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This paper used a novel technique, which is thermo-compression bonding, and Sn-1.0Ag-0.5Cu solder to form a full intermetallic compound (IMC) Cu₃Sn joints (Cu/Cu₃Sn/Cu joints). The purpose of the study is to form high-melting-point IMC joints for high-temperature power electronics applications. The study also investigated the effect of temperature gradient on the microstructure evolution and the growth behavior of IMCs.

In this paper, the thermo-compression bonding technique was used to form full Cu₃Sn joints.

Experimental results indicated that full Cu/Cu3Sn/Cu solder joints with the thickness of about 5-6 µm are formed in a short time of 9.9 s and under a low pressure of 0.016 MPa at 450°C by thermo-compression bonding technique. During the bonding process, Cu₆Sn₅ grew with common scallop-like shape at Cu/SAC105 interfaces, which was followed by the growth of Cu₃Sn with planar-like shape between Cu/Cu6Sn5 interfaces. Meanwhile, the morphology of Cu₃Sn transformed from a planar-like shape to wave-like shape until full IMCs solder joints were eventually formed during thermo-compression bonding process. Asymmetrical growth behavior of the interfacial IMCs was also clearly observed at both ends of the Cu/SAC105 (Sn-1.0Ag-0.5Cu)/Cu solder joints. Detailed reasons for the asymmetrical growth behavior of the interfacial IMCs during thermo-compression bonding process are given. The compound of Ag element causes a reduction in Cu dissolution rate from the IMC into the solder solution at the hot end, inhibiting the growth of IMCs at the cold end.

This study used the thermo-compression bonding technique and Sn-1.0Ag-0.5Cu to form full Cu₃Sn joints.

Due to its inexpensive production costs, low stress concentration and maintenance-friendliness, the adhesive bonded pipe joint is frequently utilized for pipe connection. However, further theoretical analysis is needed to understand the debonding failure mechanism of such bonded pipe joints under axial tension.

In this study, based on the bi-linear cohesive zone model, the integrated closed-form solutions were derived by considering the axial stiffness ratio and failure stage to determine the relative interfacial slip, interfacial shear stress and relationship of tension–displacement in the bonded pipe joint.

Additionally, solutions for the critical bonded length and the ultimate load capacity were put forth. Besides, the numerical study was conducted to verify the theoretical solutions regarding the load–displacement relationship. The interfacial shear stress distribution at different failure stages was presented to understand the interfacial shear stress transmission and debonding process. The effect of bonded length on the ultimate load and ductility of pipe joints was also discussed.

The findings in this study can give a reference for the design of bonded pipe joints in their actual engineering applications.

The aim of the paper is to study the feasibility of direct ultrasonic bonding between contact pad arrays on flexible printed circuit boards (FPCB) and rigid printed circuit boards (RPCB) at ambient temperature.

Metallization layers on the RPCB comprised Sn on Cu while the pads on the FPCB consisted of Au/Ni/Cu. Prepared RPCB and FPCB were bonded by ultrasound at ambient temperature using an ultrasonic frequency of 20 kHz, a power of 1,400 W, and 0.62 MPa of bonding pressure. The bonded samples were cross‐sectioned and the joints and microstructures were observed by Field Emission Scanning Electron Microscopy (FE‐SEM) and Energy Dispersive Spectroscopy (EDS). The soundness of the joints was evaluated by pull testing.

Robust bonding between FPCB and RPCB was obtained by bonding for 1.0 and 1.5 s. This result has confirmed that direct room temperature ultrasonic bonding of Au and Sn is feasible. At a longer bonding time of 3.0 s, cracks and voids were found in the joints due to excessive ultrasonic energy. The IMC (intermetallic compound) between the Sn layer and pads of the RPCB was confirmed as Cu₆Sn₅. On the FPCB side, Cu₆Sn₅ and Ni₃Sn₄ were formed by contact with the facing Sn coating, and mechanically alloyed Cu_0.81Ni_0.19 was found within the pads. Meanwhile, the strength of bonded joints between FPCB and RPCB increased with bonding time up to 1.5 s and the maximum value reached 12.48 N. At 3.0 s bonding time, the strength decreased drastically, and showed 5.75 N. Footprints from the fracture surfaces showed that bonding started from the edges of the metal pads, and extended to the pad centers as ultrasonic bonding time was increased.

