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Automotive electronics, after 1995, will be similar to aerospace electronics because there is a demand for low weight and volume together with very high speed and ultra‐high reliability. What is different is that automotive electronics must achieve all those properties at very low cost. It will be shown that when using ASIC chips the chip area is determined by the number of pins instead of the number of components of the active circuit. As ASIC technology proceeds towards line widths in the submicrometre range, the ratio of active Si area to total chip area is becoming much less than 1. This means that on the ASIC chip there is Si area which is ‘empty’. This ‘empty’ Si area can be used for designing self‐test circuits and redundant functions on the ASIC chip at a cost penalty slightly higher than the design cost. It will also be shown that these ASICs can work in the order of 100 MHz at the chip level. Such ASIC chips will therefore have a very high reliability at the chip level due to the inherent properties of the Si and the built‐in redundancy. At the same time they can work at very high speed. From a performance point of view the best solution should be a highly miniaturised packaging technology. With self‐test circuits on the chip, there is a good correlation between wafer test and final test. Therefore, from an economical point of view, working with chips will then have an economical advantage compared with working with packaged circuits. From a reliability point of view it will be shown that the solder joints are the limiting factor. A critical review is presented of the reliability problems plaguing the SMD and soldering technology of today. It will be shown that, if SMD technology is to meet the reliability demands in a future automotive environment, it will have to have solder joint failure rates better than 30 ppm over the life, 17 years, in automotive applications. The conclusion is that a multi‐ASIC chip approach has the best potential as the solution for the future, post 1995, automotive electronics, provided there is a highly reliable chip interconnection technology available at that time.

As part of their growth strategy, many firms choose to expand internationally. Such expansion is an especially important decision for small- and medium-sized enterprises (SMEs). These SMEs are vital to China's economy and have grown in importance since the reform and opening-up, measured in terms of size, number, financial status, or profitability. In addition, the Chinese electronics sector plays an important role in the economy. This inquiry explores the internationalisation behaviour of 50 Chinese electronics SMEs. The findings are presented and implications drawn for future research, along with those for policy makers and practitioners.

This paper aims to examine the current state of reverse supply chain management (RSCM) initiatives in several Turkish industries.

This study is based on an exploratory research regarding RSCM activities of Turkish automotive, white goods, electric/electronics, and furniture industries. The sample consists of all the companies included in the Top‐500 Industrial Enterprises List of The Assembly of the Istanbul Chamber of Industry (ISO).

The research findings show that the RSCM initiatives in the considered industries are still in a very early stage. Companies' involvement in product returns is mostly due to the legislative liabilities, and system inadequacies are emphasized as the most important reason for not being able to implement an efficient RSCM.

This paper investigates the reverse supply chain practices of selected industries in Turkey and aims to enable researchers to use this study as a building block in understanding these practices and related problems. The limitation of this study is to solely include the medium and large‐sized companies in the industries.

Reverse supply chain operations contribute to the economic sustainability by reducing waste and saving energy and material. In this research, an empirical study in the electronics, white goods, automotive and furniture industries is conducted, and potential research opportunities are discussed to streamline reverse supply chain activities in the industries. Hence, this study can be viewed as an attempt to increase the level of awareness on reverse supply chain issues.

No field study has been conducted to analyze reverse supply chain activities of the industries in Turkey. This research is a pioneering study and will provide a benchmark for the various research activities on related topics.

Experts claim over 50% of sensor applications are currently served by silicon‐sensor technology.

ISHM invites papers for the above Conference, to be held on 29–31 May 1991 in Rotterdam, The Netherlands. Papers should cover areas such as: design, manufacturing, packaging and interconnection, materials and processing, applications, reliability, components, new technologies, marketing and economics, optoelectronics. Summaries should be in English, length 200–300 words. The deadline for receipt of summaries is 30 September 1990. (For full details, see announcement on pp. 54–55.)

Global value chains (GVCs) have become increasingly influential in determining the patterns of international trade and foreign direct investment (FDI) and in providing growth opportunities in Asia and the Pacific while small- and medium-sized enterprises (SMEs) have been an engine of economic development. The purpose of this paper is to provide effective development strategies and relevant policy approaches to facilitate dynamic insertion of SMEs into GVCs.

This paper was developed based on various Economic and Social Commission for Asia and the Pacific works in the fields of the development of SMEs and GVCs in Asia and the Pacific. Sectoral case studies on agribusiness, garment/apparel, automotive and electronics illustrate SMEs’ effective integration into GVCs.

SMEs face multiple obstacles and challenges which may limit the benefits derived from the development of GVCs in Asia and the Pacific. Policymakers are suggested to design and implement appropriate strategies and polices in order to facilitate the development of SMEs under the ongoing globalization.

This paper is mainly based on existing policy papers which were developed by the United Nations Secretariat, its specialized agencies and others. Further empirical and policy studies are expected to be conducted in order to deepen the understanding of the present topics and to come up with practical policy options.

Policymakers are suggested to consider strategies and policy options recommended by this paper for their works on SME development and trade and investment promotion.

This is the first policy paper which proposes a comprehensive framework for SMEs’ effective participation in GVCs, specifically suggesting seven approaches, namely, SME development; trade policy; behind-the-border and cross-border trade facilitation; regional integration frameworks; FDI promotion; SME clusters; and national innovation system.