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The purpose of this study is to design a wearable medical device as a human care platform and to introduce the design details, key technologies and practical implementation methods of the system.

A multi-channel data acquisition scheme based on PCI-E (rapid interconnection of peripheral components) was proposed. The flexible biosensor is integrated with the flexible data acquisition card with monitoring capability, and the embedded (device that can operate independently) chip STM32F103VET6 is used to realize the simultaneous processing of multi-channel human health parameters. The human health parameters were transferred to the upper computer LabVIEW by intelligent clothing through USB or wireless Bluetooth to complete the transmission and processing of clinical data, which facilitates the analysis of medical data.

The smart clothing provides a mobile medical cloud platform for wearable medical through cloud computing, which can continuously monitor the body's wrist movement, body temperature and perspiration for 24 h. The result shows that each channel is completely accurate to the top computer display, which can meet the expected requirements, and the wearable instant care system can be applied to healthcare.

The smart clothing in this study is based on the monitoring and diagnosis of textiles, and the electronic communication devices can cooperate and interact to form a wearable textile system that provides medical monitoring and prevention services to individuals in the fastest and most accurate way. Each channel of the system is precisely matched to the display screen of the host computer and meets the expected requirements. As a real-time human health protection platform technology, continuous monitoring of human vital signs can complete the application of human motion detection, medical health monitoring and human–computer interaction. Ultimately, such an intelligent garment will become an integral part of our everyday clothing.

This study investigates the impact of three parameters such as: number of LED chips, pitch and LED power on the junction temperature of LEDs using a best heat sink configuration selected according to a lower temperature. This study provides valuable insights into how to design LED arrays with lower junction temperatures.

To determine the best configuration of a heat sink, a numerical study was conducted in Comsol Multiphysics on 10 different configurations. The configuration with the lowest junction temperature was selected for further analysis. The number of LED chips, pitch and LED power were then varied to determine the optimal configuration for this heat sink. A general equation for the average LED temperature as a function of these three factors was derived using Minitab software.

Among 10 configurations of the rectangular heat sink, we deduce that the best configuration corresponds to the first design having 1 mm of width, 0.5 mm of height and 45 mm of length. The average temperature for this design is 50.5 C. For the power of LED equal to 50 W–200 W, the average temperature of this LED drops when the number of LED chips reduces and the pitch size decreases. Indeed, the best array-LED corresponds to 64 LED chips and a pitch size of 0.5 mm. In addition, a generalization equation for average temperature is determined as a function of the number of LED chips, pitch and power of LED which are key factors for reducing the Junction temperature.

The study is original in its focus on three factors that have not been studied together in previous research. A numerical simulation method is used to investigate the impact of the three factors, which is more accurate and reliable than experimental methods. The study considers a wide range of values for the three factors, which allows for a more comprehensive understanding of their impact. It derives a general equation for the average temperature of the LED, which can be used to design LED arrays with desired junction temperatures.

In industrial applications, formaldehyde-based wood adhesives have been used extensively because of their low costs and high reactivity. However, their real-world applications are hindered by some main bottlenecks, especially the formaldehyde emission and usage of nonrenewable raw materials. The purpose of this study is the development of sustainable and formaldehyde-free wood adhesive formulation.

In this study, starch and tannin-based wood adhesive were synthesized. Chemical structures and thermal properties of the prepared bio-based resin formulations were elucidated by using Fourier transform infrared and differential scanning calorimetry analysis, respectively. Laboratory scale particleboard production was carried out to determine the performance of the developed resin formulations. Obtained results were evaluated in dry medium (P2) according to European norms EN 312 (2010). Furthermore, the board formaldehyde content was determined by using the perforator method according to the European Norm EN 12460-5.

The results show that the improved starch and tannin-based wood adhesives were successful in their adhesive capacity, and the formaldehyde content of the final product was obtained as low as 0.75 mg/100 g. This paper highlights that the presented adhesive formulations could be a potential eco-friendly and cost-effective alternative to the formaldehyde-based wood adhesives for interior particleboard production.

Starch-based resins in the liquid form needed to be continuously mixed throughout their shelf life to prevent the starch from settling because it was not possible to dissolve the precipitated starch again after a while. For this reason, starch was given to the chips in powder form while preparing the particleboard.

In conclusion, this study shows that the developed bio-based resin formulations have a high potential to be used for producing interior-grade particleboards instead of commercial formaldehyde-based wood adhesives because the obtained results generally satisfied the interior grade particleboard requirements according to European norms EN 312, P2 class (2010). In addition, it was determined that the produced boards had significantly low formaldehyde content. The low formaldehyde content of the final boards was not because of the resin but because of the natural structure of the wood raw material, press parameters and environmental factors.

The developed bio-based resin system made it possible to obtain boards with significantly low formaldehyde content compared to commercial resins.

The developed bio-based resin formulation made it possible to produce laboratory-scale board prototypes at lower press factors and board densities compared to their counterparts.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly.

In this work, through experiments and numerical simulations, an attempt has been made to increase the fundamental natural frequency of the PCB assembly as high as practically achievable so as to minimize the impacts of dynamic loads acting on it. An optimization tool in the finite element software (ANSYS) was used to search the specified design space for the optimal support location of the six fastening screws.

