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This is a national study which aims to determine the average waiting time in Malaysian public hospitals and to gauge the level of patient satisfaction with the waiting time. It also aims to identify factors perceived by healthcare providers which contribute to the waiting time problem.

Self‐administered questionnaires were the main method of data collection. Two sets of questionnaires were used. The first set solicited information from patients on their waiting time expereince. The second set elucidated information from hospital employees on the possible causes of lengthy waiting time. The questionnaires were administered in 21 public hospitals throughout all 13 states in Malaysia. A total of 13,000 responses were analysed for the patient survey and almost 3,000 were analysed for the employee survey.

The findings indicate that on average, patients wait for more than two hours from registration to getting the prescription slip, while the contact time with medical personnel is only on average 15 minutes. Employee surveys on factors contributing to the lengthy waiting time indicate employee attitude and work process, heavy workload, management and supervision problems, and inadequate facilities to be among the contributory factors to the waiting time problem.

Public healthcare in Malaysia is in a state of “excess demand”, where demand for subsidised healthcare far outstrips supply, due to the large fee differential between public and private healthcare services. There is a need for hospital managers to reduce the boredom faced by patients while waiting, and to address the waiting time problem in a more scientific manner, as has been carried out in other countries through simulation and modelling techniques.

Healthcare organisations are keen to address their waiting time problem. However, not much research has been carried out in this area. The study thus fills the lacuna in waiting time studies in healthcare organisations.

This study aims to investigate the effect of temperature applied at the initial deposition of Aluminium Nitride (AlN) thin-film on a silicon substrate by high-power impulse magnetron sputtering (HiPIMS) technique.

HiPIMS system was used to deposit AlN thin film at a low output power of 200 W. The ramping temperature was introduced to substrate from room temperature to maximum 100°Cat the initial deposition of thin-film, and the result was compared to thin-film sputtered with no additional heat. For the heat assistance AlN deposition, the substrate was let to cool down to room temperature for the remaining deposition time. The thin-films were characterized by X-ray diffraction (XRD) and atomic force microscope (AFM) while the MIS Schottky diode characteristic investigated through current-voltage response by a two-point probe method.

The XRD pattern shows significant improvement of the strong peak of the c-axis (002) preferred orientation of the AlN thin-film. The peak was observed narrowed with temperature assisted where FWHM calculated at 0.35° compared to FWHM of AlN thin film deposited at room temperature at around 0.59°. The degree of crystallinity of bulk thin film was improved by 28% with temperature assisted. The AFM images show significant improvement as low surface roughness achieved at around 0.7 nm for temperature assisted sample compares to 3 nm with no heat applied.

The small amount of heat introduced to the substrate has significantly improved the growth of the c-axis AlN thin film, and this method is favorable in the deposition of the high-quality thin film at the low-temperature process.

The purpose of this paper is to investigate the effect of carbon nanotube (CNT) addition on microstructure, interfacial intermetallic compound (IMC) layer and micromechanical properties of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint under blast wave condition. This work is an extension from the previous study of microstructural evolution and hardness properties of Sn-Ag-Cu (SAC) solder under blast wave condition.

SAC/CNT solder pastes were manufactured by mixing of SAC solder powder, fluxes and CNT with 0.02 and 0.04 by weight percentage (Wt.%) separately. This solder paste then printed on the printed circuit board (PCB) with the copper surface finish. Printed samples underwent reflow soldering to form the solder joint. Soldered samples then exposed to the open field air blast test with different weight charges of explosives. Microstructure, interfacial IMC layer and micromechanical behavior of SAC/CNT solder joints after blast test were observed and analyzed via optical microscope, field emission scanning microscope and nanoindentation.

Exposure to the blast wave induced the microstructure instability of SAC305/Cu and SAC/CNT/Cu solder joint. Interfacial IMC layer thickness and hardness properties increases with increase in explosive weight. The existence of CNT in the SAC305 solder system is increasing the resistance of solder joint to the blast wave.

Response of micromechanical properties of SAC305/CNT/Cu solder joint has been identified and provided a fundamental understanding of reliability solder joint, especially in extreme conditions such as for military applications.

In retrospectives on Brunei’s first feature film Gema Dari Menara (1968), commentators have tended to focus on either its historical representation of Brunei’s booming post-curfew years in the late 1960s as ‘a time capsule of Brunei’s lost pop history’, or the film’s propagandistic nature for Da’wah (religious propagation). In this paper, however, I will concentrate my observations on the aesthetic values of the film itself, including the narrative structure, plot design, camerawork, characterisation and character relationships, as well as the resulting artistic effects manifested by these production elements as a whole.

Putting all the propagandistic elements aside, I would like to argue that Gema Dari Menara, as a family melodrama, is carefully constructed and propelled by the above-mentioned filmmaking techniques. The drama not only tells the story of an intense familial conflict revolving around the theme of faith rooted in the Bruneian tradition, it also implies the necessity of an internal negotiation between the predominant Islamic ideology and the increasingly secularised Bruneian civil society at the time. While the implied negotiation may have been unintended or subconscious in the original making of the film, it is well-balanced and reflective of the political and social reality of Brunei as a British Protectorate in the late 1960s, foreshadowing the current coexistent status quo of the dominance and sacredness of MIB and the secular popular culture in Brunei.

