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The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

This paper aims to concentrate on recent innovations in flexible wearable sensor technology tailored for monitoring vital signals within the contexts of wearable sensors and systems developed specifically for monitoring health and fitness metrics.

In recent decades, wearable sensors for monitoring vital signals in sports and health have advanced greatly. Vital signals include electrocardiogram, electroencephalogram, electromyography, inertial data, body motions, cardiac rate and bodily fluids like blood and sweating, making them a good choice for sensing devices.

This report reviewed reputable journal articles on wearable sensors for vital signal monitoring, focusing on multimode and integrated multi-dimensional capabilities like structure, accuracy and nature of the devices, which may offer a more versatile and comprehensive solution.

The paper provides essential information on the present obstacles and challenges in this domain and provide a glimpse into the future directions of wearable sensors for the detection of these crucial signals. Importantly, it is evident that the integration of modern fabricating techniques, stretchable electronic devices, the Internet of Things and the application of artificial intelligence algorithms has significantly improved the capacity to efficiently monitor and leverage these signals for human health monitoring, including disease prediction.

This study aims to design and validate a theoretical model for capacitive imaging (CI) sensors that incorporates the interelectrode shielding and surrounding shielding electrodes. Through experimental verification, the effectiveness of the theoretical model in evaluating CI sensors equipped with shielding electrodes has been demonstrated.

The study begins by incorporating the interelectrode shielding and surrounding shielding electrodes of CI sensors into the theoretical model. A method for deriving the semianalytical model is proposed, using the renormalization group method and physical model. Based on random geometric parameters of CI sensors, capacitance values are calculated using both simulation models and theoretical models. Three different types of CI sensors with varying geometric parameters are designed and manufactured for experimental testing.

The study’s results indicate that the errors of the semianalytical model for the CI sensor are predominantly below 5%, with all errors falling below 10%. This suggests that the semianalytical model, derived using the renormalization group method, effectively evaluates CI sensors equipped with shielding electrodes. The experimental results demonstrate the efficacy of the theoretical model in accurately predicting the capacitance values of the CI sensors.

The theoretical model of CI sensors is described by incorporating the interelectrode shielding and surrounding shielding electrodes into the model. This comprehensive approach allows for a more accurate evaluation of the detecting capability of CI sensors, as well as optimization of their performance.

Perspiration and heat are produced by the body and must be eliminated to maintain a stable body temperature. Sweat, heat and air must pass through the fabric to be comfortable. The cloth absorbs sweat and then releases it, allowing the body to chill down. By capillary action, moisture is driven away from fabric pores or sucked out of yarns. Convectional air movement improves sweat drainage, which may aid in body temperature reduction. Clothing reduces the skin's ability to transport heat and moisture to the outside. Excessive moisture makes clothing stick to the skin, whereas excessive heat induces heat stress, making the user uncomfortable. Wet heat loss is significantly more difficult to understand than dry heat loss. The purpose of this study is to provided a good compilation of complete information on wet thermal comfort of textile and technological elements to be consider while constructing protective apparel.

This paper aims to critically review studies on the thermal comfort of textiles in wet conditions and assess the results to guide future research.

Several recent studies focused on wet textiles' impact on comfort. Moisture reduces the fabric's thermal insulation value while also altering its moisture characteristics. Moisture and heat conductivity were linked. Sweat and other factors impact fabric comfort. So, while evaluating a fabric's comfort, consider both external and inside moisture.

The systematic literature review in this research focuses on wet thermal comfort and technological elements to consider while constructing protective apparel.

Nearly 75% of EU buildings are not energy-efficient enough to meet the international climate goals, which triggers the need to develop sustainable construction techniques with high degree of resilience against climate change. In this context, a promising construction technique is represented by ventilated façades (VFs). This paper aims to propose three different VFs and the authors define a novel machine learning-based approach to evaluate and predict their energy performance under different boundary conditions, without the need for expensive on-site experimentations

The approach is based on the use of machine learning algorithms for the evaluation of different VF configurations and allows for the prediction of the temperatures in the cavities and of the heat fluxes. The authors trained different regression algorithms and obtained low prediction errors, in particular for temperatures. The authors used such models to simulate the thermo-physical behavior of the VFs and determined the most energy-efficient design variant.

The authors found that regression trees allow for an accurate simulation of the thermal behavior of VFs. The authors also studied feature weights to determine the most relevant thermo-physical parameters. Finally, the authors determined the best design variant and the optimal air velocity in the cavity.

This study is unique in four main aspects: the thermo-dynamic analysis is performed under different thermal masses, positions of the cavity and geometries; the VFs are mated with a controlled ventilation system, used to parameterize the thermodynamic behavior under stepwise variations of the air inflow; temperatures and heat fluxes are predicted through machine learning models; the best configuration is determined through simulations, with no onerous in situ experimentations needed.

Surface acoustic wave (SAW) sensors have attracted great attention worldwide for a variety of applications in measuring physical, chemical and biological parameters. However, stability has been one of the key issues which have limited their effective commercial applications. To fully understand this challenge of operation stability, this paper aims to systematically review mechanisms, stability issues and future challenges of SAW sensors for various applications.

