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Plastic ball grid array packages were aged for up to 2000 hours. Various solder ball pad metallurgies were studied and solder ball shear tests were conducted at a range of ageing times. The solder ball shear strength was found to decrease after an initial hardening stage. The deterioration of solder ball shear strength was found to be mainly caused by the formation of intermetallic compound layers, together with microstructural coarsening and diffusion related porosity at the interface. For the ball pad metallurgy, two distinct intermetallic compound layer structures were observed to have formed after ageing. Once two continuous intermetallic compound layers formed fracture tended to occur at their interface. For the ball pad metallurgies which do not form two continuous intermetallic compound layers, the shear strength still decreased, due to the coarsening of the microstructure, intermetallic particle formation and diffusion related porosity at the surface of the Ni₃Sn₄.

Tin and solder coatings interact with substrates commonly used in the electronics industry to produce layers of intermetallic compounds at temperatures above and below the melting point of the coatings. Observations on the rates of compound growth at room temperature for durations of up to 12 years are reported and related to the published results for shorter times at higher temperatures. Recent results concerning the effect of intermatallic compound growth on the solderability of coatings and on the strength of soldered joints are presented. In both cases it is apparent that retarding the rate of compound growth could be useful and the use of barrier layers for this purpose is considered.

Presents the results of a study of the effects of solder ball pad metallurgy, intermetallic compound (IMC) thickness and thermal cycling on the shear strengths of PBGA package solder balls. The study of the microstructures of solder balls revealed that only a very thin layer of intermetallic compound existed between solder balls and Ni or Ni alloy barrier layers immediately after ball placement and reflow. The protective Au layer was dissolved completely and a needle like AuSn₄ intermetallic compound was then formed and dispersed evenly in the solder balls. The overall thickness of the IMC layers was thicker than 15μm after storage at 150°C for 1,000 hours. During the shear tests failure occurred at the interface of the two IMC layers. The fracture surfaces of solder balls with electrolytic Ni and thick Au layers were smooth and brittle fracture was observed. The ball shear strength decreased dramatically with the formation of IMC layers. For the solder balls with electroless Ni and thin Au layers, only a single IMC layer was formed at the interface and its thickness was only 2.5 μm after storage at 150°C for 1,000 hours.

A compound emitter heterojunction bipolar transistor (HBT) structure that incorporates an additional heterojunction within the emitter for minority carrier confinement has been proposed. In this new device configuration, the single wide band‐gap emitter layer in a conventional HBT is replaced by two sub‐layers of wide band‐gap material, with the sub‐layer nearer the base having a narrower band‐gap. By means of numerical simulations, the compound emitter HBT was found to perform better than comparable conventional HBTs. With the AlGaAs(n) / GaAs heterostructure system, the optimum compound emitter HBT structure was found to be Al0.3Ga0.7As(n) ‐ Al0. 2Ga0.8As(n) / GaAs with grading at the two hetero‐interfaces. It has a low turn‐on voltage that is almost identical to that of a homojunction GaAs bipolar transistor with similar doping conditions. Compared with a conventional single emitter layer Al0.3Ga0.7As/GaAs HBT, the optimum compound emitter HBT has an enhancement in the current gain by approximately 2 folds, an improvement in the uniform current gain region from 2 to 4 decades of collector current density, and a slight increase in the unity‐gain cut‐off frequency fT by about 7 %.

In a properly wetted joining system, with tin/lead solder as the filler and copper as the base metals, a layer of intermetallic compounds is usually found at the interface of these two metals. This layer, mainly copper and tin, has profound effects on the joint’s properties and reliability. Optical microscopy or scanning electron microscopy micrographs are traditionally used for analysing the type and thickness of these compounds. An alternative analytical approach is presented. By using scanning electron microscopy in conjunction with energy‐dispersive X‐ray analysis, the elemental constituents across the interface can be plotted. More detailed and precise information about the compound distribution can thus be deduced. The studies reported concentrate on infra‐red reflowed joints. Unlike conventional wave‐soldered joints, only Cu₆Sn₅ was found in these. The growth of intermetallic compounds at different aging temperatures, and with solder paste exposed to atmosphere for different times, was also studied.

Interactions between stainless steel and silver and gold based thick film conductors and YBa2Cu3O7 thick film superconductors were studied by SEM and EDX. The stainless steel reacted with the superconducting layer, forming a Ba‐Fe‐O compound on the interface, while BaO‐depleted YBa2Cu3O7 compound transformed into insulating Y2BaCuO5 compound. When YBa2Cu3O7 is fired on a gold thick film conductor, a thin layer of Y2BaCuO5 compound forms between the conductor and the superconducting film. In the case of a thin Ag conductor, BaO diffused through the silver film and reacted with alumina ceramic to the depth of a few μm. When a thicker silver layer (40–50 μm) was used, diffusion did not occur.

