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The purpose of this study is to design a wearable medical device as a human care platform and to introduce the design details, key technologies and practical implementation methods of the system.

A multi-channel data acquisition scheme based on PCI-E (rapid interconnection of peripheral components) was proposed. The flexible biosensor is integrated with the flexible data acquisition card with monitoring capability, and the embedded (device that can operate independently) chip STM32F103VET6 is used to realize the simultaneous processing of multi-channel human health parameters. The human health parameters were transferred to the upper computer LabVIEW by intelligent clothing through USB or wireless Bluetooth to complete the transmission and processing of clinical data, which facilitates the analysis of medical data.

The smart clothing provides a mobile medical cloud platform for wearable medical through cloud computing, which can continuously monitor the body's wrist movement, body temperature and perspiration for 24 h. The result shows that each channel is completely accurate to the top computer display, which can meet the expected requirements, and the wearable instant care system can be applied to healthcare.

The smart clothing in this study is based on the monitoring and diagnosis of textiles, and the electronic communication devices can cooperate and interact to form a wearable textile system that provides medical monitoring and prevention services to individuals in the fastest and most accurate way. Each channel of the system is precisely matched to the display screen of the host computer and meets the expected requirements. As a real-time human health protection platform technology, continuous monitoring of human vital signs can complete the application of human motion detection, medical health monitoring and human–computer interaction. Ultimately, such an intelligent garment will become an integral part of our everyday clothing.

This study investigates the impact of three parameters such as: number of LED chips, pitch and LED power on the junction temperature of LEDs using a best heat sink configuration selected according to a lower temperature. This study provides valuable insights into how to design LED arrays with lower junction temperatures.

To determine the best configuration of a heat sink, a numerical study was conducted in Comsol Multiphysics on 10 different configurations. The configuration with the lowest junction temperature was selected for further analysis. The number of LED chips, pitch and LED power were then varied to determine the optimal configuration for this heat sink. A general equation for the average LED temperature as a function of these three factors was derived using Minitab software.

Among 10 configurations of the rectangular heat sink, we deduce that the best configuration corresponds to the first design having 1 mm of width, 0.5 mm of height and 45 mm of length. The average temperature for this design is 50.5 C. For the power of LED equal to 50 W–200 W, the average temperature of this LED drops when the number of LED chips reduces and the pitch size decreases. Indeed, the best array-LED corresponds to 64 LED chips and a pitch size of 0.5 mm. In addition, a generalization equation for average temperature is determined as a function of the number of LED chips, pitch and power of LED which are key factors for reducing the Junction temperature.

The study is original in its focus on three factors that have not been studied together in previous research. A numerical simulation method is used to investigate the impact of the three factors, which is more accurate and reliable than experimental methods. The study considers a wide range of values for the three factors, which allows for a more comprehensive understanding of their impact. It derives a general equation for the average temperature of the LED, which can be used to design LED arrays with desired junction temperatures.

An alliance portfolio can help latecomer firms to acquire the necessary knowledge and resources to catch up with market leaders. However, how latecomer firms construct an alliance portfolio in terms of the nature of windows of opportunity has not been fully analyzed. This paper aims to explore how latecomer firms can build appropriate coalitions according to the nature of the window of opportunity to achieve technological catch-up in different catch-up phases.

Based on a longitudinal case study from 1984 to 2018 of Sunny Group, now a leading manufacturer of integrated optical components and products, this paper explores the process of technological catch-up of latecomer firms building different types of alliance portfolio in different windows of opportunity.

This paper finds that there is a sequence when latecomers build an alliance portfolio in the process of catch-up. When the uncertainty of opportunity increases, the governance mechanism of the alliance portfolio will change from contractual to equity-based. Also, latecomer firms build market-dominated and technology-dominated alliance portfolios to overcome their market and technology disadvantages, respectively.

These conclusions not only enrich the theory of latecomer catch-up from the perspective of windows of opportunity but also expand research on alliance portfolio processes from a temporal perspective.

In the electronic assembly industry, low-temperature soldering holds great potential to be used in surface mounting technology. Tin–bismuth (Sn–Bi) eutectic alloys are lead-free solders applied in consumer electronics because of their low melting point, high strength and low cost. This paper aims to investigate how to address the problem of hot tear crack formation during Sn–Bi low-temperature solder (LTS) in the mass production of consumer electronics.

This paper explored the development of hot tear cracks during Sn–Bi soldering in the fabrication of flip chip ball grid arrays. Experiments were designed to simulate various conditions encountered in Sn–Bi soldering. Quantitative analysis was conducted on the number of hot tear cracks observed in different alloy compositions and solder volumes to explore the primary cause of hot tear cracks and possible methods to suppress crack formation.

