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Ioannis N. Lagoudis

There is significant amount of literature tackling different issues related to the port industry. The present chapter focuses on a single business unit of seaports aiming…

Abstract

There is significant amount of literature tackling different issues related to the port industry. The present chapter focuses on a single business unit of seaports aiming at the documentation of works related to container terminals.

An effort to review, collect and present the majority of the works present in the last 30 years, between 1980 and 2010, has been made in order to picture the problems dealt and methods used by the authors in the specific research field. To facilitate the reader, studies have been grouped under five categories of addressed problems (productivity and competitiveness, yard and equipment utilization, equipment scheduling, berth planning, loading/unloading) and four modelling methodologies (mathematics and operations research, management and economics, simulation, stochastic modelling).

The analysis shows that most works focus on productivity and competitiveness issues followed by yard and equipment utilisation and equipment scheduling. In reference to the methodologies used managerial and economic approaches lead, followed by mathematics and operations research.

In reference to future research, two fields have been identified where there is scope of significant contribution by the academic community: container terminal security and container terminal supply chain integration.

The present chapter provides the framework for researchers in the field of port container terminals to picture the so far works in this research area and enables the identification of gaps at both research question and methodology level for further research.

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Maritime Logistics
Type: Book
ISBN: 978-1-78052-340-8

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The Emerald Review of Industrial and Organizational Psychology
Type: Book
ISBN: 978-1-78743-786-9

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Article

Li‐Yin Hsiao and Jenq‐Gong Duh

In the flip‐chip technology (FCT) used in current microelectronic packages, a Ni‐based under‐bump metallurgy (UBM) is widely used due to its slow reaction rate with Sn. In…

Abstract

Purpose

In the flip‐chip technology (FCT) used in current microelectronic packages, a Ni‐based under‐bump metallurgy (UBM) is widely used due to its slow reaction rate with Sn. In this study, solders joints of eutectic Pb‐Sn with a Ni UBM were employed to investigate the intermetallic compound (IMC) formation after aging at 150°C for various periods of time.

Design/methodology/approach

The compositions and elemental re‐distribution in the IMC formed due to the interfacial reaction between the Ni/Cu UBM and eutectic Sn‐Pb solders were evaluated with an electron probe microanalyzer. The interfacial morphologies were revealed with the aid of a field‐emission scanning electron microscope through a special etching technique.

Findings

At the centre of the chip side, two IMCs were found between the solder and Ni metallization. The scalloped‐like IMC was determined to be (Cu, Ni)6Sn5, while the nodule‐like IMC was (Ni,Cu)3Sn4. However, at the edge of the chip side, three IMCs were revealed. The scalloped‐like IMC was (Cu1−y,Niy)6Sn5, the nodule‐like IMC was (Ni1−x,Cux)3Sn4, and the layer‐type IMC was (Cu1−z,Niz)3Sn.

Originality/value

On the basis of the elemental distributions from the quantitative analysis of the IMC and the related phase transitions during the IMC formation, two distinct diffusion paths are proposed to illustrate the interfacial reaction and phase transformation between IMCs and solder in Sn‐Pb joints aged at 150°C. These diffusion paths demonstrated two kinds of phase equilibrium, including (Cu1−z,Niz)3Sn/(Cu1−y,Niy)6Sn5/solder and (Ni1−x,Cux)3Sn4/(Cu1−yNiy)6Sn5/solder.

Details

Soldering & Surface Mount Technology, vol. 18 no. 2
Type: Research Article
ISSN: 0954-0911

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Book part

Matt Bower

This chapter provides a comprehensive review of research and developments relating to the use of Web 2.0 technologies in education. As opposed to early educational uses of…

