and offer some methods about minimizing its effect by design optimization.

This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.

The fine-pitch stencil used in this work is fabricated by electroform process and subsequently nano-coated using the PVD process. Stencil printing process was then performed to print the solder paste onto the printed circuit board (PCB) pad. The solder paste release was observed by solder paste inspection (SPI) and analyzed qualitatively and quantitatively. The printing cycle of up to 80,000 cycles was used to investigate the life span of stencil printing.

The finding shows that the performance of stencil printing in terms of solder printing quality is highly dependent on the surface roughness of the stencil aperture. PVD-coated stencil aperture can prolong the life span of stencil printing with an acceptable performance rate of about 60%.

Stencil printing is one of the important processes in surface mount technology to apply solder paste on the PCB. The stencil’s life span greatly depends on the type of solder paste, stencil printing cycles involved and stencil conditions such as the shape of the aperture, size and thickness of the stencil. This study will provide valuable insight into the relationship between the coated stencil wall aperture via PVD process on the life span of fine-pitch stencil printing.

Polymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested and reported. The purpose of this paper is suggesting thin film-based TIM to sustain the light-emiting diode (LED) performance and electronic device miniaturization.

Consequently, ZnO thin film at various thicknesses was prepared by chemical vapour deposition (CVD) method and tested their thermal behaviour using thermal transient analysis as solid TIM for high-power LED.

Low value in total thermal resistance (R_th-tot) was observed for ZnO thin film boundary condition than bare Al boundary condition. The measured interface (ZnO thin film) resistance {(R_th-bhs) thermal resistance of the interface layer (thin film) placed between metal core printed circuit board (MCPCB) board and Al substrates} was nearly equal to Ag paste boundary condition and showed low values for ZnO film prepared at 30 min process time measured at 700 mA. The T_J value of LED mounted on ZnO thin film (prepared at 30 min.) coated Al substrates was measured to be 74.8°C. High value in junction temperature difference (ΔT_J) of about 4.7°C was noticed with 30 min processed ZnO thin film when compared with Al boundary condition. Low correlated colour temperature and high luminous flux values of tested LED were also observed with ZnO thin film boundary condition (processed at 30 min) compared with both Al substrate and Ag paste boundary condition.

Overall, 30 min CVD processed ZnO thin film would be an alternative for commercial TIM to achieve efficient thermal management. This will increase the life span of the LED as the proposed material decreases the T_J values.

Most of the linear encoders are based on optics. The accuracy and reliability of these encoders are greatly reduced in polluted and noisy environments. Moreover, these encoders have a complex structure and large sensor volume and are thus not suited to small application scenarios and do not have universality. This paper aims to present a new absolute magnetic linear encoder, which has a simple structure, small size and wide application range.

The effect of swing error is analyzed for the sensor structural arrangement. A double-threshold interval algorithm is then proposed to synthesize multiple interval electrical angles into absolute angles and convert them into actual displacement distances.

The final linear encoder measurement range is 15.57 mm, and the resolution reaches ± 2 µm. The effectiveness of the algorithm is demonstrated experimentally.

The linear encoder has good robustness, and high measurement accuracy, which is suitable for industrial production. The linear encoder has been mass-produced and used in an electric power-assisted braking system.

Induction heating processes need to adapt to complex geometries or variable processes that require a high degree of flexibility in the induction heating setup. This is usually done using complex inductors or adaptable resonant tanks, which leads to costly and constrained implementations. This paper aims to propose a multi-level, versatile power supply able to adapt the output to the required induction heating process.

This paper proposes a versatile multilevel topology able to generate versatile output waveforms. The methodology followed includes simulation of the proposed architecture, design of the power electronics, control and magnetic elements and laboratory tests after building a 10-level prototype.

The proposed converter has been designed and tested using an experimental prototype. The designed generator is able to operate at 1 kVpp and 100 A at 250 kHz, proving the feasibility of the proposed approach.

