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The purpose of this paper is to demonstrate successful use of least-squares finite element method (LSFEM) with h-type mesh refinement and coarsening for the solution of two-dimensional, inviscid, compressible flows.

Unsteady Euler equations are discretized on meshes of linear and quadratic triangular and quadrilateral elements using LSFEM. Backward Euler scheme is used for time discretization. For the refinement of linear triangular elements, a modified version of the simple bisection algorithm is used. Mesh coarsening is performed with the edge collapsing technique. Pressure gradient-based error estimation is used for refinement and coarsening decision. The developed solver is tested with flow over a circular bump, flow over a ramp and flow through a scramjet inlet problems.

Pressure difference based error estimator, modified simple bisection method for mesh refinement and edge collapsing method for mesh coarsening are shown to work properly with the LSFEM formulation. With the proper use of mesh adaptation, time and effort necessary to prepare a good initial mesh reduces and mesh independency control of the final solution is automatically taken care of.

LSFEM is used for the first time for the solution of inviscid compressible flows with h-type mesh refinement and coarsening on triangular elements. It is shown that, when coupled with mesh adaptation, inherent viscous dissipation of LSFEM technique is no longer an issue for accurate shock capturing without unphysical oscillations.

This paper discusses the microstructures of solder joints and the mechanism of thermal fatigue, which is an important source of failure in electronic devices. The solder joints studied were near‐eutectic Pb‐Sn solder contacts on copper. The microstructure of the joints is described. While the fatigue life of near‐eutectic solder joints is strongly dependent on the operating conditions and on the microstructure of the joint, the metallurgical mechanisms of failure are surprisingly constant. When the cyclic load is in shear at temperatures above room temperature the shear strain is inhomogeneous, and induces a rapid coarsening of the eutectic microstructure that concentrates the deformation in well‐defined bands parallel to the joint interface. Fatigue cracks propagate along the Sn‐Sn grain boundaries and join across the Pb‐rich regions to cause ultimate failure. The failure occurs through the bulk solder unless the joint is so thin that the intermetallic layer at the interface is a significant fraction of the joint thickness, in which case failure may be accelerated by cracking through the intermetallic layer. The coarsening and subsequent failure are influenced more strongly by the number of thermal cycles than by the time of exposure to high temperature, at least for hold times up to one hour. Thermal fatigue in tension does not cause well‐defined coarsened bands, but often leads to rapid failure through cracking of the brittle intermetallic layer. Implications are drawn for the design of accelerated fatigue tests and the development of new solders with exceptional fatigue resistance.

Observation by optical microscopy and EBSP have made it clear that the trigger for the grain coarsening phenomenon of austenite stainless steel BS304S31 may be the stacking faults concentrating selectively in a thin layer lying just beneath the grain boundary. When macroscopic plastic strain reached 6 percent, selective concentration of stacking faults was observed. When it reached 20 percent, the distribution of stacking faults became uniform in each grain. After these specimens were heated, concentration of stacking faults disappeared, and grain coarsening occurred at the point with 6 percent strain, but no grain coarsening occurred at the point with 20 percent strain. In order to investigate this concentration of stacking faults, an attempt was made to analyze the deformation in each crystal by using image‐based FEM. The result suggested that there is a possibility that plastic strain concentrates in the vicinity of the grain boundary when the macroscopic plastic strain is small.

The study aims to examine the impact of migration on household consumption expenditures in Bangladesh.

The paper uses coarsened exact matching methods to examine the causal impact between migration and household welfare using the dataset on Bangladesh Household Income and Expenditure Survey 2010 on 12,213 households.

The study reveals that migration has a positive impact on household welfare improvement through increases in their consumption expenditures. Households with migration status are found to spend more on food, non-food (housing, durable goods, fuel, cosmetics, cleaning, transport, clothing, taxes, insurance, recreation) items and medical. However, the authors do not find any evidence of impacts on education expenditures.

The availability of panel data and the use of other variables (e.g. household investment expenditures, household budget allocation for agricultural input expenses, etc.) would have been able to provide vivid results.

This paper adds to the Bangladeshi migration literature by offering a novel empirical assessment of the Bangladeshi migrants and its impact on household welfare by drawing upon a recently published, nationally representative sample of Bangladeshi households.

The purpose of this paper is to investigate growth kinetics of interfacial Cu-Sn intermetallic compound (IMC) at the solid Cu/liquid Sn interface.

The Sn/Cu solid–liquid interfacial IMCs are fabricated under various soldering temperatures (240°C-270°C) and soldering times (5-240 s) by dipping method. The thickness and morphology of IMC are observed and analyzed by the optical microscope and scanning electron microscope.

Holding at 260°C, Cu/Sn solid–liquid interface Cu₆Sn₅ growth index experience a change from 0.08 to 0.30 within 10-190 s. The growth index is 0.08 in 10-40 s; the growth index is 0.30 in 40-190 s. Cu₆Sn₅ grain coarsening index is constant within 10-190 s. It is 0.13. The result of the index of Cu₆Sn₅ grain coarsening is different from predecessors 27 results Cu₆Sn₅ grain coarsening index for 1/3. This is because Cu₆Sn₅ grain grows at the expense of its near small grain to reduce the surface Gibbs free energy, and its morphology changes from regular shape to irregular shape. It sets up the mathematical expression about the initial formation time and temperature of Cu₃Sn in 240°C-270°C.

