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The purpose of this paper is to show how to precisely control the liquid resin coating thickness in stereolithography (SL).

A vacuum adsorption coating equipment and technology are developed to precisely control the liquid resin coating thickness in SL. Dual‐electrode device is used, so adsorption can be precisely controlled and the electrode polarization can be avoided.

It turns out that the apparatus can control coating thickness effectively, and thickness uniformity is increased remarkably, which induces the standard deviation thickness decrease from 0.00547 to 0.00243 mm, and efficiency of rapid prototyping production increase by 53 percent.

The paper demonstrates that the apparatus can control coating thickness effectively.

The use of U‐V technology in conformal coating applications has come of age. This paper discusses the material, process, and equipment which recently have been utilised for the conformal coating of printed wiring boards. First is presented a description of the coating material properties, both uncured and in the cured state. Next follows a discussion of the processing scheme, parameters such as time, speed, and U‐V light source requirement. Hardware to enable the coating operation to fit into an automated assembly line is also described. Of special interest will be the employment of masking techniques to prevent coating of certain critical areas. Lastly, typical performance data on the actual product having the U‐V coating are presented. An overall appraisal of the entire U‐V system is included.

A large number of coatings have been described which serve very specific purposes. An example is a foam coating which may be applied by spraying, dipping, or other normal procedures. On curing, however, there is sufficient gas generation to foam the coating. A fine cellular structure results. The resulting layer is thick but light and has a very high strength‐to‐volume ratio as well as insulating properties [Downey Finishing Corp., 1629 S. 55th Ave., Cicero, IL 60650].

The purpose of this paper is to present a serial produced industrial robot for thin‐type space solar cells (SSC), which is applied to perform the bonding process of SSC.

An optimized process of adhesive coating and bonding for SSC is designed, based on an analysis of hydromechanics model. In order to perform the process, a novel robot is developed, which mainly consists of a three‐axis Cartesian coordinates' motion platform, coating‐and‐bonding device, solar cell and glass cover orientation plate, control system, pneumatic system, constant temperature module, and industrial personal computer software. The coating and bonding operation is based on the three‐axis Cartesian coordinates' motion and the help of pneumatic system.

Compared with the experimental prototype and handwork, the robot is more effective and reliable for the bonding process of the thin‐type solar cells.

The robot is very useful to realize automatic production of SSC.

The drive towards low unit cost in optoelectronic packaging is assisted by avoiding the need for hermeticity and by the use of simple assembly techniques. Silicone gels can solve this problem, provided the reliability meets the application requirements. Extensive lifetest data for semiconductor lasers and PIN photodiodes coated in silicone gels are reported in this paper. Results to date show great promise and promote confidence in the use of these materials for the environmental protection of optoelectronic devices. Apart from silicone gels, light cured resin materials can also offer benefits towards lower cost assembly processes. Tests are reported of the degradation in optical transmission of these resins and also bulk degradation under differing environmental conditions. The use of these polymer materials can play an integral part in low‐cost optoelectronic packaging developments, two specific designs of which — a silicon laser optical bench and a ceramic ferrule co‐axial structure — will be described. Both of these packages take advantage of a passive fibre/device alignment allowed by the use of an expanded beam laser design.

This paper aims to investigate the circulation of moist silica sand to provide appropriate feeding modes and references for designing the coating device when printing sand mold with line-forming.

First, this paper briefly introduces sand mold printing with line-forming and the circulation problem brought by moist silica sand. The outlet may be choked due to poor flowability and solidification characteristic, resulting in poor dimensional tolerance and even production failure. Then, based on circulation modeling, a series of feeding modes is proposed to guarantee adequate feeding, avoid solidification and ensure successful fabrication. Finally, the GUI of control software is developed, including slicing, path planning and the function of virtual printing.

Several feeding modes of moist silica sand are put forward to avoid the choke.

The authors will further investigate the flowability of furan no-bake sand based on experiments.

This paper is going to provide references for the novel design of nozzle, prototype and sand mold printing, influencing significantly on mold manufacturing and the casting industry. This research applies equally to equipment having the circulation of high moist particles with solidification features.

This paper reviews the range of sensors used in electronic nose (e‐nose) systems to date. It outlines the operating principles and fabrication methods of each sensor type as well as the applications in which the different sensors have been utilised. It also outlines the advantages and disadvantages of each sensor for application in a cost‐effective low‐power handheld e‐nose system.

A frequency tunable half‐wave resonator at 3 GHz is presented with a microelectromechanical systems (MEMS) variable capacitor as the tuning element. The capacitor is fabricated using the multi‐user MEMS process (MUMPs) technology provided by JDS/Cronos, and transferred to an alumina substrate by an in‐house developed flip‐chip process. This capacitor is electrostatically actuated. The resulting C‐V response is linear with a slope of 0.05 pF/V for a wide range of actuation voltages. The MEMS device has a capacitance ratio of 3:1 for 0‐70 V bias, with a Q‐factor of 140 measured at 1 GHz. A half‐wave tunable microstrip resonator with bias lines is designed to include this MEMS device, which exhibits linear tuning over 180 MHz (6 percent) centered around 3 GHz with a constant 3 dB bandwidth of 160 MHz over the entire tuning range. The power consumption of the MEMS device was measured to be negligible.

This paper aims to encompass the technological advancements in the area of flexible sensing electronics fabrication particularly for wearable device development applications. In the recent past, it is evident that there is a tremendous growth in the field of flexible electronics and sensors fabrication technologies all around the world. Even though, there is a significant amount of research has been carried in the past decade, but still there is a huge need for exploring novel materials for low temperature processing, optimized printing methods and customized printing devices with accurate feature control.

The author has done an extensive literature survey in the proposed area and found that the researchers are showing significant interest in exploring novel materials, new conductive ink processing methods suitable for additive manufacturing, and fabrication technologies for developing the plastic substrate-based flexible electronics for the on growing demands of wearable devices in the market.

The author has consolidated some of the recent advancements in the area of flexible sensing electronics using the inkjet-printing platform carried out by the researchers. The novel customized inkjet-printing technology, materials selections for device development, compatibility of the materials for the inkjet-printing process and the interesting results of the devices fabricated are highlighted in this paper.

The author has reported the novel inkjet-printing platforms explored by researchers in the recent past for various applications which primarily includes gas sensing. The author has consolidated in a crisp manner about the technology, materials compatible for inkjet-printing, and the exciting results of the printed devices. The author has reported the advantages and challenges of the proposed methods by the researchers. This work will bridge the technical gap in the inkjet-printing technology and will be useful for the researchers to take forward the research work on this domain to the next level.