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The purpose of this paper is to analyze the individual steps during the printing of capacitor structures. The method of substrate preparation, the obtained roughness of conductive and dielectric layers are examined. Moreover, the capacitances of the obtained capacitors were examined.

Surface roughness and microscopic analysis were used to assess the quality of printed conductive structures. Two criteria were used to assess the quality of printed dielectric structures: the necessary lack of discontinuity of layers and minimal roughness. To determine the importance of printing parameters, a draft experimental method was proposed.

The optimal way to clean the substrate has been determined. The most important parameters for the dielectric layer (i.e. drop-space, table temperature, curing time and temperature) were found.

If dielectric layers are printed correctly, most problems with printing complex electronic structures (transistors, capacitors) will be eliminated.

The tests performed identified the most important factors for dielectric layers. Using them, capacitors of repeatable capacity were printed.

In the literature on this subject, no factors were found which were responsible for obtaining homogeneous dielectric layers.

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

This paper aims to perform thermal and mechanical characterization for silver-based sintered thermal joints. Layer quality affects thermal and mechanical performance, and it is important to achieve information about how materials and process parameters influence them.

Thermal investigation of the thermal joints analysis method was focused on determination of thermal resistance, where temperature measurements were performed using infrared camera. They were performed in two modes: steady-state analysis and dynamic analysis. Mechanical analysis based on measurements of mechanical shear force. Additional characterizations based on X-ray image analysis (image thresholding), optical microscope of polished cross-section and scanning electron microscope image analysis were proposed.

Sample surface modification affects thermal resistance. Silver metallization exhibits the lowest thermal resistance and the highest mechanical strength compared to the pure Si surface. The type of dynamic analysis affects the results of the thermal resistance.

Investigation of the layer quality influence on mechanical and thermal performance provided information about different joint types.

The purpose of this work was to characterize NiMn₂O₄ spinel-based thermistor powder, to use it in screen printing technology to fabricate temperature sensors, to study their performance for different sintering temperatures of thermistor layer, with and without insulative cover, as well as to investigate stability of the fabricated thermistors and their applicability in water quality monitoring.

After the characterization of starting NiMn₂O₄ spinel-based thermistor powder, it was converted to thick film paste which was screen printed on alumina substrate. Thermistor layers were sintered at four different sintering temperatures: 980°C, 1050°C, 1150°C and 1290°C. An interdigitated pattern of Ag-Pd conductive layer was used to reduce the resistance. Temperature-resistance characteristics were investigated in air and water, with and without insulative cover atop the thermistor layer. Stability of the fabricated thermistors after aging at 120°C for 300 h was also examined.

Thick film NiMn₂O₄ spinel thermistors, prepared by screen printing and sintering in the temperature range 980°C–1290°C, exhibited good negative temperature coefficient (NTC) characteristics in the temperature range −30°C to 145°C, including high temperature coefficient of resistance, good stability and applicability in water.

This study explores the range of sintering temperature that can be applied for NiMn₂O₄ thermistor thick films without compromising on the temperature sensing performance in air and water, as well as stability of the thermistors after aging at elevated temperatures.

The main purpose of this study is to test the performance of the ink-jet printed microwave resonant circuits on Low temperature co-fired ceramics (LTCC) substrates combined with microfluidic channels for sensor applications. Normally, conductive patterns are deposited on an LTCC substrate by means of the screen-printing technique, but in this paper applicability of ink-jet printing in connection with LTCC materials is demonstrated.

A simple microfluidic LTCC sensor based on the microstrip ring resonator was designed. It was assumed the micro-channel, located under the ring, was filled with a mixture of DI water and ethanol, and the operating frequency of the resonator was tuned to 2.4 GHz. The substrate was fabricated by standard LTCC process, and the pattern of the microstrip ring resonator was deposited over the substrate by means of an ink-jet printer. Performance of the sensor was assessed with the use of various volumetric concentrations of DI water and ethanol. Actual changes in concentration were detected by means of microwave measurements.

It can be concluded that ink-jet printing is a feasible technique for fast fabrication of micro-strip circuits on LTCC substrates, including microfluidic components. Further research needs to be conducted to improve the reliability, accuracy and performance of this technique.

The literature shows the use of ink-jet printing for producing various conductive patterns in different applications. However, the idea to replace the screen-printing with the ink-jet printing on LTCC substrates in connection with microwave-microfluidic applications is not widely studied. Some questions concerning accuracy and reliability of this technique are still open.

This paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated for non-metallized and metalized semiconductor surfaces. Heat transfer efficiency depends on thermal conductivity; radiation was used to perform thermographic analysis; the convection is energy loss, so its removing might improve measurements accuracy.

Investigation of thermal joints analysis method was focused on determination of convection impact on thermal resistance thermographic analysis method. Measuring samples placed in vacuum chamber with lowered pressure requires transparent window for infrared radiation that is used for thermographic analysis. Impact of infrared window and convection on temperature measurements and thermal resistance were referred.

