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1 – 10 of over 1000
Article
Publication date: 16 March 2015

Johannes Glasschroeder, Emanuel Prager and Michael F. Zaeh

The purpose of this paper is to show a possibility of how new functions can be integrated in parts, created by the powder-bed-based 3D-printing technology. One big advantage of…

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Abstract

Purpose

The purpose of this paper is to show a possibility of how new functions can be integrated in parts, created by the powder-bed-based 3D-printing technology. One big advantage of additive manufacturing technologies is the possibility to create function-integrated parts during the manufacturing process. This applies to mechanical functions like movable elements, thermodynamic functions like contour near cooling channels in a part as well as electrical functions like conductive lines and electrical components.

Design/methodology/approach

A powder-bed-based 3D-printer is utilized to process polymethyl methacrylate (PMMA) as base material. To enable new functionalities, an automated exhausting mechanism was implemented into the test system. The created cavities can be filled with new components or rather new materials.

Findings

Three different approaches are shown in this paper. The first one was the integration of screw nuts to enhance bolted joints compared to threads, directly created in the part. The average tensile strength could be raised from 200 to 430 N/mm. The second approach was the integration of different reinforcement elements like carbon or metallic fibers. Here again a reinforcement of the tensile strength of approximately 27 per cent could be reached. The last approach shows a method to integrate conductive material as well as electrical components in a part to create simple electrical circuits.

Originality/value

The paper demonstrates how to extend an additive powder-bed-based technology with a powder-exhausting mechanism. The possibilities of this technology are illustrated by three examples, integrating mechanical as well as electrical functions in a part.

Details

Rapid Prototyping Journal, vol. 21 no. 2
Type: Research Article
ISSN: 1355-2546

Keywords

Article
Publication date: 15 January 2018

Grzegorz Tomaszewski, Jerzy Potencki and Tadeusz Wałach

This paper aims to study the packing density of printed paths on different substrate materials. It presents problems which appear when the necessity of printing one or more narrow…

Abstract

Purpose

This paper aims to study the packing density of printed paths on different substrate materials. It presents problems which appear when the necessity of printing one or more narrow paths occurs.

Design/methodology/approach

A piezoelectric printhead containing nozzles with a diameter of 35 µm was used for printing nanoparticle silver ink on different polymer substrates which were treated by plasma or not treated at all. The shape, defects, resistance and printing parameters for the printed paths were analysed.

Findings

The obtained results allow the identification of the sources of the technological problems in obtaining a high packing density of the paths in a small area of substrate and the repeatable prints.

Research limitations/implications

The study could have limited universality because of the chosen research method; printhead, ink, substrate materials and process parameters were arbitrarily selected. The authors encourage the study of other kinds of conductive inks, treatment methods and printing process parameters.

Practical implications

The study includes practically useful information about widths, shapes, defects and the resistance of the paths printed using different technological parameters.

Originality/value

The study presents the results of original empirical research on problems of the packing density of inkjet printed paths on a small area of substrate and identifies problems that must be resolved to obtain effective interconnections in the inkjet technology.

Details

Circuit World, vol. 44 no. 1
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 1 February 2016

Paweł Osypiuk, Andrzej Dziedzic and Wojciech Stęplewski

The purpose of this paper is to determine the influence of mechanical factors (such as longitudinal elongation or cyclic compressive and tensile stresses) on electrical properties…

Abstract

Purpose

The purpose of this paper is to determine the influence of mechanical factors (such as longitudinal elongation or cyclic compressive and tensile stresses) on electrical properties of thin- or thick-film resistors or conductors.

Design/methodology/approach

All test samples were made on Kapton foil. Copper foil or silver-based polymer thick-film conductive inks were used for fabrication of conductors. Resistive structures were made with the aid of two polymer thick-film resistive inks or OhmegaPly Ni-P resistive foil. Test structures differ not only in materials applied for resistors or conductors but also in geometrical shape of functional tracks (meanders consisted of many horse-shoes, semicircles, squares or triangles).

Findings

Presented results showed significant role of material on range of reversible resistance changes. But shape of test samples also affects relation between relative resistance changes and relative elongation.

Originality/value

In general, changes induced by cyclic compressive and stretching stresses were smaller than those caused by substrate elongation.

Details

Soldering & Surface Mount Technology, vol. 28 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Content available

Abstract

Details

Circuit World, vol. 39 no. 4
Type: Research Article
ISSN: 0305-6120

Article
Publication date: 6 January 2022

Lijuan Huang, Zhenghu Zhu, Hiarui Wu and Xu Long

As the solution to improve fatigue life and mechanical reliability of packaging structure, the material selection in PCB stack-up and partitioning design on PCB to eliminate the…

Abstract

Purpose

As the solution to improve fatigue life and mechanical reliability of packaging structure, the material selection in PCB stack-up and partitioning design on PCB to eliminate the electromagnetic interference by keeping all circuit functions separate are suggested to be optimized from the mechanical stress point of view.