Abstract

This chapter provides a comprehensive review of research and developments relating to the use of Web 2.0 technologies in education. As opposed to early educational uses of the Internet involving publication of static information on web pages, Web 2.0 tools offer a host of opportunities for educators to provide more interactive, collaborative, and creative online learning experiences for students. The chapter starts by defining Web 2.0 tools in terms of their ability to facilitate online creation, editing, and sharing of web content. A typology of Web 2.0 technologies is presented to illustrate the wide variety of tools at teachers’ disposal. Educational uses of Web 2.0 technologies such as wikis, blogs, and microblogging are explored, in order to showcase the variety of designs that can be utilized. Based on a review of the research literature the educational benefits of using Web 2.0 technologies are outlined, including their ability to facilitate communication, collaborative knowledge building, student-centered activity, and vicarious learning. Similarly, issues surrounding the use of Web 2.0 tools are distilled from the literature and discussed, such as the possibility of technical problems, collaboration difficulties, and plagiarism. Two case studies involving the use Web 2.0 tools to support personalized learning and small group collaboration are detailed to exemplify design possibilities in greater detail. Finally, design recommendations for learning and teaching using Web 2.0 are presented, again based on findings from the research literature.

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Design of Technology-Enhanced Learning
Type: Book
ISBN: 978-1-78714-183-4

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Article

Chien-Yi Huang, Ching-Hsiang Chen and Yueh-Hsun Lin

This paper aims to propose an innovative parametric design for artificial neural network (ANN) modeling for the multi-quality function problem to determine the optimal…

Abstract

Purpose

This paper aims to propose an innovative parametric design for artificial neural network (ANN) modeling for the multi-quality function problem to determine the optimal process scenarios.

Design/methodology/approach

The innovative hybrid algorithm gray relational analysis (GRA)-ANN and the GRA-Entropy are proposed to effectively solve the multi-response optimization problem.

Findings

Both the GRA-ANN and the GRA-Entropy analytical approaches find that the optimal process scenario is a stencil aperture of 57 per cent and immediate processing of the printed circuit board after exposure to a room environment.

Originality/value

A six-week confirmation test indicates that the optimal process has improved quad flat non-lead assembly yield from 99.12 to 99.78 per cent.

Details

Soldering & Surface Mount Technology, vol. 28 no. 2
Type: Research Article
ISSN: 0954-0911

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Article

Chien-Yi Huang

This research aims to study the stencil printing process of the quad flat package (QFP) component with a pin pitch of 0.4 mm. After the optimization of the printing…

Abstract

Purpose

This research aims to study the stencil printing process of the quad flat package (QFP) component with a pin pitch of 0.4 mm. After the optimization of the printing process, the desired inspection specification is determined to reduce the expected total process loss.

Design/methodology/approach

Static Taguchi parametric design is applied while considering the noise factors possibly affecting the printing quality in the production environment. The Taguchi quality loss function model is then proposed to evaluate the two types of inspection strategies.

Findings

The optimal parameter-level treatment for the solder paste printing process includes a squeegee pressure of 11 kg, a stencil snap-off of 0.14 mm, a cleaning frequency of the stencil once per printing and using an air gun after stencil wiping. The optimal upper and lower specification limits are 119.8 µm and 110.3 µm, respectively.

Originality/value

Noise factors in the production environment are considered to determine the optimal printing process. For specific components, the specification is established as a basis for subsequent processes or reworks.

Details

Soldering & Surface Mount Technology, vol. 30 no. 4
Type: Research Article
ISSN: 0954-0911

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Article

Nesar Ahmad, M.U. Bokhari, S.M.K. Quadri and M.G.M. Khan

The purpose of this research is to incorporate the exponentiated Weibull testing‐effort functions into software reliability modeling and to estimate the optimal software…

Abstract

Purpose

The purpose of this research is to incorporate the exponentiated Weibull testing‐effort functions into software reliability modeling and to estimate the optimal software release time.

Design/methodology/approach

This paper suggests a software reliability growth model based on the non‐homogeneous Poisson process (NHPP) which incorporates the exponentiated Weibull (EW) testing‐efforts.

Findings

Experimental results on actual data from three software projects are compared with other existing models which reveal that the proposed software reliability growth model with EW testing‐effort is wider and effective SRGM.

Research limitations/implications

This paper presents a SRGM using a constant error detection rate per unit testing‐effort.

Practical implications

Software reliability growth model is one of the fundamental techniques to assess software reliability quantitatively. The results obtained in this paper will be useful during the software testing process.

