The excellent material properties of fibre reinforced composites make them especially attractive for applications in the aerospace and automotive industries. Traditional methods of manufacturing composite structures have proven to be labour intensive and time‐consuming. Robotic fibre placement for fabrication of composite components has been proposed. This approach greatly reduces production cost and time. This paper briefly presents the overall strategy for the establishment of a robotic fibre placement facility. The methodology for development of process planning and programming, simulation, program generator and control is described. In addition, the algorithms for automatic fibre path generation for open and closed surfaces will also be discussed, as well as the control system architecture for the process.
Laser interferometry‐based sensing (LIS) technique has been proposed and established recently to track and perform dynamic measurements on a moving end‐effector of a robot…
Laser interferometry‐based sensing (LIS) technique has been proposed and established recently to track and perform dynamic measurements on a moving end‐effector of a robot manipulator. In this paper, a technique using LIS system to perform guidance of a manipulator is proposed. The LIS system is used as a sensor to guide the end‐effector of a robot manipulator. This is to be accomplished through the implementation of guidance error determination and compensation, and path generation in the control algorithm. This technique can be used to accurately guide the manipulator’s end‐effector to a specified location or along a specified path with a high level of accuracy. The structure and various components within the system and the control strategy are also presented.
A Cu‐Al bonding system exists when copper wire is bonded onto an aluminum bond pad using thermosonic wire bonding technology. Aged Cu‐Al bonding system was analyzed by…
A Cu‐Al bonding system exists when copper wire is bonded onto an aluminum bond pad using thermosonic wire bonding technology. Aged Cu‐Al bonding system was analyzed by measuring the intermetallics layer thickness and its correlation to electrical contact resistance. Result shows that the thickness of Cu‐Al intermetallics layer grows almost linearly to aging time. The activation energy needed for Cu atoms to diffuse into Al was calculated using Fick's law; Q=129.66 kJ/mole and D0=1.628×10−4 m2/s. The calculation of activation energy and impurity diffusity using Model Kidson also shows linear relationship. Electrical resistance of Cu‐Al intermetallics layer was calculated from contact resistance of Cu‐Al bonding system. The result shows that the electrical resistance of Cu‐Al intermetallics layer increases linearly with intermetallics thickness. Its growth rate that was calculated using Model of Braunovic and Alexandrov is double of Model of Murcko.