Design/methodology/approach

The present paper investigated the effect of RO4350B and RT5880 printed circuit board (PCB) laminates on fatigue life of the QFN (quad flat no-lead) packaging structure for high-frequency applications. During accelerated thermal cycling between −50 °C and 100 °C, the mismatched coefficients of thermal expansion (CTE) between packaging and PCB materials, initial PCB warping deformation and locally concentrated stress states significantly affected the fatigue life of the packaging structure. The intermetallics layer and mechanical strength of solder joints were examined to ensure the satisfactorily soldering quality prior to the thermal cycling process. The failure mechanism was investigated by the metallographic observations using a scanning electron microscope.

Findings

Typical fatigue behavior was revealed by grain coarsening due to cyclic stress, while at critical locations of packaging structures, the crack propagations were confirmed to be accompanied with coarsened grains by dye penetration tests. It is confirmed that the cyclic stress induced fatigue deformation is dominant in the deformation history of both PCB laminates. Due to the greater CTE differences in the RT5880 PCB laminate with those of the packaging materials, the thermally induced strains among different layered materials were more mismatched and led to the initiation and propagation of fatigue cracks in solder joints subjected to more severe stress states.

Originality/value

In addition to the electrical insulation and thermal dissipation, electronic packaging structures play a key role in mechanical connections between IC chips and PCB.

Details

Multidiscipline Modeling in Materials and Structures, vol. 18 no. 1
Type: Research Article
ISSN: 1573-6105

Keywords

Article
Publication date: 22 October 2019

Chuan Cao, Aitor Cazón-Martín, María Isabel Rodriguez-Ferradas, Paz Morer-Camo, Luis Matey-Muñoz, Unai Etxaniz-Sein, Hector Morcillo-Fuentes and Daniel Aguinaga-Azpiazu

The purpose of this study is to explore a methodology for connecting microelectromechanical system sensors – i.e. inertial measurement unit (IMU) – to an Arduino-based…

Abstract

Purpose

The purpose of this study is to explore a methodology for connecting microelectromechanical system sensors – i.e. inertial measurement unit (IMU) – to an Arduino-based microcontroller, using graphene-based conductive filament and flexible thermoplastic polyurethane (FTPU) filament and low-cost dual material extrusion technology.

Design/methodology/approach

A series of electrical tests were carried out to determine the maximum resistance the conductive paths may take to connect printed circuit boards (PCB). To select the most suitable printing material, three types of conductive filaments were examined. Then an experiment was carried out to find the best printing parameters in terms of printing speed, printing temperature and layer height to minimise resistivity. The size of the conductive path was also analysed. A final prototype was designed and printed according to optimised printing settings and maximum allowable resistances for each line and considering different geometries and printing strategies to reduce cross-contamination among paths.

Findings

For the Black Magic 3D conductive filament, the printing speed and layer height played a significant role regarding resistivity, while the printing temperature was not very important. The infill pattern of the conductive paths had to be aligned with the expected current path, while using air gaps between two adjacent paths resulted in the best approach to reducing cross-contamination. Moreover, the cross-section size of the conductive path did not affect the volume resistivity. When combined with FTPU filament constraints, the prototype yielded suitable electrical performance and printing quality when printed at a temperature of 220°C, speed of 20 mm/s and layer height of 0.2 mm.

Originality/value

This paper explores a systematic methodology for the additive manufacturing of commercial conductive material using low-cost extrusion technology to connect complex electronics when data transmission is a key feature.

Details

Rapid Prototyping Journal, vol. 26 no. 2
Type: Research Article
ISSN: 1355-2546

Keywords

Article
Publication date: 1 April 1988

Strong trends of growth are becoming apparent in the area of sensor technologies for vehicle applications, as Stephen McClelland reports.

Abstract

Strong trends of growth are becoming apparent in the area of sensor technologies for vehicle applications, as Stephen McClelland reports.

Details

Sensor Review, vol. 8 no. 4
Type: Research Article
ISSN: 0260-2288

Article
Publication date: 1 February 2016

Wojciech Grzesiak, Piotr Maćków, Tomasz Maj, Beata Synkiewicz, Krzysztof Witek, Ryszard Kisiel, Marcin Myśliwiec, Janusz Borecki, Tomasz Serzysko and Marek Żupnik

This paper aims to present certain issues in direct bonded copper (DBC) technology towards the manufacture of Al2O3 or AlN ceramic substrates with one or both sides clad with a…

Abstract

Purpose

This paper aims to present certain issues in direct bonded copper (DBC) technology towards the manufacture of Al2O3 or AlN ceramic substrates with one or both sides clad with a copper (Cu) layer.