Hot tear cracks existed in Sn–Bi solders with different bismuth (Bi) contents, but increasing the solder volume reduced the number of hot tear cracks. Experiments were designed to test the degree of chip transient thermal warpage with temperature change, and, according to the results, glue was dispensed in specific areas to reduce chip warpage deformation. Finally, the results of combined process experiments pointed to an effective method of low-temperature soldering to suppress hot tear cracks.

The study focuses on Sn–Bi solders only without other solder pastes such as SAC305 or Sn–Zn series.

With the growing popularity of smart electronics, especially in intelligent terminals, new energy vehicles electronics, solar photovoltaic and other field, there will be more and more demand for low- temperature, energy-saving, lead-free solders. Therefore, this study will help the industry to roll out LTS (Sn–Bi) solutions rapidly.

In the long term, lean and green manufacturing is expected to be essential for maintaining an advanced manufacturing industry across the world. Developing new LTSs and soldering processes is the most effective, direct solution for energy conservation and emission mitigation. With the growing popularity of smart electronics, especially in intelligent terminals, new energy vehicles and solar photovoltaics, there would be an increased demand for low-temperature, energy-saving, lead-free techniques.

Although there are many methods that can be used to suppress hot tear cracks, there is little research on how to control the hot tear cracks caused by the low-temperature soldering of Sn–Bi in laptop applications. The authors studied the hot tear cracks that developed during the world’s first mass production of 50 million personal laptops based on low-temperature Sn–Bi alloy solder pastes. By controlling the Bi content, redesigning the solder paste printing process (e.g. through a printer’s stencil) and adding dispensing processes, the authors obtained reliable and stable experimental data and conclusions.

This study aims to contribute to the numerical modelling of drop impact on a flip-chip component assembled on printed circuit boards using solder micro-bumps. This contribution is based on the introduction of non-linear fracture mechanics in the numerical approach.

The integration of non-linear fracture mechanics into the numerical approach requires the proposal and validation of several simplifying assumptions. Initially, a dynamic 3D model was simplified to a dynamic 2D model. Subsequently, the dynamic 2D model is replaced with an equivalent static 2D model. The equivalent static 2D model was used to perform calculations considering the non-linear fracture mechanics. A crack was modelled in the critical bump. The J-integral was used as a comparative parameter to study the effects of crack length, crack position and chip thickness on the fracture toughness of the solder bump.

The different simplifying assumptions were validated by comparing the results obtained by the various models. Numerical results showed a high risk of failure at the critical solder bump in a zone close to the intermetallic layer. The obtained results were in agreement with the post-test observations using the “Dye and Pry” methods.

The originality of this study lies in the introduction of non-linear fracture mechanics to model the mechanical response of solder bumps during drop impact. This study led to some interesting conclusions, highlighting the advantage of introducing non-linear fracture mechanics into the numerical simulations of microelectronic components during a drop impact.

In industrial applications, formaldehyde-based wood adhesives have been used extensively because of their low costs and high reactivity. However, their real-world applications are hindered by some main bottlenecks, especially the formaldehyde emission and usage of nonrenewable raw materials. The purpose of this study is the development of sustainable and formaldehyde-free wood adhesive formulation.

In this study, starch and tannin-based wood adhesive were synthesized. Chemical structures and thermal properties of the prepared bio-based resin formulations were elucidated by using Fourier transform infrared and differential scanning calorimetry analysis, respectively. Laboratory scale particleboard production was carried out to determine the performance of the developed resin formulations. Obtained results were evaluated in dry medium (P2) according to European norms EN 312 (2010). Furthermore, the board formaldehyde content was determined by using the perforator method according to the European Norm EN 12460-5.

The results show that the improved starch and tannin-based wood adhesives were successful in their adhesive capacity, and the formaldehyde content of the final product was obtained as low as 0.75 mg/100 g. This paper highlights that the presented adhesive formulations could be a potential eco-friendly and cost-effective alternative to the formaldehyde-based wood adhesives for interior particleboard production.

Starch-based resins in the liquid form needed to be continuously mixed throughout their shelf life to prevent the starch from settling because it was not possible to dissolve the precipitated starch again after a while. For this reason, starch was given to the chips in powder form while preparing the particleboard.

In conclusion, this study shows that the developed bio-based resin formulations have a high potential to be used for producing interior-grade particleboards instead of commercial formaldehyde-based wood adhesives because the obtained results generally satisfied the interior grade particleboard requirements according to European norms EN 312, P2 class (2010). In addition, it was determined that the produced boards had significantly low formaldehyde content. The low formaldehyde content of the final boards was not because of the resin but because of the natural structure of the wood raw material, press parameters and environmental factors.

The developed bio-based resin system made it possible to obtain boards with significantly low formaldehyde content compared to commercial resins.

The developed bio-based resin formulation made it possible to produce laboratory-scale board prototypes at lower press factors and board densities compared to their counterparts.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly.