This paper argues that the film Gema Dari Menara produced in 1968 reflects Brunei’s attempt towards constructing a Brunei Malayness as a national identity. During the early twentieth century, the colonial powers particularly in the Peninsula, tried to help establish a sense of unity among the Malays. Although it was not clear whether this was entirely successful, it is possible that the presence of colonial powers had some influence towards fuelling Malays to be more proactive in their own identity construction. After the British began to leave Brunei, the nation-state can be perceived to have intensified its efforts in creating a national identity as a way to unify its people, including the preservation and reconstruction of its Malayness. A close analysis of the characters in the film will reveal portrayals of ideals of Malayness and how Islamic values penetrate Malayness in the Bruneian context. The main character Azman is arguably the epitome of ideal Malayness, as his behaviour, his way of thinking as well as the way he dresses complement what Brunei aspires to for its people, whereas his younger siblings’ partying and wild behaviour are a cautionary tale. These findings will hopefully provide insights for further studies on the impact of the British administration on the Brunei Malay culture or identity formation in Brunei as a postcolonial state.

This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.

The fine-pitch stencil used in this work is fabricated by electroform process and subsequently nano-coated using the PVD process. Stencil printing process was then performed to print the solder paste onto the printed circuit board (PCB) pad. The solder paste release was observed by solder paste inspection (SPI) and analyzed qualitatively and quantitatively. The printing cycle of up to 80,000 cycles was used to investigate the life span of stencil printing.

The finding shows that the performance of stencil printing in terms of solder printing quality is highly dependent on the surface roughness of the stencil aperture. PVD-coated stencil aperture can prolong the life span of stencil printing with an acceptable performance rate of about 60%.

Stencil printing is one of the important processes in surface mount technology to apply solder paste on the PCB. The stencil’s life span greatly depends on the type of solder paste, stencil printing cycles involved and stencil conditions such as the shape of the aperture, size and thickness of the stencil. This study will provide valuable insight into the relationship between the coated stencil wall aperture via PVD process on the life span of fine-pitch stencil printing.

The purpose of this paper is to discuss the effect of a blast wave on the microstructure, intermetallic layers and hardness properties of Sn0.3Ag0.7Cu (SAC0307) lead-free solder.

Soldered samples were exposed to the blast wave by using trinitrotoluene (TNT) explosive. Microstructure and intermetallic layer thickness were identified using Alicona ® Infinite Focus Measurement software. Hardness properties of investigated solders were determined using a nanoindentation approach.

Microstructure and intermetallic layers changed under blast wave condition. Hardness properties of exposed solders decreased with an increase in the TNT explosive weight.

Microstructural evolution and mechanical properties of the exposed solder to the blast wave provide a fundamental understanding on how blast waves can affect the reliability of a solder joint, especially for military applications.

The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint according to the formulation of solder paste because of different types of fluxes.

Solder pastes were prepared by mixing SAC305 solder powder with different flux and different wt.% of carbon nanotube (CNT). Fourier transform infrared spectroscopy was used to identify functional groups from different fluxes of as-formulated solder paste. The solder pastes were then subjected to stencil printing and reflow process. Solderability was investigated via contact angle analysis and the thickness of cross-sectionally intermetallic layer.

It was found that different functional groups from different fluxes showed different physical behaviour, indicated by contact angle value and IMC layer thickness. “Aromatic contain” functional group lowering the contact angle while non-aromatic contain functional group lowering the thickness of IMC layer. The higher the CNT wt.%, the lower the contact angle and IMC layer thickness, regardless of different fluxes. Relationship between contact angle and IMC layer thickness is found to have distinguished region because of different fluxes. Thus it may be used as guidance in flux selection for solder paste formulation.

However, detail composition of the fluxes was not further explored for the scope of this paper.

The quality of solder joint of SAC305/CNT/Cu system, as indicated by contact angle and the thickness of IMC layer formation, depends on existence of functional group of the fluxes.

Reflow solder joint quality is significantly affected by the ability of the solder to perfectly fill pad space and retain good solder joint shape. This study aims to investigate solder joint quality by quantitatively analyzing the stencil printing-deposited solder volume, solder height and solder coverage area.

The dispensability of different solder paste types on printed circuit board (PCB) pads using different stencil aperture shapes was evaluated. Lead-free Type 4 (20–38 µm particle size) and Type 5 (15–25 µm particle size) solder pastes were used to create solder joints according to standard reflow soldering.

The results show that the stencil aperture shape greatly affects the solder joint quality as compared with the type of solder paste. These investigations allow the development of new strategies for solving solder paste stencil printing issues and evaluating the quality of solder joints.

The reflow soldering process requires the appropriate selection of the stencil aperture shape according to the PCB and the solder paste according to the particle-size distribution of the solder alloy powder. However, there are scarce studies on the effects of stencil aperture shape and the solder alloy particle size on the solder paste space-filling ability.

The purpose of this paper is to identify the factors influencing intention of Muslim Filipinos to give zakat on employment income.

The study used the extended theory of planned behaviour – an extension of the theory of reasoned action – to investigate the factors influencing intention to give zakat. The theory introduces six variables (i.e. attitude, perceived behavioural control, injunctive norm, descriptive norm, moral norm and past behaviour) in predicting the intention to give zakat. Totally, 450 questionnaires were distributed to the respondents in a Muslim-majority area (i.e. Marawi City), and 384 cases were deemed usable. The data have been analysed using multiple regression analysis.

This paper finds that attitude, descriptive norm and moral norm have a positive relationship with the intention to give zakat. Meanwhile, perceived behavioural control, injunctive norm and past behaviour are found to have insignificant influence over intention. However overall, the study supports the extension of the theory of planned behaviour which accounts for 53 per cent of the variance in intention.

This paper provides new insights on factors influencing the intention to give zakat on a non-Muslim majority country setting where no zakat institution operates. This paper also used the extended theory of planned behaviour on zakat compliance literature.