This review paper starts with different types of SAWs, advantages and disadvantages of different types of SAW sensors and then the stability issues of SAW sensors. Subsequently, recent efforts made by researchers for improving working stability of SAW sensors are reviewed. Finally, it discusses the existing challenges and future prospects of SAW sensors in the rapidly growing Internet of Things-enabled application market.

A large number of scientific articles related to SAW technologies were found, and a number of opportunities for future researchers were identified. Over the past 20 years, SAW-related research has gained a growing interest of researchers. SAW sensors have attracted more and more researchers worldwide over the years, but the research topics of SAW sensor stability only own an extremely poor percentage in the total researc topics of SAWs or SAW sensors.

Although SAW sensors have been attracting researchers worldwide for decades, researchers mainly focused on the new materials and design strategies for SAW sensors to achieve good sensitivity and selectivity, and little work can be found on the stability issues of SAW sensors, which are so important for SAW sensor industries and one of the key factors to be mature products. Therefore, this paper systematically reviewed the SAW sensors from their fundamental mechanisms to stability issues and indicated their future challenges for various applications.

To develop electrode materials for supercapacitor with superior electrochemical performance and simple preparation process, the purpose of this study is to prepare flexible CC/NiS/a-NiS electrodes with self-supporting structure by loading hydrothermally synthesized a-NiS particles along with nano-NiS on carbon cloth by electroplating method.

The effects of current densities, temperatures and pH values on the loading amount and uniformity of the active substances during the plating process were investigated on the basis of optimization of surface morphology, crystalline structure and electrochemical evaluation as the cyclic voltammetry curves, constant current charge–discharge curves and AC impedance.

The a-NiS particles on CC/NiS/a-NiS were mostly covered by the plated nano-NiS, which behaved as a bulge and provided a larger specific surface area. The CC/NiS/a-NiS electrode prepared with the optimized parameter exhibited a specific capacitance of 115.13 F/g at a current density of 1 A/g and a Coulomb efficiency of 84% at 5 A/g, which is superior to that of CC/NiS electrode prepared by electroplating at a current density of 10 mA/cm², a temperature of 55°C and a pH of 4, demonstrating its fast charge response of the electrode and potential application in wearable electronics.

This study provides an integrated solution for the development of specifically structured NiS-based electrode for supercapacitor with simple process, low cost and high electrochemical charge/discharge performance, and the simple and easy-to-use method is also applicable to other electrochemically active composites.

The purpose of this paper is to develop a prototype of a wearable medical device in the form of a bandage with a real-time data monitoring platform, which can be used domestically for diabetic patients to identify the possibility of foot ulceration at the early stage.

The prototype can measure blood volumetric change and temperature variation in the forefoot area simultaneously. The waveform extracted using a pulsatile-blood-flow signal was used to assess blood perfusion-related information, and hence, predict ischemic ulcers. The temperature difference between ulcerated and the reference was used to predict neuropathic ulcers. The medical device can be used as a bandage during the application wherein the sensory module is placed inside the hollow pocket of the bandage. A platform was developed through a mobile application where doctors can extract real-time information, and hence, determine the possibility of ulceration.

The height of the peaks in the pulsatile-blood-flow signal measured from the subject with foot ischemic ulcers is significantly less than that of the subject without ischemic ulcers. In the presence of ischemic ulcers, the captured waveform flattens. Therefore, the blood perfusion from arteries to the tissue of the forefoot is considerably low for the subject with ischemic ulcers. According to the temperature difference data measured over 25 consecutive days, the temperature difference of the subject with neuropathic ulcers occasionally exceeded the 4 °F range but mostly had higher values closer to the 4 °F range. However, the temperature difference of the subject who had no complications of neuropathic ulcers did not exceed the 4 °F range, and the majority of the measurements occupy a narrow range from −2°F to 2 °F.

The proposed prototype of wearable medical apparatus can monitor both temperature variation and pulsatile-blood-flow signal on the forefoot simultaneously and thereby predict both ischemic and neuropathic diabetes using a single device. Most importantly, the wearable medical device can be used domestically without clinical assistance with a real-time data monitoring platform to predict the possibility of ulceration and the course of action thereof.

At the moment, in terms of both research and commercial products, smart shoe technology and applications seem not to attract the same magnitude of attention compared to smart garments and other smart wearables such as wrist watches and wrist bands. The purpose of this study is to fill this knowledge gap by discussing issues regarding smart shoe sensing technologies, smart shoe sensor placements, factors that affect sensor placements and finally the areas of smart shoe applications.

Through a review of relevant literature, this study first and foremost attempts to explain what constitutes a smart shoe and subsequently discusses the current trends in smart shoe applications. Discussed in this study are relevant sensing technologies, sensor placement and areas of smart shoe applications.

This study outlined 13 important areas of smart shoe applications. It also uncovered that majority of smart shoe functionality are physical activity tracking, health rehabilitation and ambulation assistance for the blind. Also highlighted in this review are some of the bottlenecks of smart shoe development.

To the best of the authors’ knowledge, this is the first comprehensive review paper focused on smart shoe applications, and therefore serves as an apt reference for researchers within the field of smart footwear.