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This paper aims to investigate the film cooling effectiveness (FCE) and mixing flow characteristics of the flat surface ramp model integrated with a compound angled film cooling jet.

Three-dimensional numerical simulation is performed on a flat surface ramp model with Reynolds Averaged Navier-Stokes approach using a finite volume solver. The tested model has a fixed ramp angle of 24° and a ramp width of two times the diameter of the film cooling hole. The coolant air is injected at 30° along the freestream direction. Three different film hole compound angles oriented to freestream direction at 0°, 90° and 180° were investigated for their performance on-ramp film cooling. The tested blowing ratios (BRs) are in the range of 0.9–2.0.

The film hole oriented at a compound angle of 180° has improved the area-averaged FCE on the ramp test surface by 86.74% at a mid-BR of 1.4% and 318.75% at higher BRs of 2.0. The 180° film hole compound angle has also produced higher local and spanwise averaged FCE on the ramp test surface.

According to the authors’ knowledge, this study is the first of its kind to investigate the ramp film cooling with a compound angle film cooling hole. The improved ramp model with a 180° film hole compound angle can be effectively applied for the end-wall surfaces of gas turbine film cooling.

Maintaining the turbine blade’s temperature within the safety limit is challenging in high-pressure turbines. This paper aims to numerically present the conjugate heat transfer analysis of a novel approach to mini-channel embedded film-cooled flat plate.

Numerical simulations were performed at a steady state using SST k – ω turbulence model. Impingement and film cooling are classical approaches generally adopted for turbine blade analysis. The existing film cooling techniques were compared with the proposed design, where a mini-channel was constructed inside the solid plate. The impact of the blowing ratio (M), Biot number (Bi) and temperature ratio (TR) on overall cooling performance was also studied.

Overall cooling effectiveness was always shown to be higher for mini-channel embedded film-cooled plates. The effectiveness increases with increasing the blowing ratio from M = 0.3 to 0.7, then decreases with increasing blowing ratio (M = 1 and 1.4) due to lift-off conditions. The mini-channel embedded plate resulted in an approximately 21% increase in area-weighted average overall effectiveness at a blowing ratio of 0.7 and Bi = 1.605. The lower uniform temperature was also found for all blowing ratios at a low Biot number, where conduction heat transfer significantly impacts total cooling effectiveness.

To the best of the authors’ knowledge, this study presents a novel approach to improve the cooling performances of a film-cooled flat plate with better cooling uniformity by using embedded mini-channels. Despite the widespread application of microchannels and mini-channels in thermal and fluid flow analysis, the application of mini-channels for blade cooling is not explored in detail.

In this study, numerical simulations are performed to compare the adiabatic film cooling effectiveness and reveal the difference of film cooling mechanisms of two models with the same geometries and cross-section areas of film holes’ exits at three typical blowing ratios (M = 0.5, 1 and 1.5). The two models are an elliptical model and a cylindrical model with 90° compound angle, respectively.

Three different cases are considered in this work and the baseline is the model with a cylindrical film hole. The same boundary conditions and a validated turbulence model (realizable k-ε) are adopted for all cases.

The results show that both the elliptical and cylindrical models with 90° compound angle can enhance the film cooling effectiveness compared with the baseline. However, the elliptical model performs well at lower blowing ratios and in the near region at each blowing ratio because of the wider width of the film hole’s exit. The cylindrical model with 90° compound angle provides better film cooling effectiveness in the further downstream area of the film hole at higher blowing ratio because of the less lift-off and better coolant coverage in the larger x/D region along the mainstream direction.

Overall, it can be concluded that although the elliptical and cylindrical models with 90° compound angle have identical hole exits, the different inlet direction and cross-sectional geometry affect the flow structures when the coolant enters, moves through and exits the hole and finally different film cooling results appear.

