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Geared toward engineers, managers and supervisors in the areas of quality, manufacturing engineering and production, ‘Quality Factors in Fabricating Printed Circuit Boards’ will take place in Dallas, May 23rd, Boston, June 19th, Chicago, October 3rd and Orlando, November 21st. This full day seminar examines techniques and rationale for inspection at various stages in the manufacturing process.

Despite recent economic gloom, Bolton based Vantage Circuit Products Ltd have achieved continued growth and have recently appointed Bernard Mulhall as Sales Manager responsible for their rapidly developing business in chemicals and materials for the electronics industry in the South of England.

To highlight the differences and common features of taboo search (TS) and genetic algorithms (GA) in solving the problem of board‐type sequencing on the assembly line simultaneously with the combined problem of feeder assignment and component placement sequencing in the printed circuit board (PCB) industry.

Two metaheuristics (search techniques) are used to solve three problems associated with the PCB assembly line: TS and GA. The implemented approach is used to solve the three problems on a single pick‐and‐place sequential machine with a stationary board table and stationary feeders, and with the use of the Euclidean metric.

The achieved results show a satisfactory reduction in assembly time, when TS and GA are compared with a random solution, with a slight superiority of TS over GA. However, the program running time is longer for TS.

The hypothetical case study used shows that in real life the savings could reach an average of 6 per cent when TS is used. Slightly lower savings are possible when GA is used.

This paper provides a clear insight into how some of the problems associated with the production of PCBs can be solved simultaneously using metaheuristics such as TS and GA.

The purpose of this study is to investigate heat transfer and deformation of flexible printed circuit board (FPCB) under thermal and flow effects by using fluid structure interaction. This study simulate the electronic cooling process when electronic devices are generating heat during operation at FPCB under force convection.

The thermal and flow effects on FPCB with attached ball grid array (BGA) packages have been investigated in the simulation. Effects of Reynolds number (Re), number of BGA packages attached, power supplied to the BGA packages and size of FPCB were studied. The responses in the present study are the deflection/length of FPCB (δ/L) and Nusselt number (Nu).

It is important to consider both thermal and flow effects at the same time for understanding the characteristic of FPCB attached with BGA under operating condition. Empirical correlation equations of Re, Prandtl number (Pr), δ/L and Nu have been established, in which the highest effect is of Re, followed by Pr and δ/L. The δ/L and Nu¯ were found to be significantly affected by most of the parametric factors.

This study provides a better understanding of the process control in FPCB assembly.

This study provides fundamental guidelines and references for the thermal coupling modelling to address reliability issues in FPCB design. It also increases the understanding of FPCB and BGA joint issues to achieve high reliability in microelectronic design.

In order to handle high and rapid production demands, printed circuit board (PCB) manufacturers have employed high‐speed surface mount machines into their assembly lines. These machines have abilities of fast component placements, but provide challenges for process engineers to optimise the component placement sequences and feeder arrangements via effective planning. A computer program was developed based on operating concepts using genetic algorithm, to solve for various component placement sequencing planning of the high‐speed chipshooter. Genetic algorithms are a class of general purpose search methods based on the concepts of genetic evolution and survival of the fittest. The program provides information on component placement sequences and feeder arrangements for optimal assembly times. Initial tests have shown that the size of the parent space affects the convergence of the solutions during iterations. Finally, comparisons of results have shown improvement over those previously obtained by other researchers.