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The purpose of this paper is to help high frequency circuit designers understand how to choose the best permittivity value for a laminate material for accurate modeling.

In this paper, experimental measurements of the performance of simple circuits are compared to various mathematical and software models.

Higher permittivity values were obtained using samples with bonded copper foil compared to samples etched free of foil. These higher values yielded better agreement between measured and modelled performance using current automated design software. High profile foil on thin laminates was found to increase the surface impedance of the conductor and change the propagation constant and apparent permittivity of the laminate by 15 percent or more. It was also demonstrated that, under some circumstances, the anisotropy of the substrate could result in differences in measured and modelled performance.

Only a limited number of circuit laminate materials were closely examined. Future work should include a wider variety of laminates.

The paper details the magnitude of the effects of test method, conductor profile and substrate anisotropy on the values of a material's permittivity best suited for circuit design purposes.

This paper examines the US opera sector as a means for interrogating how varying forms of non-standard work shape gender inequality in the creative industries.

The authors draw on 16 seasons of opera production data from Operabase.com to conduct a gender-based exploratory data analysis of the key creative roles of conductor, director and designers, as well as the hiring networks through which teams are formed, at the 11 largest opera companies in the United States.

The authors find that women, as a group, experienced gender-based disadvantage across the key creative roles of opera production, but particularly in the artistic leadership roles of conductor and director. The authors also find that women's exclusion in the field is being further perpetuated by the sector's non-standard and overlapping employment structures, which impacts women practitioners' professional visibility and career opportunities.

The study can help organizations implement strategic hiring practices that acknowledge the relationship between gender inequality and varying forms of non-standard work with the aim of increasing women's representation.

This study work establishes the scale of gender inequality operating within a sector that has received minimal scholarly attention as a site of employment. The study analysis also offers important insight for the wider creative industries and highlights opportunities to redress gender inequality in other sectors where project-based work is prevalent.

The purpose of this paper is to establish an accurate model to quantify the effect of conductor roughness on insertion loss (IL) and provide improved measurements and suggestions for manufacturing good conductive copper lines of printed circuit board.

To practically investigates the modified model of conductor roughness, three different kinds of alternate oxidation treatments were used to provide transmission lines with different roughness. The IL results were measured by a vector net analyzer for comparisons with the modified model results.

An accurate model, with only a 1.8% deviation on average from the measured values, is established. Compared with other models, the modified model is more reliable in industrial manufacturing.

This paper introduces the influence of tiny roughness structures on IL. Besides, this paper discusses the effect of current distribution on IL.

In various publications noble steel is mentioned as a possibility for use as a substrate in thick film technology processing. The possibility to cut, stencil and drill steel sheets to desired shapes and the attractive price difference compared with alumina as well as PC board materials justified an investigation. A variety of steel sheets in various formulations from various vendors is offered on the market as well as ceramic pastes for thick film applications. This investigation aims to find out the most suitable ceramic paste for coating steel substrates in a common thick film process.

In the production of printed circuit assemblies, the demand for higher reliability levels has increased over the years. In order to achieve a high level of soldering quality, it is essential that solderability is built into the system at all stages and various factors must be taken into account. In the first section of this paper some of these factors are discussed. The various solderable coalings that are available are reviewed, some of the problems that can be encountered are illustrated and the effects of impurities in solders discussed. In the second part of the paper, the use of circuit boards having fused tin/lead coatings is discussed from the solderability point of view.

Copper substrates covered with ceramic insulating coating were tested for their ability to be used in thick film technology. The ceramic coating was prepared by screen printing from a dielectric composition containing special glass and aluminium oxide and was fired at 820°C–1,000°C. The electrical properties of the coatings studied included voltage breakdown, surface and bulk insulation resistance and dielectric constant. Resistor compositions designed for use on ceramic substrates were screen printed, as on the substrates mentioned, on alumina or ceramic‐coated steel substrates and fired up to the required temperatures (820–875°C). The resistivity and TCR of the prepared resistors were measured in relation to firing temperature. The distribution of lead, bismuth, ruthenium, barium, palladium, silver and copper in the system resistor (or conductor) ceramic coating/copper substrate was investigated. Reference was made to the application of ceramic coatings on copper in other fields, e.g., in heavy‐current electronics.

