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Using the modified theory of planned behavior, this study aims to understand residents’ supporting or rejecting mindsets toward legalizing gambling in Kinmen, Taiwan, where exists a complex and somewhat contradictory relationships between economic growth and the preservation of the natural environment in the context of tourism specifically to small island destinations. This study develops a convenience sampling procedure in which 365 questionnaires are collected. A series of hypotheses tests are conducted via structural equation modeling. This study notices that perceived behavioral control is the most important attribute affecting behavioral intention. However, behavioral intention does not necessarily lead to actual behavior. Attitude is considered as a more reliable predictor of actual action. Attitude relied heavily on positive perceived behavioral control. Further, the respondents are concerned more about how legalizing gambling affects their current lifestyle.

By using ethnographic data and family interviews from eight families in Taipei, Taiwan, this paper aims to delineate how multigenerational families implement parents’ child-rearing values, and how these strategies vary by social class. The primary focus is the child’s mother and her relationship with other family members. I ask the following question: How does a mother in a three-generation family implement her ideal parenting values for her child while being encumbered by the constraints of her parents-in-law? Additionally, how does this intergenerational dynamic vary with family socioeconomic status? To conceptualize this process in such a complex context, I argue that we must understand parenting behaviors as acts of “doing family” and “intensive mothering.”

From 2008 to 2009, I conducted a pilot survey in two public elementary schools to recruit the parents of sixth-grade students. All eight cases of multigenerational families in this paper were selected randomly after being clustered by the parent’s highest education level and family income levels. This paper utilized the mothers’ interviews as the major source to analyze, while the interviews of other family members served as supplementary data.

Two cases, Mrs Lee and Mrs Su’s stories, were selected here to illustrate two distinctive approaches toward childrearing in multi-generational families. Results indicate that white-collar mothers in Taiwan hold the value of concerted cultivation and usually picture the concept of intensive mothering as their ideal image of parenthood. Yet, such an ideal and more westernized child-rearing philosophy often leads to tensions at home, particularly between the mother and the mother-in-law. Meanwhile, blue-collar mothers tend to collaborate with grandparents in sharing childcare responsibilities, and oftentimes experience friction over child discipline in terms of doing homework and material consumption.

Via this analysis of three-generation families in Taiwan, we are able to witness the struggle of contemporary motherhood in East Asia. This paper foregrounds the negotiations that these mothers undertake in defining ideal parenting and the ideal family. On the one hand, these mothers must encounter the new parenting culture, given that the cultural ideal of concerted cultivation has become a popular ideology. On the other hand, by playing the role of daughter-in-law, they must negotiate within the conventional, patriarchal family norms.

FastSLAM is a popular method to solve the problem of simultaneous localization and mapping (SLAM). However, when the number of landmarks present in real environments increases, there are excessive comparisons of the measurement with all the existing landmarks in each particle. As a result, the execution speed will be too slow to achieve the objective of real-time navigation. Thus, this paper aims to improve the computational efficiency and estimation accuracy of conventional SLAM algorithms.

As an attempt to solve this problem, this paper presents a computationally efficient SLAM (CESLAM) algorithm, where odometer information is considered for updating the robot’s pose in particles. When a measurement has a maximum likelihood with the known landmark in the particle, the particle state is updated before updating the landmark estimates.

Simulation results show that the proposed CESLAM can overcome the problem of heavy computational burden while improving the accuracy of localization and mapping building. To practically evaluate the performance of the proposed method, a Pioneer 3-DX robot with a Kinect sensor is used to develop an RGB-D-based computationally efficient visual SLAM (CEVSLAM) based on Speeded-Up Robust Features (SURF). Experimental results confirm that the proposed CEVSLAM system is capable of successfully estimating the robot pose and building the map with satisfactory accuracy.

The proposed CESLAM algorithm overcomes the problem of the time-consuming process because of unnecessary comparisons in existing FastSLAM algorithms. Simulations show that accuracy of robot pose and landmark estimation is greatly improved by the CESLAM. Combining CESLAM and SURF, the authors establish a CEVSLAM to significantly improve the estimation accuracy and computational efficiency. Practical experiments by using a Kinect visual sensor show that the variance and average error by using the proposed CEVSLAM are smaller than those by using the other visual SLAM algorithms.

This paper aims to propose an innovative parametric design for artificial neural network (ANN) modeling for the multi-quality function problem to determine the optimal process scenarios.

The innovative hybrid algorithm gray relational analysis (GRA)-ANN and the GRA-Entropy are proposed to effectively solve the multi-response optimization problem.

Both the GRA-ANN and the GRA-Entropy analytical approaches find that the optimal process scenario is a stencil aperture of 57 per cent and immediate processing of the printed circuit board after exposure to a room environment.

A six-week confirmation test indicates that the optimal process has improved quad flat non-lead assembly yield from 99.12 to 99.78 per cent.

