Search results

The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.

A newly developed system with chip or cylindrical components is presented. The article describes a practical solution of connection with 0.603 and mini-metal electrode leadless face (MELF) surface mount device (SMD) resistors.

A new method of rigid solder connection for electronic modules is presented. This system is original and patented.

This solution is not used yet. Testing of a new system is executed now.

This article shows a real and original construction with chip and cylindrical chip components.

When the new Internepcon Production Show and Conference opens its doors on 8th April 1986, at the NEC Birmingham, it will be the UK's first event to concentrate its product profile and conference sessions on electronics production line technology. To ensure that this exciting show is of even greater benefit to the visitors, the emphasis will be on production line technology in action, with many of the products actually operating on the stands.