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The electronics packaging industry is debating whether CSP, Chip Scale Packaging, or flip chip is going to become the major alternative for future products. The user wants more functionality and portability at an ever increasing speed and the need for denser packaging is becoming urgent. The issue of acquiring adequate circuit boards is pressing. However, the comparison between CSP and flip chip is not straightforward, since many CSPs are really flip chips in small packages. CSPs therefore, do not compare with flip chip on board but with packaged die.

The purpose of this paper is to study the drop reliability of ball-grid array (BGA) solder joints affected by thermal cycling.

The drop test was made with the two kinds of chip samples with the thermal cycling or not. Then, the dyeing process was taken by these samples. Finally, through observing the metallographic analysis results, the conclusions could be found.

It is observed that the solder joint cracks which were only subjected to drop loads without thermal cycling appeared near the BGA package pads. The solder joint cracks which were subjected to drop loads with thermal cycling appear near the printed circuit board pads.

This paper obtains the solder joint cracks picture with drop test under the thermal cycling.

The explosive growth of high‐density packaging has created a tremendous impact on the electronics assembly and manufacturing industry. Ball Grid Array (BGA), Chip Scale Packaging (CSP), Direct Chip Attach (DCA), and flip‐chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. In this paper, they will be briefly discussed.

A review of state‐of‐the‐art technology pertinent to tape automated bonding (for fine pitch, high I/O, high performance, high yield, high volume and high reliability) is presented. Emphasis is placed on a new understanding of the key elements (for example, tapes, bumps, inner lead bonding, testing and burn‐in on tape‐with‐chip, encapsulation, outer lead bonding, thermal management, reliability and rework) of this rapidly moving technology.