Search results

This study seeks to address the challenge of repatriate turnover by focusing on how effective repatriation adjustment, job satisfaction, and organizational commitment are at predicting the Taiwanese repatriates' intentions to leave their organization. By building on the cross‐cultural adjustment and turnover theories and researches, this study expands these recent findings to Taiwanese repatriates.

Multiple regression was used to predict intent to leave and explain the impact of the three predictors on intent to leave. Correlation was used to compare the relationship of study variables.

The results of multiple regression indicated that repatriation adjustment was the strongest predictor of intent to leave followed by organizational commitment. The combination of the three variables can predict approximately 58 percent of the variance of intent to leave. Overall interrelations among the independent variables showed a positive strong relationship and negatively related to intent to leave the organization.

The results provide empirical evidence that repatriation adjustment, job satisfaction, and organizational commitment are negatively related to intent to leave the organization. Furthermore, the conceptual framework of this study can be a guide to future research in repatriates' turnover intention.

The results of this study may help multinational organizations in Taiwan to enhance the international assignment process of their employees and keep valuable human capital within the organization.

The purpose of this paper is to examine the relationship between job satisfaction, family support, learning orientation, organizational socialization and cross‐cultural training and cross‐cultural adjustment in the proposed model.

A quantitative research method was used, and correction and regression were employed. The study undertook a multidimensional approach in its assessment of the adjustment of Taiwanese financial institution expatriates.

This study found that job satisfaction played an important role in the proposed model of expatriate adjustment in an international assignment. Also found to be of importance was the role of organization socialization.

The conclusions of this study pertain only to Taiwanese financial institution expatriates in the USA, and cannot be generalized for cross‐cultural adjustment in other countries.

Given the associations between job satisfaction and cross‐cultural adjustment, multinationals should ensure that they have human resource policies and practice to support the job satisfaction of expatriates. Modifying socialization policies and practices can have a positive influence on expatriates' adjustment.

This study both replicates and extends previous research on cross‐cultural adjustment. It provides objective information for expatriate selection, management and socialization.

Differing from previous studies trying to solve the electromagnetic compatibility (EMC) issue by addressing single factor, this study aims to combine measures of shielding, filtering and grounding to design parameters with the Taguchi method at the beginning of product design to come up with the optimal parameter combination.

EMC-related performance such as radiated emission, conduction interference and electrical fast transient/burst immunity (EFT) are response variables, whereas the printed circuit board and mechanic design-relevant parameters are considered as control factors. The noise factors are peripherals used together with the tablet.

The optimal design parameter matrix based on results from the application and integration of multivariate analysis method of principal component grey relation and technique for order preference by similarity to ideal solution suggests 14 grounding screw holes, cooling aperture of casing at diameter of 3 mm and staggered layout and 300O filter located at source of noise. Validation of this matrix shows around 10, 1 and 8 per cent improvement in radiation, conduction interference and EFT immunity.

The multivariate quality parameters’ design method proposed by this study improves EMC characteristics of products and meets the design specification required by customer, accelerating electronic product research and development process and complying with electromagnetic interference test regulations set forth by individual country.

This paper aims to propose an innovative parametric design for artificial neural network (ANN) modeling for the multi-quality function problem to determine the optimal process scenarios.

The innovative hybrid algorithm gray relational analysis (GRA)-ANN and the GRA-Entropy are proposed to effectively solve the multi-response optimization problem.

Both the GRA-ANN and the GRA-Entropy analytical approaches find that the optimal process scenario is a stencil aperture of 57 per cent and immediate processing of the printed circuit board after exposure to a room environment.

A six-week confirmation test indicates that the optimal process has improved quad flat non-lead assembly yield from 99.12 to 99.78 per cent.

This paper aims to consider the practical production environment of electronics manufacturing industry firms, and the large quantities of information collected on machine processes, testing data and production reports, while simultaneously taking into account the properties of the processing environment, in conducting analysis to obtain valuable information.

This research constructs a prediction model of the circuit board assembly process yield. A decision tree is used to extract the key attributes. The authors also integrate association rules to determine the relevance of key attributes of undesirable phenomena.

The results assure the successful application of the methodology by reconfirming the rules for solder skip and short circuit occurrence and their causes.

Measures for improvement are recommended, production parameters determined and debugging suggestions made to improve the process yield when the new process is implemented.