The results of qualitative and quantitative research into differentiation of compounds feeds are presented. The aim of the qualitative research is to define the compound feeds as product attributes in the context of marketing mix elements in order to understand product differentiation amongst products. The framework of the qualitative research is employed in the quantitative research where price and cost data for feed products are collected and related to the product attributes. Quantitative analysis is employed to identify some characteristics of products. Compound feeds can be defined as a set of product/service attributes. Both prices and costs can be related to these. The quantitative analysis reveals that whilst there is significant variation in the prices and costs of compounds in the same product category, the relative variation is greater for some product groups than others and that these categories form natural product groups.

The purpose of this study is to select a proper surface treatment to enhance wear resistance of engine camshafts. The camshaft is a relevant part of a diesel engine which works under torsion, fatigue and wear efforts. They are usually manufactured by casting, forging or machining from forged bar of low alloy steels, and in most cases, the machined surfaces are quenched and tempered by induction heating. After that, in many cases, to withstand the efforts imposed on the active surfaces and improve tribology and fatigue properties, the industry used for decades, thermochemical technologies such as salt bath or gaseous nitriding and nitrocarburizing processes.

This paper studied the effects of plasma nitriding and plasma nitrocarburizing, on the tribological behaviour of the steel SAE 1045HM3 proposed to produce camshafts. After the plasma treatments, the change in surface roughness was measured; the modified layers were studied by X-ray techniques and its thickness by optical microscopy. The diffusion zone was evaluated by Vickers microhardness determinations. Tribology tests were performed by pin-on-disc configuration using WC ball as a counterpart.

Results show that plasma nitrided samples present the best tribological behaviour compared with the nitrocarburized ones; also, the influence of the roughness produced by the thermochemical processes appears to be important.

Although both the plasma treatments have been applied for many years, and also reported separately in the scientific literature, there was no information comparing these two treatments for carbon steels, and also, there is not much about tribology in lubricated conditions of nitrided and nitrocarburized carbon steels. In fact, it is not proved that the porosity of the nitrocarburized layer is beneficial for wear resistance in lubricated conditions. In this paper, it was proved that at least in the tested conditions, it is not.

Gas or plasma nitrocarburizing is usually recommended for this kind of applications, although the modified layer is porous. This paper attempts to prove that nitriding could be better than nitrocarburizing, even with a thinner white layer.

The purpose of this study is comparison of the diffusion processes performed using the commercial available dopant paste made by Filmtronics and the original prepared liquid dopant solution. To decrease prices of industrially produced silicon-based solar cells, the new low-cost production processes are necessary. The main components of most popular silicon solar cells are with diffused emitter layer, passivation, anti-reflective layers and metal electrodes. This type of cells is prepared usually using phosphorus oxychloride diffusion source and metal pastes for screen printing. The diffusion process in diffusion furnace with quartz tube is slow, complicated and requires expensive equipment. The alternative for this technology is very fast in-line processing using the belt furnaces as an equipment. This approach requires different dopant sources.

In this work, the diffusion processes were made for two different types of dopant sources. The first one was the commercial available dopant paste from Filmtronics and the second one was the original prepared liquid dopant solution. The investigation was focused on dopant sources fabrication and diffusion processes. The doping solution was made in two stages. In the first stage, a base solution (without dopants) was made: dropwise deionized (DI) water and ethyl alcohol were added to a solution consisting of tetraethoxysilane (TEOS) and 99.8 per cent ethyl alcohol. Next, to the base solution, orthophosphoric acid dissolved in ethyl alcohol was added.

Diffused emitter layers with sheet resistance around 60 Ω/sq were produced on solar grade monocrystalline silicon wafers using two types of dopant sources.

In this work, the diffusion processes were made for two different types of dopant sources. The first one was the commercial available dopant paste from Filmtronics and the second one was the original prepared liquid dopant solution.

The introduction of high density surface mount technology may lead to a number of metallurgical problems. This paper considers two aspects which are currently being actively discussed. Firstly, incompatibility in expansion properties of the materials used and severe thermal cycling may induce creep and fatigue stresses on soldered joints, and the merits of different alloys are considered. Secondly, the necessary thermal treatments such as burn‐in and elevated service temperature can lead to intermetallic compound layer growth between the solder and the metallised layer on components which may be considered a potential source of joint strength reduction. Mention is also made of the different visual appearance of joints to chip components compared with conventional soldered joints.