Direct ultrasonic bonding with transverse vibration at ambient temperature between the surface layers of the pads of FPCB and RPCB has been confirmed to be feasible.

This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints by transient liquid phase bonding (TLPB).

TLPB is promising to assemble die-attaching packaging for power devices. In this study, porous Cu (P-Cu) foil with a distinctive porous structure and Sn-58Bi solder (SB) serve as the bonding materials for TLPB under a formic acid atmosphere (FA). The high surface area of P-Cu enables efficient diffusion of the liquid phase of SB, stimulating the wetting, spreading and formation of intermetallic compounds (IMCs).

The higher bonding temperature decreased strength due to the coarsening of IMCs. The longer bonding time reduced the bonding strength owing to the coarsened Bi and thickened IMC. Applying optimal bonding pressure improved bonding strength, whereas excessive pressure caused damage. The presence of a Pt catalyst enhanced bonding efficiency and strength by facilitating reduction–oxidation reactions and oxide film removal.

Overall, this study demonstrates the feasibility of low-temperature TLPB for Cu/SB/P-Cu/SB/Cu joints and provides insights into optimizing bonding strength for the interconnecting materials in the applications of power devices.

The purpose of this study is to investigate the effect of chip and substrate thickness on the thermal cycling reliability of flip chip joints assembled with anisotropic conductive adhesives (ACA) on FR‐4 substrates.

Four test lots were assembled with two substrates and two test chips. The thicknesses of the substrates were 710 and 100 μm and the thicknesses of the chips were 480 and 80 μm. To study the effect of the bonding pressure each test lot contained four test series bonded with four different bonding pressures. The reliability of the test samples was studied using a temperature cycling test.

The reliability of the test lots varied widely during the test. The test lot with a thin substrate and thin chip demonstrated considerably better reliability than the other test lots. In addition, the test lots had different failure mechanisms. After the test delamination was found in every test lot except the one assembled with the thin chip and the thin substrate.

The work shows that the thermal cycling reliability of ACA flip chip joints can be markedly increased by using thinned chips or reducing the thickness of the substrate.

This review paper aims to provide a better understanding of formulation and processing of anisotropic conductive adhesive film (ACF) material and to summarize the significant research and development work for the mechanical properties of ACF material and joints, which helps to the development and application of ACF joints with better reliability in microelectronic packaging systems.

The ACF material was cured at high temperature of 190°C, and the cured ACF was tested by conducting the tensile experiments with uniaxial and cyclic loads. The ACF joint was obtained with process of pre-bonding and final bonding. The impact tests and shear tests of ACF joints were completed with different aging conditions such as high temperature, thermal cycling and hygrothermal aging.

The cured ACF exhibited unique time-, temperature- and loading rate-dependent behaviors and a strong memory of loading history. Prior stress cycling with higher mean stress or stress amplitude restrained the ratcheting strain in subsequent cycling with lower mean stress or stress amplitude. The impact strength and adhesive strength of ACF joints increased with increase of bonding temperature, but they decreased with increase of environment temperature. The adhesive strength and life of ACF joints decreased with hygrothermal aging, whereas increased firstly and then decreased with thermal cycling.

This study is to review the recent investigations on the mechanical properties of ACF material and joints in microelectronic packaging applications.

The purpose of this paper is to investigate the effect of substrate material and thickness on the thermal cycling reliability of flip chip joints assembled with anisotropic conductive adhesives (ACA).

