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Article
Publication date: 18 May 2010

Axel Bindel, Paul Conway, Laura Justham and Andrew West

The purpose of this paper is to present an update of and the latest results from work on a project aimed at monitoring electronic products during the whole life cycle with…

Abstract

Purpose

The purpose of this paper is to present an update of and the latest results from work on a project aimed at monitoring electronic products during the whole life cycle with embedded wireless components.

Design/methodology/approach

Business processes of the electronic manufacturing supply chain were analysed. A business case and the system opportunities for life cycle monitoring, based on embedded wireless components system were developed. Radio frequency identification (RFID) assembly technology was adapted for the integration of components into a multi‐layer printed circuit board (PCB).

Findings

By storing product‐related information into electronic products, tracing of components, monitoring of processes, operations and costs, environmentally optimised recycling can be enhanced.

Research limitations/implications

The research undertaken so far relates to the embedding of RFID tags into PCBs. Wireless components with more processing power will be used in the next project phase.

Originality/value

The paper details how wireless components can be embedded into multi‐layer PCBs and how a business case for a life cycle monitoring system can be established.

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43

Abstract

Details

Circuit World, vol. 37 no. 2
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 14 September 2012

Martin Goosey

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254

Abstract

Details

Soldering & Surface Mount Technology, vol. 24 no. 4
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 23 August 2011

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368

Abstract

Details

Circuit World, vol. 37 no. 3
Type: Research Article
ISSN: 0305-6120

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