In this work, through experiments and numerical simulations, an attempt has been made to increase the fundamental natural frequency of the PCB assembly as high as practically achievable so as to minimize the impacts of dynamic loads acting on it. An optimization tool in the finite element software (ANSYS) was used to search the specified design space for the optimal support location of the six fastening screws.

It is observed that by changing the support locations based on the optimization results the fundamental natural frequency can be raised up to 51.1% and the same is validated experimentally.

Manufacturers of PCBs used in computers fix the support locations based on symmetric feature of the board not on the dynamic behavior of the assembly. This work might lead manufacturers to redesign the location of other surface mount components.

This work provides guidelines for PCB manufacturers to finalize their support locating points which will improve the dynamic characteristics of the PCB assembly during its functioning.

This study provides a novel method to improve the life of PCB based on support locations optimization which includes majority of the surface mount components that contributes to the total mass the PCB assembly.

Upon completion of the case study, the students will be able to find the challenges and underlying structures that cause the problem; the students will be able to identify the dynamic variables and develop the interconnection and interlinkages among the time-delayed variables to build the story of the business case; the students could develop the block diagram and could build the system dynamics model using the simulation software STELLA, and if they do not have the simulation software, even then they could have a mental model to understand the problem well; the system dynamics students can design the policies to make the system better behaved and recommend solutions; and the students could make mind maps and develop the mental model and could recommend solutions and way forward to overcome the challenges and solve the issues.

Tradeasia is a small-scale manufacturing firm that had started its business activities near Sundar Industrial Estate, Raiwind, in September 2007. The company’s prime focus was to buy the potato starch from chips manufacturing companies and, then, extract the potato starch from the waste potato using its own machinery and sell it as a sizing agent to textile mills. Quality characteristics in terms of better millage and enhanced gullibility made it compatible with Rafhan corn-based starch. The major challenge linked to potato starch was its degree of wetness; the potato starch either extracted from rotten potato or procured from the potato chips manufacturing companies had a high degree of wetness and moisture content. Wet potato starch sometimes had more than 60% moisture content, which was really a challenge. Owing to the high degree of wetness, the wet starch was prone to fungus growth, and within hours, the fungus created toxins if it was not dried immediately, and then after 24 h, toxins acquired a black colour, and they became hardened like pebbles. The starch then was unusable even for sizing purposes for textile products. Reduction in the degree of wetness was really a big challenge and demanded prompt action and high productivity of the operational staff to make that product dry for sale purposes. This was the biggest challenge that ended up in huge inventories of wet starch. Capacity constraints and operational inefficiency killed the company’s productivity and affected the company’s profit.

This case study is written and developed for MBA and MS-level supply chain students of the system dynamics course or those studying management of supply chain complexities. This case study discusses the operational challenges while running the business; huge inventories, capacity constraints and inefficiency in production operations were the challenges associated with almost all manufacturing industries. This case study discussed not only why such challenges are appearing in the business but also the solution that resided in the wisdom shared by the employees in the board meeting. An integrated system dynamics model could be used to design the policies to overcome such challenges. Even the block diagram of the model and causal loop diagram could help to conceptualize the problem and explore the way forward.

Teaching notes are available for educators only.

CSS 7: Management science.

Tactile sensation is an important sensory function for robots in contact with the external environment. To better acquire tactile information about objects, this paper aims to propose a three-layer structure of the interdigital flexible tactile sensor.

The sensor consists of a bottom electrode layer, a middle pressure-sensitive layer and a top indenter layer. First, the pressure sensitive material, structure design, fabrication process and circuit design of the sensor are introduced. Then, the calibration and performance test of the designed sensor is carried out. Four functions are used to fit and calibrate the relationship between the output voltage of the sensor and the contact force. Finally, the contact force sensing test of different weight objects and the flexible test of the sensor are carried out.

The performance test results show that the sensitivity of the sensor is 0.93 V/N when it is loaded with 0–3 N and 0.23 V/N when it is loaded with 3–5 N. It shows good repeatability, and the cross-interference between the sensing units is generally low. The contact force sensing test results of different weight objects show that the proposed sensor performs well in contact force. Each part of the sensor is a flexible material, allowing the sensor to achieve bending deformation, so that the sensor can better perceive the contact signs of the grasped object.

The sensor can paste the surface of the paper robot’s gripper to measure the contact force of the grasping object and estimate the contour of the object.

In this paper, a three-layer interdigital flexible tactile sensor is proposed, and the structural parameters of the interdigital electrode are designed to improve the sensitivity and response speed of the sensor. The indenter with three shapes of the prism, square cylinder and hemisphere is preliminarily designed and the prism indenter with better conduction force is selected through finite element analysis, which can concentrate the external force in the sensing area to improve the sensitivity. The sensor designed in this paper can realize the measurement of contact force, which provides a certain reference for the field of robot tactile.