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Observes that most research surrounding the internationalperformance of companies has revolved around their export intensity.Takes the view that, although exports are…
Observes that most research surrounding the international performance of companies has revolved around their export intensity. Takes the view that, although exports are certainly an important component of globalization, this concept ignores a significant proportion of a company′s global value‐chain. Presents case studies to map the globalization of two high‐tech companies. Posits the expectation that, in companies which perform superlatively in terms of their global revenue base, value‐adding activities will be dispersed on a world‐wide basis early in the companies′ evolution, their technology and product life cycles will show very little lead‐time lag across major markets, and product development strategies will be driven by global market requirements.
David R. Selviah, Andy C. Walker, David A. Hutt, Kai Wang, Aongus McCarthy, F. Anibal Fernández, Ioannis Papakonstantinou, Hadi Baghsiahi, Himanshu Suyal, Mohammad Taghizadeh, Paul Conway, John Chappell, Shefiu S. Zakariyah, Dave Milward, Richard Pitwon, Ken Hopkins, Malcolm Muggeridge, Jeremy Rygate, Jonathan Calver, Witold Kandulski, David J. Deshazer, Karen Hueston, David J. Ives, Robert Ferguson, Subrena Harris, Gary Hinde, Martin Cole, Henry White, Navin Suyal, Habib ur Rehman and Chris Bryson
The purpose of this paper is to provide an overview of the research in a project aimed at developing manufacturing techniques for integrated optical and electronic…
The purpose of this paper is to provide an overview of the research in a project aimed at developing manufacturing techniques for integrated optical and electronic interconnect printed circuit boards (OPCB) including the motivation for this research, the progress, the achievements and the interactions between the partners.
Several polymer waveguide fabrication methods were developed including direct laser write, laser ablation and inkjet printing. Polymer formulations were developed to suit the fabrication methods. Computer‐aided design (CAD) tools were developed and waveguide layout design rules were established. The CAD tools were used to lay out a complex backplane interconnect pattern to meet practical demanding specifications for use in a system demonstrator.
Novel polymer formulations for polyacrylate enable faster writing times for laser direct write fabrication. Control of the fabrication parameters enables inkjet printing of polysiloxane waveguides. Several different laser systems can be used to form waveguide structures by ablation. Establishment of waveguide layout design rules from experimental measurements and modelling enables successful first time layout of complex interconnection patterns.
The complexity and length of the waveguides in a complex backplane interconnect, beyond that achieved in this paper, is limited by the bend loss and by the propagation loss partially caused by waveguide sidewall roughness, so further research in these areas would be beneficial to give a wider range of applicability.
The paper gives an overview of advances in polymer formulation, fabrication methods and CAD tools, for manufacturing of complex hybrid‐integrated OPCBs.