Design/methodology/approach

As part of the experimental work, attempts were made to produce patterns printed onto DBC substrates based on four substantially different technologies: precise cutting with a diamond saw, photolithography, the use of a milling cutter (LPKF ProtoMat 93s) and laser ablation with differential chemical etching of the Cu layer.

Findings

The use of photolithography and etching technology in the case of boards clad with a 0.2-mm-thick Cu layer, can produce conductive paths with a width of 0.4 mm while maintaining a distance of 0.4 mm between the paths, and in the case of boards clad with a 0.3-mm-thick copper layer, conductive paths with a width of 0.5 mm while maintaining a distance of 0.5 mm between paths. The application of laser ablation at the final step of removing the unnecessary copper layer, can radically increase the resolution of printed pattern even to 0.1/0.1 mm. The quality of the printed pattern is also much better.

Research limitations/implications

Etching process optimization and the development of the fundamentals of technology and design of power electronic systems based on DBC substrates should be done in the future. A limiting factor for further research and its implementation may be the relatively high price of DBC substrates in comparison with typical PCB printed circuits.

Practical implications

Several examples of practical implementations using DBC technology are presented, such as full- and half-bridge connections, full-wave rectifier with an output voltage of 48 V and an output current of 50 A, and part of a battery discharger controller and light-emitting diode illuminator soldered to a copper heat sink.

Originality/value

The paper presents a comparison of different technologies used for the realization of precise patterns on DBC substrates. The combination of etching and laser ablation technologies radically improves the quality of DBC-printed patterns.

Details

Circuit World, vol. 42 no. 1
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 1 April 2019

Dariusz Klepacki, Wieslaw Sabat, Kazimierz Kamuda and Kazimierz Kurylo

This paper aims to present the problems connected with integrity of electrical signals in microelectronic hybrid systems made on metal substrates. The systems made on ferritic and…

Abstract

Purpose

This paper aims to present the problems connected with integrity of electrical signals in microelectronic hybrid systems made on metal substrates. The systems made on ferritic and austenitic sheet substrates were selected for the analysis.

Design/methodology/approach

For experimental investigations for the identification of the per-unit-length parameters for the simplest planar structures realized in thick-film technology on metal substrates, three types of path test systems with different geometric parameters were made. For the test circuits’ realization, the metal substrates of ferritic stainless steel of H17 grade (1.4016) with a thickness of 1 mm were selected. The sizes of 110 × 60 mm were obtained by laser cutting which process was required to obtain sufficient flatness of the substrates. Measurements were conducted using special elaborated equipment.

Findings

For selected configurations of conductive paths, the results of calculations and measurements of the range of variability of residual parameters for the systems of mutually parallel paths were presented. For selected path systems, the results of signals integrity analysis in mutually parallel path systems have been included.

Originality/value

The influence of configuration of paths, their geometrical and physical parameters on the value of residual elements parameters was determined, and their role in propagation process of fast-changing signals in the mutually parallel path systems was analyzed. These effects are very important from the point of view of electromagnetic compatibility and signal integrity of electronic circuits.

Details

Circuit World, vol. 45 no. 1
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 7 June 2019

Jakub Krzeminski, Bartosz Blicharz, Andrzej Skalski, Grzegorz Wroblewski, Małgorzata Jakubowska and Marcin Sloma

Despite almost limitless possibilities of rapid prototyping, the idea of 3D printed fully functional electronic device still has not been fulfilled – the missing point is a highly…

Abstract

Purpose

Despite almost limitless possibilities of rapid prototyping, the idea of 3D printed fully functional electronic device still has not been fulfilled – the missing point is a highly conductive material suitable for this technique. The purpose of this paper is to present the usage of the photonic curing process for sintering highly conductive paths printed on the polymer substrate.

Design/methodology/approach

This paper evaluates two photonic curing processes for the conductive network formulation during the additive manufacturing process. Along with the xenon flash sintering for aerosol jet-printed paths, this paper examines rapid infrared sintering for thick-film and direct write techniques.

Findings

This paper proves that the combination of fused deposition modeling, aerosol jet printing or paste deposition, along with photonic sintering, is suitable to obtain elements with low resistivity of 3,75·10−8 Ωm. Presented outcomes suggest the solution for fabrication of the structural electronics systems for daily-use applications.

Originality/value

The combination of fused deposition modelling (FDM) and aerosol jet printing or paste deposition used with photonic sintering process can fill the missing point for highly conductive materials for structural electronics.

Details

Circuit World, vol. 45 no. 1
Type: Research Article
ISSN: 0305-6120

Keywords

1 – 10 of over 1000