Four test lots are assembled using three different substrates. Two of the substrates are made of FR‐4. The thicknesses of these substrates are 600 and 100 μm. The third substrate is made of liquid crystal polymers (LCP) and is flexible. With the thicker FR‐4 substrate two test lots are assembled using both normal and two‐step bonding profiles to study how the bonding profile affects the deformation of the substrate. Four different bonding pressures are used to study the effect of pressure on reliability and the failure mechanism of the ACA joints. The reliability of the test samples is studied using a temperature cycling test.

The reliability of the test lot with the LCP substrate is considerably better than that of the test lots with the FR‐4 substrates. Additionally, the thinner FR‐4 substrate has better reliability than the thicker FR‐4 substrate. The failure mechanisms found varied among the test lots. The effect of the two‐step bonding process on the deformation of the substrate is found to be minor compared with the effect of the glass fibres.

The work shows that the thermal cycling reliability of ACA flip chip joints is markedly influenced by the thickness and material of the substrate. It is also seen that the substrate used influences the failure mechanisms formed during thermal cycling testing.

Fibre reinforced polymer composites (FRPs) are finding increasing usage in many industrial sectors. Adhesive bonding is often the most attractive joining technique for these materials in terms of structural efficiency and cost of manufacture. However, concerns regarding the lack of reliable design methods, the long term ageing behaviour and the difficulties in non‐destructive evaluation and repair of bonded joints has led to a reluctance to use adhesives in primary structures. DERA has been involved in the assessment of adhesive bonding for joining FRPs for many years. This paper focuses on investigations at DERA into the effects that environment and fatigue loading have on the performance of bonded composite joints, and briefly reviews current approaches to strength and lifetime prediction. It is seen that adhesively bonded composite joints can be significantly affected by the service environment, however, this is highly dependent on the joint type and materials involved.

Adhesively bonded joints are used in many fields, especially in the automotive, marine, aviation, defense and outdoor industries. Adhesive bonding offers advantages over traditional mechanical methods, including the ability to join diverse materials, even load distribution and efficient thermal-electrical insulation. This study aims to investigate the mechanical properties of adhesively bonded joints, focusing on adherends produced with auxetic and flat surfaces adhered with varying adhesive thicknesses.

The research uses three-dimensional (3D)-printed materials, polyethylene terephthalate glycol and polylactic acid, and two adhesive types with ductile and brittle properties for single lap joints, analyzing their mechanical performance through tensile testing. The adhesion region of one of these adherends was formed with a flat surface and the other with an auxetic surface. Adhesively bonded joints were produced with 0.2, 0.3 and 0.4 mm bonding thickness.

Results reveal that auxetic adherends exhibit higher strength compared to flat surfaces. Interestingly, the strength of ductile adhesives in auxetic bonded joints increases with adhesive thickness, while brittle adhesive strength decreases with thicker auxetic bonds. Moreover, the auxetic structure displays reduced elongation under comparable force.

The findings emphasize the intricate interplay between adhesive type, bonded surface configuration of adherend and bonding thickness, crucial for understanding the mechanical behavior of adhesively bonded joints in the context of 3D-printed materials.

The purpose of this paper is to develop an empirical relationship for predicting the strength of titanium to austenitic stainless steel fabricated by diffusion bonding (DB) process. Process parameters such as bonding pressure, bonding temperature and holding time play the main role in deciding the joint strength.

In this study, three-factors, five-level central composite rotatable design was used to conduct the minimum number of experiments involving all the combinations of parameters.

An empirical relationship was developed to predict the lap shear strength (LSS) of the joints incorporating DB process parameters. The developed empirical relationship was optimized using particle swarm optimization (PSO). The optimized value discovered through PSO was compared with the response surface methodology (RSM). The joints produced using bonding pressure of 14 MPa, bonding temperature of 900°C and holding time of 70 min exhibited a maximum LSS of 150.51 MPa in comparison with other joints. This was confirmed by constructing response graphs and contour plots.

Optimizing the DB parameters using RSM and PSO, PSO gives an accurate result when compared with RSM. Also, a sensitivity analysis is carried out to identify the most influencing parameter for the DB process.