Originality/value

The present scheme has a flexible structure and may cover many of the earlier results on software reliability growth modeling. In general, this paper also provides a framework in which many software reliability growth models can be described.

Details

International Journal of Quality & Reliability Management, vol. 25 no. 2
Type: Research Article
ISSN: 0265-671X

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Article

Yi-Chun Huang, Min-Li Yang and Ying-Jiuan Wong

Little research has been conducted on the internal factors that drive green product (GP) innovation and how family influence affects firm adoption of GP innovation. This…

Abstract

Purpose

Little research has been conducted on the internal factors that drive green product (GP) innovation and how family influence affects firm adoption of GP innovation. This study aims to apply multiple perspectives to bridge this research gap, adopting the resource-based view (RBV) to examine what and how internal factors affect firm adoption of GP innovation, and using the behavioral theory of family firms to investigate whether family influence fosters or hinders firm adoption of GP innovation.

Design/methodology/approach

This study used a multichannel approach and adopted content analysis to collect and evaluate data on listed Taiwanese firms and used cross-sectional regression analysis to examine the effect of internal factors and family influence on firm adoption of GP innovation.

Findings

The results showed that the internal factors of green capabilities, R&D intensity and firm size significantly and positively affected firm adoption of GP innovation separately. Furthermore, the study found that family influence (ownership and control) significantly and negatively affects firm adoption of GP innovation separately.

Research limitations/implications

This study contributes to the academic research of innovation management, green management and family firms in several aspects, but also has some limitations. This study examined only the relationship between a firm’s internal factors and GP innovation. Future research might test the relationship between a firm’s internal factors and adoption of green process innovation. In addition, such research can explore how integrated internal and external factors influence firm adoption of GP innovation.

Practical implications

From the RBV, the internal factors of green capabilities, R&D intensity and firm size that can exert crucial effects on firm engage in firm’s adoption of GP innovation. This study suggests that top managers in family-influenced businesses should maintain appropriate commitment and support for fostering and facilitating firm GP innovation.

Social implications

From the RBV, this study examined how internal factors affect firm adoption of GP innovation. Moreover, based on the behavioral theory of family firms, this study further examined how family influence (ownership and control) affects firm adoption of GP innovation. This paper extended both perspectives to examine green issues.

Originality/value

From the RBV, this study examined how internal factors affect firms’ GP innovation. Moreover, based on institutional theory, this study further examines how a family firm moderates the relationship between a firm’s internal factors and GP innovation. The paper extended both perspectives to probe further the green issues.

Details

Management Research Review, vol. 39 no. 10
Type: Research Article
ISSN: 2040-8269

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Rutgers Studies in Accounting Analytics: Audit Analytics in the Financial Industry
Type: Book
ISBN: 978-1-78743-086-0

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Book part

Inma Rodríguez-Ardura and Antoni Meseguer-Artola

Recent research on immersive experiences in online environments for higher education has attributed a fundamental role to two distinct yet connected psychological…

Abstract

Recent research on immersive experiences in online environments for higher education has attributed a fundamental role to two distinct yet connected psychological phenomena: the feelings of being virtually present in the education environment, often simply called presence, and peak episodes of flow. The authors conceptually delimitate these two psychological facets of e-learners’ experiences and examine their interplay. The authors show how flow episodes are elicited by students’ sense of control over the online education environment, their attention being focussed on the learning tasks, and their feelings of being physically placed in the online education setting. Also, the interactivity created by the online education environment evokes an e-learner’s imagery, which in turn triggers presence feelings and episodes of flow. The authors further show that, although presence and flow are triggered by some common antecedents, they differ in the object of the individual’s immersion, and that presence feelings facilitate flow. Moreover, the authors provide practical recommendations for higher education institutions, policy makers and the academic and information and communication technology community involved in e-learning, to make sure e-learner experiences reach their fullest potential.

Details

The Future of Innovation and Technology in Education: Policies and Practices for Teaching and Learning Excellence
Type: Book
ISBN: 978-1-78756-555-5

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