It obtains a mathematical model to express the changes of solid–liquid interface frontier concentration which has an effect on the interfacial Cu₆Sn₅ layer growth index and the Cu₆Sn₅ grain coarsening index. Different indexes can be obtained by establishing relevance equations, which can be used to predict the growth of the interface IMC layer. This mathematical model is established to design the solder pads and the sizes of the solder joints.

This paper aims to investigate the transformations during aging at 200°C for different periods on microstructure and mechanical properties of high-temperature Zn-4Al-3Mg solders.

The solder was melted in a resistance furnace, and different cooling rates were obtained by changing the cooling medium. Subsequently, all the specimens were aged at 200°C for 20 h and 50 h. A scanning electron microscope equipped with an energy dispersive X-ray detector and X-ray diffraction were used for the observation of microstructures and the determination of phase composition. Tensile tests and Rockwell hardness tests were also performed.

After aging, Zn atoms precipitated from the supersaturated α-Al and the (α-Al + η-Zn)_eutectoid phase with the original fine lamellar structure coarsened and spheroidized to minimize the system energy. Among these solders, the furnace-cooled alloys exhibited the highest thermal stability, largely retaining their original morphology after aging, whereas the collapse and spheroidization of the η-Zn phase and the coarsening of the η-Zn dendrites took place in the air-cooled and water-cooled samples, respectively. Furthermore, a decrease in tensile strength during aging was attributed to the thermal softening effect. The variation of macro-hardness was mainly associated with the microstructural alterations in terms of quantity, morphology and distribution of soft η-Zn phase and hard intermetallic compounds induced by the aging treatment.

The structural stability of eutectic Zn-4Al-3Mg solders solidified at different cooling rates and the effect of aging on mechanical properties were investigated.

Studies have been made of ageing effects, both at room temperature and at 125°C, on the microstructure of 60:40 tin‐lead solders. A comparison was made of the effect of ageing on slow and rapidly cooled matrices. Precipitation of tin within lead dendrites was observed to occur very rapidly after solidification of the alloy. Subsequently the precipitates coarsened markedly over a period of a few weeks. The matrix of the alloy also coarsened at room temperature over this period. At elevated temperatures a similar sequence of events occurred, but substantially faster. The microstructural origins of the known loss in mechanical strength of solders with ageing are discussed.

An empirical study was conducted to determine the thermal fatigue behaviour of 1.27 mm pitch, J‐bend and gullwing surface mount solder joints, manufactured with four low‐temperature solders. Selected solder alloys were: 58Bi‐42Sn (wt %), 43Sn‐43Pb‐14Bi, 52ln‐48Sn and 40ln‐40Sn‐20Pb. Accelerated thermal cycling was used in conjunction with metallographic analysis and mechanical (pull) strength measurement to test their behaviour. The relative merit of each solder composition was determined by comparing it with 63Sn‐37Pb solder, subjected to identical testing conditions. The strength decreased linearly with increased number of thermal cycles for gullwing solder joints of all four solder alloys. The fatigue lifetime was relatively longer for 58Bi‐42Sn and 40ln‐40Sn‐20Pb than for other alloys, but significantly lower than that obtained with 63Sn‐37Pb solder. No discernible degradation of strength was observed with the J‐bend solder joints of any solder alloy, even after the completion of 6000 thermal cycles. Thermal fatigue resistance of the latter joints was attributed to a more favourable coefficient of thermal expansion (CTE) mismatch. Solder joint cracking occurred only in gullwing components soldered with 52ln‐48Sn, 40ln‐40Sn‐20Pb and 43Sn‐43Pb‐14Bi alloys, after 1000 or 2000 thermal cycles. The crack initiated on the outside surface of the solder fillet, and appeared to propagate through both phases of the microstructure. The stress‐induced heterogeneous coarsening of the microstructure was evident only with 43Sn‐43Pb‐14Bi solder, although not as prevalent as that usually observed with eutectic Sn‐Pb solder. Fatigue cracks were absent from solder joints of 58Bi‐42Sn and 63Sn‐37Pb alloys.

The purpose of this paper is to investigate the microstructural development of SnAgCu solder joints under different loading conditions (isothermal storage, thermal cycling and vibration).

The observed microstructural changes have been studied with respect to grain growth and grain refinement, crack formation and crack growth. The growth kinetics of the intermetallic phases encountered as particles in the bulk as well as a reaction layer on the copper pad, were studied in the temperature range of 125‐175°C.

Dynamic recrystallisation of the tin matrix leads to a change in the diffusion controlled growth mechanism, which causes an increase of the particle growth rate compared to isothermal storage. Thus, these grain boundaries are separated forcibly by crack growth during thermal cycling. This stress causes intergranular cracks while vibration stress induces transgranular cracks.

The paper adds insight into microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue.

The most commonly used solder for electrical interconnects in electronic packages is the near eutectic 60Sn‐40Pb alloy. This alloy has a number of processing advantages(suitable melting point of 183°C and good wetting behaviour). However, under conditions of cyclic strain and temperature (thermomechanical fatigue) the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime complex. A finite element simulation methodology to predict solder joint mechanical behaviour, that includes microstructural evolution, has been developed. The mechanical constitutive behaviour was incorporated into the time‐dependent internal state variable viscoplastic model through experimental creep tests. The microstructural evolution is incorporated through a series of mathematical relations that describe mass flow in a temperature/strain environment. The model has been found to simulate observed thermomechanical fatigue behaviour in solder joints.