It is observed that by changing the support locations based on the optimization results the fundamental natural frequency can be raised up to 51.1% and the same is validated experimentally.

Manufacturers of PCBs used in computers fix the support locations based on symmetric feature of the board not on the dynamic behavior of the assembly. This work might lead manufacturers to redesign the location of other surface mount components.

This work provides guidelines for PCB manufacturers to finalize their support locating points which will improve the dynamic characteristics of the PCB assembly during its functioning.

This study provides a novel method to improve the life of PCB based on support locations optimization which includes majority of the surface mount components that contributes to the total mass the PCB assembly.

Polymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested and reported. The purpose of this paper is suggesting thin film-based TIM to sustain the light-emiting diode (LED) performance and electronic device miniaturization.

Consequently, ZnO thin film at various thicknesses was prepared by chemical vapour deposition (CVD) method and tested their thermal behaviour using thermal transient analysis as solid TIM for high-power LED.

Low value in total thermal resistance (R_th-tot) was observed for ZnO thin film boundary condition than bare Al boundary condition. The measured interface (ZnO thin film) resistance {(R_th-bhs) thermal resistance of the interface layer (thin film) placed between metal core printed circuit board (MCPCB) board and Al substrates} was nearly equal to Ag paste boundary condition and showed low values for ZnO film prepared at 30 min process time measured at 700 mA. The T_J value of LED mounted on ZnO thin film (prepared at 30 min.) coated Al substrates was measured to be 74.8°C. High value in junction temperature difference (ΔT_J) of about 4.7°C was noticed with 30 min processed ZnO thin film when compared with Al boundary condition. Low correlated colour temperature and high luminous flux values of tested LED were also observed with ZnO thin film boundary condition (processed at 30 min) compared with both Al substrate and Ag paste boundary condition.

Overall, 30 min CVD processed ZnO thin film would be an alternative for commercial TIM to achieve efficient thermal management. This will increase the life span of the LED as the proposed material decreases the T_J values.

The purpose of this study is to increase awareness of current supply chain (SC) security-related issues by providing an extensive analysis of existing SC security solutions and their limitations. The security of SCs has received increasing attention from researchers, due to the emerging risks associated with their distributed nature. The increase in risk in SCs comes from threats that are inherently similar regardless of the type of SC, thus, requiring similar defence mechanisms. Being able to identify the types of threats will help developers to build effective defences.

In this work, we provide an analysis of the threats, possible attacks and traceability solutions for SCs, and highlight outstanding problems. Through a comprehensive literature review (2015–2021), we analysed various SC security solutions, focussing on tracking solutions. In particular, we focus on three types of SCs: digital, food and pharmaceutical that are considered prime targets for cyberattacks. We introduce a systematic categorization of threats and discuss emerging solutions for prevention and mitigation.

Our study shows that the current traceability solutions for SC systems do not offer a broadened security analysis and fail to provide extensive protection against cyberattacks. Furthermore, global SCs face common challenges, as there are still unresolved issues, especially those related to the increasing SC complexity and interconnectivity, where cyberattacks are spread across suppliers.

This is the first time that a systematic categorization of general threats for SC is made based on an existing threat model for hardware SC.

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

This study aims to develop a safe, wearable clothing system that combines visibility-enhancing and emergency–accident-responding functions for two-wheeled vehicle (TWV) users' safety assistance.

First, the wearable system (WS) allowing users to control turn signals, brake lights and emergency flasher only with head movements was developed. Second, multiconnected systems were developed between WSs and a smartphone application (AS), providing accident occurrence recognition, driving photo capture–storage and emergency notification functions. Third, usability testing in each function was performed to assess the operability of the systems.

The intuitive interface, which uses head movement as gesture commands, was effectively operated for controlling turn signals, brake lights and emergency flasher when driving, despite differences in user physique and boarding structure among TWVs. In addition, using Bluetooth low energy and Wi-Fi protocols simultaneously can establish automatic accident recognition–notification and driving photo capture–storage–display functions by linking two WSs with one AS.

This study presents a case using relatively accessible technologies within the fashion industry to improve users' safety and provide fundamental data for convergence education for smart fashion products, highlighting the significance of this study in this convergence era.

The WSs and the AS of a TWV user visually evoke the attention of other drivers and pedestrians, reducing the risk of accidents; social contribution regarding public safety will be possible by allowing the system to autonomously inform emergencies and receive emergency medical treatment quickly when the accident occurred.

Founded in 2004, OPPO has experienced the boom of the Chinese mobile phone market, the trend of mobile Internet and the prosperity of the smartphone market. While adjusting its business structure based on changes in the market environment, it has transitioned itself from an audio device manufacturer to a smart-phone manufacturer that offers hardware, software, and service.

This case study focuses on OPPO's evolution and strategy, and provides an insight into its history, competition, and strategic choices based on whether or not OPPO should release a feature phone with a foldable display at the MWC 2019, and discusses the core competitiveness that helped OPPO succeed against the market downturn. This case study helps students understand the development of corporate strategies and the process of building core competitiveness in the microcompetition in the red ocean market. We also wish to help students understand how to come up with the most appropriate decision-making framework and conduct a critical analysis on the issues based on the internal and external factors of their businesses while they make strategic decisions. When it comes to different dimensions and indicators coming to contradictory conclusions in particular, what should the manager of a business do to make the correct strategic decision?