The purpose of this paper is to investigate how to reduce the time and cost required to conduct reliability testing. With increasing competition in the electronics industry and reduction in product life cycles, it is essential to diminish the time required for new product development and thus time to market.

This study conducts empirical sample test for wireless card and analyzes the fatigue life through finite element modeling (FEM). Simulation results are compared to the data collected from a temperature cycling test under conditions of −40°C to 150°C and −40°C to 100°C.

Assuming that the results of product lifetime from empirical sample test and software simulation exhibit a linear relationship, a “scale factor” should exist for any given product structure, process condition and materials composition scenario. The scale factors were found to be approximately 0.1 in both temperature cycling scenarios. Also, the effectiveness of various adhesive dispensing patterns on solder joint reliability is evaluated through software simulation. The L shape adhesive dispensing was proven to effectively enhance the fatigue life of chip scale package solder joints roughly 100‐fold.

The scale factor is used to convert the results from software simulation to empirical sample test for a given set of processing environments and materials. This helps to reduce the time and cost required to conduct reliability testing.

This research aims to study the stencil printing process of the quad flat package (QFP) component with a pin pitch of 0.4 mm. After the optimization of the printing process, the desired inspection specification is determined to reduce the expected total process loss.

Static Taguchi parametric design is applied while considering the noise factors possibly affecting the printing quality in the production environment. The Taguchi quality loss function model is then proposed to evaluate the two types of inspection strategies.

The optimal parameter-level treatment for the solder paste printing process includes a squeegee pressure of 11 kg, a stencil snap-off of 0.14 mm, a cleaning frequency of the stencil once per printing and using an air gun after stencil wiping. The optimal upper and lower specification limits are 119.8 µm and 110.3 µm, respectively.

Noise factors in the production environment are considered to determine the optimal printing process. For specific components, the specification is established as a basis for subsequent processes or reworks.

The purpose of this study is to use the Taguchi Method for parametric design in the early stages of product development. electromagnetic compatibility (EMC) issues can be considered in the early stages of product design to reduce counter-measure components, product cost and labor consumption increases due to a number of design changes in the R&D cycle and to accelerate the R&D process.

The three EMC characteristics, including radiated emission, conducted emission and fast transient impulse immunity of power, are considered response values; control factors are determined with respect to the relevant parameters for printed circuit board and mechanical design of the product and peripheral devices used in conjunction with the product are considered as noise factors. The optimal parameter set is determined by using the principal component gray relational analysis in conjunction with both response surface methodology and artificial neural network.

Market specifications and cost of components are considered to propose an optimal parameter design set with the number of grounded screw holes being 14, the size of the shell heat dissipation holes being 3 mm and the arrangement angle of shell heat dissipation holes being 45 degrees, to dispose of 390 O filters on the noise source.

The optimal parameter set can improve EMC effectively to accommodate the design specifications required by customers and pass test regulations.

This study aims to focus on the passive components of System in Package SiP modules and discusses the geometric pad designs for 01005-sized passive components, the front end design of the hole size and shape of the stencil and the parameters of the stencil sidewall coating, to determine the optimum parameter combination.

This study plans and conducts experiments, where a L8(27) inner orthogonal array is built to consider the control factors, including a L4(23) outer orthogonal array to consider the noise factor, and the experimental data are analyzed by using the technique for order preference by similarity to ideal solution multi-quality analysis method.

The results show that the optimum design parameter level combination is that the solder mask opening pad has no solder mask in the lower part of the component, the pad width is 1.1 times that of the component width, the pad length is 1.75 times that of the electrode tip length, the pad spacing is 5 mil, the stencil open area is 90% of the pad area, the stencil opening corner has a 3 mil chamfer angle, and the stencil sidewall is free of nano-coating.

The parameter design and multi-quality analysis method, as proposed in this study, can effectively develop the layout of passive components on a high-density SiP module substrate, to stabilize the process and increase the production yield.

Differing from previous studies trying to solve the electromagnetic compatibility (EMC) issue by addressing single factor, this study aims to combine measures of shielding, filtering and grounding to design parameters with the Taguchi method at the beginning of product design to come up with the optimal parameter combination.

EMC-related performance such as radiated emission, conduction interference and electrical fast transient/burst immunity (EFT) are response variables, whereas the printed circuit board and mechanic design-relevant parameters are considered as control factors. The noise factors are peripherals used together with the tablet.

The optimal design parameter matrix based on results from the application and integration of multivariate analysis method of principal component grey relation and technique for order preference by similarity to ideal solution suggests 14 grounding screw holes, cooling aperture of casing at diameter of 3 mm and staggered layout and 300O filter located at source of noise. Validation of this matrix shows around 10, 1 and 8 per cent improvement in radiation, conduction interference and EFT immunity.

The multivariate quality parameters’ design method proposed by this study improves EMC characteristics of products and meets the design specification required by customer, accelerating electronic product research and development process and complying with electromagnetic interference test regulations set forth by individual country.