The theory is presented of the increase in damping that can be obtained when a damping compound is added to a simple structure vibrating in a bending mode. Consideration has been given to the use of ‘Aquaplas’ damping compound on a vibrating stringer‐skin combination, and it has been shown that the maximum damping ratio is obtained when the material is applied to the stringer flange over the centre 40 per cent of the pin‐ended length of the beam. A preliminary experimental investigation is described, in which damping measurements were made on a simple structural specimen treated with Aquaplas. A new method was used successfully to determine the damping ratio of a heavily damped system. The damping properties of Aquaplas were evaluated, and some of the theoretical conclusions were verified. Some of the results obtained indicate that a more accurate mathematical representation must be sought for the visco‐elastic behaviour of Aquaplas than is provided by the ‘complex stiffness’ method.

The purpose of this paper is to verify how solder joint properties correlate with soldering profile set-up. These characteristics act against each other. All observed properties may significantly affect the quality and reliability of solder joints. The purpose is also to design recommendations for manufacturers of electronic assemblies.

The samples for experiment were reflowed by using a laboratory reflow oven. A LEXT laser confocal microscope was used for wetting angle and intermetallic compound (IMC) thickness measurement. The ionic contamination was measured by using a contaminometer.

The appropriate choice of soldering profile is very important for the reliability of electronic assemblies. The higher temperatures or longer preheating and soldering times improve the wetting angle. Likewise, there is also the activation of all the fluxes. The result is low contamination with printed circuit boards (PCBs). On the other hand, we must not forget that higher temperatures and longer soldering time also affect the thickness of the IMC. The outer limits recommended by the manufacturer were selected for the soldering profile set-up. Even within these limits, it is possible to achieve an improvement in the wetting angle, an improvement in levels of PCB contamination and an increase in the thickness of the IMC. This paper presents the results achieved for solders Sn42Bi57.6Ag0.4, Sn96.5Ag3Cu0.5 and Sn97Ag3.

The gained knowledge on the correlation between IMC thickness, solderability of PCB and PCB contamination caused by different soldering profile set-ups can help to prevent reliability problems because each of the named effects has a significant influence on reliability.

This paper aims to present the classification, representation and extraction of adhesively bonded assembly features (ABAFs) from the computer-aided design (CAD) model.

The ABAFs are represented as a set of faces with a characteristic arrangement among the faces among parts in proximity suitable for adhesive bonding. The characteristics combination of the faying surfaces and their topological relationships help in classification of ABAFs. The ABAFs are classified into elementary and compound types based on the number of assembly features exist at the joint location.

A set of algorithms is developed to extract and identify the ABAFs from CAD model. Typical automotive and aerospace CAD assembly models have been used to illustrate and validate the proposed approach.

New classification and extraction methods for ABAFs are proposed, which are useful for variant design.

IN this paper an attempt is made to describe rapid, precise, efficient methods for solving aeroplane geometry problems by analytic geometry.

The second in a series giving suggestions for laboratory work on the various types of machine tool

The purpose of this paper is to study the aerodynamic characteristics of Ahmed body in longitudinal and lateral platoons under crosswind by computational fluid dynamics simulation. It helps to improve the aerodynamic characteristics of vehicles by providing theoretical basis and engineering direction for the development and progress of intelligent transportation.

A two-car platoon model is used to compare with the experiment to prove the accuracy of the simulation method. The simplified Ahmed body model and the Reynolds Averaged N-S equation method are used to study the aerodynamic characteristics of vehicles at different distances under cross-winds.

When the longitudinal distance x/L = 0.25, the drag coefficients of the middle and trailing cars at β = 30° are improved by about 272% and 160% compared with β = 10°. The side force coefficients of the middle and trailing cars are increased by 50% and 62%. When the lateral distance y/W = 0.25, the side force coefficients of left and middle cars at β = 30° are reduced by 38% and 37.5% compared with β = 10°. However, the side force coefficient of the right car are increased by about 84.3%.

Most of the researches focus on the overtaking process, and there are few researches on the neat lateral platoon. The innovation of this paper is that in addition to studying the aerodynamic characteristics of longitudinal driving, the aerodynamic characteristics of neat lateral driving are also studied, and crosswind conditions are added. The authors hope to contribute to the development of intelligent transportation.

A CRITICAL stage in the process of making aircraft occurs with alarming frequency in the history of aviation.