The proposed converter enables versatile waveform generation, enabling advanced tests and processes on induction heating system. The proposed system allows for multifrequency generation using a single inductor and converter, or advanced tests for inductive and capacitive components used on induction heating systems. Unlike previous multifrequency proposals, the proposed generator enables a significantly improved versatility in terms of operational frequency and amplitude in a single converter.

This paper aims to concentrate on recent innovations in flexible wearable sensor technology tailored for monitoring vital signals within the contexts of wearable sensors and systems developed specifically for monitoring health and fitness metrics.

In recent decades, wearable sensors for monitoring vital signals in sports and health have advanced greatly. Vital signals include electrocardiogram, electroencephalogram, electromyography, inertial data, body motions, cardiac rate and bodily fluids like blood and sweating, making them a good choice for sensing devices.

This report reviewed reputable journal articles on wearable sensors for vital signal monitoring, focusing on multimode and integrated multi-dimensional capabilities like structure, accuracy and nature of the devices, which may offer a more versatile and comprehensive solution.

The paper provides essential information on the present obstacles and challenges in this domain and provide a glimpse into the future directions of wearable sensors for the detection of these crucial signals. Importantly, it is evident that the integration of modern fabricating techniques, stretchable electronic devices, the Internet of Things and the application of artificial intelligence algorithms has significantly improved the capacity to efficiently monitor and leverage these signals for human health monitoring, including disease prediction.

This research aims to investigate how manufacturing flexibility can address the challenges of an ever-changing and unpredictable business environment in Bangladesh’s labor-intensive ready-made garment (RMG) industry, which is underserved and situated in a developing country.

Using Partial Least Square Structural Equation Modeling, this study empirically evaluated the relationships between manufacturing flexibility, environmental uncertainty and firm performance. The analysis utilized 320 survey responses from potential RMG experts, representing 95 organizations.

The study achieved a decision-making model for implementing manufacturing flexibility in the RMG industry of Bangladesh with acceptable model fit criterion. The research pinpointed that workforce flexibility plays the maximum mediating among different types of manufacturing in coping with demand and supply uncertainty in the RMG sector.

The study made valuable contributions to theoretical and practical knowledge in the context of manufacturing flexibility in Bangladesh’s RMG and other underserved labor-intensive sectors in developing economies. It suggests that managers should shift from defensive and risky business strategies to more aggressive and proactive approaches by utilizing workforce flexibility resources adaptively to enhance manufacturing capabilities and align with dynamic market demand. Additionally, the study offers recommendations for future research to build upon its findings.

This study is unique in its approach because it presents a decision model for implementing manufacturing flexibility in a labor-intensive industry in a developing economy, specifically the RMG industry in Bangladesh, whereas previous research has primarily focused on high-tech industries in developed economies.

In the context of fixed-wing aircraft wing assembly, there is a need for a rapid and precise measurement technique to determine the center distance between two double-hole components. This paper aims to propose an optical-based spatial point distance measurement technique using the spatial triangulation method. The purpose of this paper is to design a specialized measurement system, specifically a spherically mounted retroreflector nest (SMR nest), equipped with two laser displacement sensors and a rotary encoder as the core to achieve accurate distance measurements between the double holes.

To develop an efficient and accurate measurement system, the paper uses a combination of laser displacement sensors and a rotary encoder within the SMR nest. The system is designed, implemented and tested to meet the requirements of precise distance measurement. Software and hardware components have been developed and integrated for validation.

The optical-based distance measurement system achieves high precision at 0.04 mm and repeatability at 0.02 mm within a range of 412.084 mm to 1,590.591 mm. These results validate its suitability for efficient assembly processes, eliminating repetitive errors in aircraft wing assembly.

This paper proposes an optical-based spatial point distance measurement technique, as well as a unique design of a SMR nest and the introduction of two novel calibration techniques, all of which are validated by the developed software and hardware platform.