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Circuit World, vol. 26 no. 1
Type: Research Article
ISSN: 0305-6120

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Microelectronics International, vol. 26 no. 3
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 March 1993

Tyzoon Tyebjee

Observes that most research surrounding the internationalperformance of companies has revolved around their export intensity.Takes the view that, although exports are certainly an…

Abstract

Observes that most research surrounding the international performance of companies has revolved around their export intensity. Takes the view that, although exports are certainly an important component of globalization, this concept ignores a significant proportion of a company′s global value‐chain. Presents case studies to map the globalization of two high‐tech companies. Posits the expectation that, in companies which perform superlatively in terms of their global revenue base, value‐adding activities will be dispersed on a world‐wide basis early in the companies′ evolution, their technology and product life cycles will show very little lead‐time lag across major markets, and product development strategies will be driven by global market requirements.

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Journal of Business & Industrial Marketing, vol. 8 no. 3
Type: Research Article
ISSN: 0885-8624

Keywords

Abstract

Purpose

The purpose of this paper is to provide an overview of the research in a project aimed at developing manufacturing techniques for integrated optical and electronic interconnect printed circuit boards (OPCB) including the motivation for this research, the progress, the achievements and the interactions between the partners.

Design/methodology/approach

Several polymer waveguide fabrication methods were developed including direct laser write, laser ablation and inkjet printing. Polymer formulations were developed to suit the fabrication methods. Computer‐aided design (CAD) tools were developed and waveguide layout design rules were established. The CAD tools were used to lay out a complex backplane interconnect pattern to meet practical demanding specifications for use in a system demonstrator.

Findings

Novel polymer formulations for polyacrylate enable faster writing times for laser direct write fabrication. Control of the fabrication parameters enables inkjet printing of polysiloxane waveguides. Several different laser systems can be used to form waveguide structures by ablation. Establishment of waveguide layout design rules from experimental measurements and modelling enables successful first time layout of complex interconnection patterns.

Research limitations/implications

The complexity and length of the waveguides in a complex backplane interconnect, beyond that achieved in this paper, is limited by the bend loss and by the propagation loss partially caused by waveguide sidewall roughness, so further research in these areas would be beneficial to give a wider range of applicability.

Originality/value

The paper gives an overview of advances in polymer formulation, fabrication methods and CAD tools, for manufacturing of complex hybrid‐integrated OPCBs.

Details

Circuit World, vol. 36 no. 2
Type: Research Article
ISSN: 0305-6120

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Microelectronics International, vol. 29 no. 2
Type: Research Article
ISSN: 1356-5362

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43

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Microelectronics International, vol. 28 no. 2
Type: Research Article
ISSN: 1356-5362

Content available
201

Abstract

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Microelectronics International, vol. 29 no. 1
Type: Research Article
ISSN: 1356-5362

Content available
200

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Microelectronics International, vol. 29 no. 3
Type: Research Article
ISSN: 1356-5362

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60

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Microelectronics International, vol. 24 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 2 August 2011

446

Abstract

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Microelectronics International, vol. 28 no. 3
Type: Research Article
ISSN: 1356-5362

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