Printed (circuit) boards have been used in the electronics industry for the past 25 years and more. The technology used to design and manufacture PCBs is well known and accepted. Recently, however, designers of electronic equipment have shown that the use of newer materials and systems, such as flexible and moulded circuits, hybrid circuits, or a combination of these, can significantly improve the cost/performance ratio for electronic interconnects. This paper examines some of the many possibilities open to electronics designers and how these new opportunities can improve the economics and performance of electronic equipment.

Inverting electroheat problems involves synthesizing the electromagnetic arrangement of coils and geometries to realize a desired heat distribution. To this end two finite element problems need to be solved, first for the magnetic fields and the joule heat that the associated eddy currents generate and then, based on these heat sources, the second problem for heat distribution. This two-part problem needs to be iterated on to obtain the desired thermal distribution by optimization. Being a time consuming process, the purpose of this paper is to parallelize the process using the graphics processing unit (GPU) and the real-coded genetic algorithm, each for both speed and accuracy.

This coupled problem represents a heavy computational load with long wait-times for results. The GPU has recently been demonstrated to enhance the efficiency and accuracy of the finite element computations and cut down solution times. It has also been used to speedup the naturally parallel genetic algorithm. The authors use the GPU to perform coupled electroheat finite element optimization by the genetic algorithm to achieve computational efficiencies far better than those reported for a single finite element problem. In the genetic algorithm, coding objective functions in real numbers rather than binary arithmetic gives added speed and accuracy.

The feasibility of the method proposed to reduce computational time and increase accuracy is established through the simple problem of shaping a current carrying conductor so as to yield a constant temperature along a line. The authors obtained a speedup (CPU time to GPU time ratio) saturating to about 28 at a population size of 500 because of increasing communications between threads. But this far better than what is possible on a workstation.

By using the intrinsically parallel genetic algorithm on a GPU, large complex coupled problems may be solved very quickly. The method demonstrated here without accounting for radiation and convection, may be trivially extended to more completely modeled electroheat systems. Since the primary purpose here is to establish methodology and feasibility, the thermal problem is simplified by neglecting convection and radiation. While that introduces some error, the computational procedure is still validated.

The methodology established has direct applications in electrical machine design, metallurgical mixing processes, and hyperthermia treatment in oncology. In these three practical application areas, the authors need to compute the exciting coil (or antenna) arrangement (current magnitude and phase) and device geometry that would accomplish a desired heat distribution to achieve mixing, reduce machine heat or burn cancerous tissue. This process presented does it more accurately and speedily.

Particularly the above-mentioned application in oncology will alleviate human suffering through use in hyperthermia treatment planning in cancer treatment. The method presented provides scope for new commercial software development and employment.

Previous finite element shape optimization of coupled electroheat problems by this group used gradient methods whose difficulties are explained. Others have used analytical and circuit models in place of finite elements. This paper applies the massive parallelization possible with GPUs to the inherently parallel genetic algorithm, and extends it from single field system problems to coupled problems, and thereby realizes practicable solution times for such a computationally complex problem. Further, by using GPU computations rather than CPU, accuracy is enhanced. And then by using real number rather than binary coding for object functions, further accuracy and speed gains are realized.

Considers, without loss of generality, a simple linear problem, where in a certain domain the magnetic field, generated by infinitely long conductors, whose locations as well as the currents are unknown, has to meet a certain figure. The problem is solved by applying hierarchical simulated annealing, which iteratively reduces the dimension of the search space to save computational cost. A Gauss‐Newton scheme, making use of analytical Jacobians, preceding a sequential quadratic program (SQP), will be applied as a second approach to tackle this severely ill‐posed problem. The results of these two techniques will be analyzed and discussed and some comments on future work will be given.

On October 31st 1985, 48 members of the ISHM‐Benelux Chapter met at the Delft University of Technology for the Autumn 1985 meeting.