The results showed that the silicon window allowed to perform thermal analysis through, and the convection was heat transfer mode which create 15% energy loss.

It is possible to measure thermal resistance for silver-based thermal joints with convection eliminated to improve measurements accuracy.

The purpose of this paper is to present the properties of thick-film resistors made of novel pastes prepared from glass and graphite.

Graphite-based resistors were made of thick-film pastes with different graphite-to-glass mass fraction were prepared and examined. Sheet resistance, temperature coefficient of resistance, impact of humidity and short-term overload were investigated. The properties of the layers fired in atmospheres of air at 550°C and nitrogen at 875°C were compared.

Graphite-based resistors with various graphite-to-glass ratios made possible to obtain a wide range of sheet resistance from single O/square to few kO/square. These values were dependent on firing atmosphere, paste composition and the number of screen-printed layers. The samples made of paste with 1:1 graphite-to-glass ratio exhibited the temperature coefficient of resistance of about −1,000 ppm/°C, almost independently on the firing atmosphere and presence of a top coating. The resistors fired in the air after coating with overglaze, exhibited significantly lower sheet resistance, reduced impact of humidity and improved power capabilities.

In this paper, graphite-based resistors for applications in typical high-temperature cermet thick-film circuits were presented, whereas typical graphite-based resistors were fabricated in polymer thick-film technology. Owing to very low cost of the graphite, the material is suitable for low-power passive circuits, where components are not subjected into high temperature, above the typical temperature of operation of standard electronic components.

This paper aims to present a requirements analysis for the processing of water-based electrode dispersions in inkjet printing.

A detailed examination of the components and the associated properties of the electrode dispersions has been carried out. The requirements of the printing process and the resulting performance characteristics of the electrode dispersions were analyzed in a top–down approach. The product and process side were compared, and the target specifications of the dispersion components were derived.

Target ranges have been identified for the main component properties, balancing the partly conflicting goals between the product and the process requirements.

The findings are expected to assist with the formulation of electrode dispersions as printing inks.

Little knowledge is available regarding the particular requirements arising from the systematic qualification of aqueous electrode dispersions for inkjet printing. This paper addresses these requirements, covering both product and process specifications.

To reduce the heat load of a gas turbine blade, its surface is covered with an outer layer of ceramics with high thermal resistance. The purpose of this paper is the selection of ceramics with such a low heat conduction coefficient and thickness, so that the permissible metal temperature is not exceeded on the metal-ceramics interface due to the loss ofmechanical properties.

Therefore, for given temperature changes over time on the metal-ceramics interface, temperature changes over time on the inner side of the blade and the assumed initial temperature, the temperature change over time on the outer surface of the ceramics should be determined. The problem presented in this way is a Cauchy type problem. When analyzing the problem, it is taken into account that thermophysical properties of metal and ceramics may depend on temperature. Due to the thin layer of ceramics in relation to the wall thickness, the problem is considered in the area in the flat layer. Thus, a one-dimensional non-stationary heat flow is considered.

The range of stability of the Cauchy problem as a function of time step, thickness of ceramics and thermophysical properties of metal and ceramics are examined. The numerical computations also involved the influence of disturbances in the temperature on metal-ceramics interface on the solution to the inverse problem.

The computational model can be used to analyze the heat flow in gas turbine blades with thermal barrier.

A number of inverse problems of the type considered in the paper are presented in the literature. Inverse problems, especially those Cauchy-type, are ill-conditioned numerically, which means that a small change in the inputs may result in significant errors of the solution. In such a case, regularization of the inverse problem is needed. However, the Cauchy problem presented in the paper does not require regularization.

This study aims to provide a comprehensive overview of the current state of the art in powder bed fusion (PBF) techniques for additive manufacturing of multiple materials. It reviews the emerging technologies in PBF multimaterial printing and summarizes the latest simulation approaches for modeling them. The topic of “multimaterial PBF techniques” is still very new, undeveloped, and of interest to academia and industry on many levels.

This is a review paper. The study approach was to carefully search for and investigate notable works and peer-reviewed publications concerning multimaterial three-dimensional printing using PBF techniques. The current methodologies, as well as their advantages and disadvantages, are cross-compared through a systematic review.

The results show that the development of multimaterial PBF techniques is still in its infancy as many fundamental “research” questions have yet to be addressed before production. Experimentation has many limitations and is costly; therefore, modeling and simulation can be very helpful and is, of course, possible; however, it is heavily dependent on the material data and computational power, so it needs further development in future studies.

This work investigates the multimaterial PBF techniques and discusses the novel printing methods with practical examples. Our literature survey revealed that the number of accounts on the predictive modeling of stresses and optimizing laser scan strategies in multimaterial PBF is low with a (very) limited range of applications. To facilitate future developments in this direction, the key information of the simulation efforts and the state-of-the-art computational models of multimaterial PBF are provided.