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Soldering & Surface Mount Technology, vol. 11 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 March 1999

39

Abstract

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Circuit World, vol. 25 no. 1
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 1 February 1987

A. Angstenberger

Both the need for the introduction of automated optical inspection (AOI) systems in the PCB manufacturing process and the requirements, technically and on economic…

Abstract

Both the need for the introduction of automated optical inspection (AOI) systems in the PCB manufacturing process and the requirements, technically and on economic grounds, placed on such equipment are discussed in detail. Furthermore, emphasis is placed on the description of commonly used AOI concepts. The paper ends with a check list containing the most important questions concerning any system's capabilities.

Details

Circuit World, vol. 13 no. 3
Type: Research Article
ISSN: 0305-6120

Content available
Article
Publication date: 1 December 2004

62

Abstract

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Microelectronics International, vol. 21 no. 3
Type: Research Article
ISSN: 1356-5362

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Content available
Article
Publication date: 1 August 2000

42

Abstract

Details

Soldering & Surface Mount Technology, vol. 12 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 1 March 2002

Alex Alaluf and David Birnbaum

Examines the use of laser‐induced fluorescence for the inspection of printed circuit boards. Discusses how it works, how it compares with other inspection options and what…

Abstract

Examines the use of laser‐induced fluorescence for the inspection of printed circuit boards. Discusses how it works, how it compares with other inspection options and what advantages it offers, particularly for the inspection of low‐contrast materials. Concludes that laser‐based automated optical inspection (AOI) has major potential advantages compared with white‐light AOI equipment.

Details

Circuit World, vol. 28 no. 1
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 27 November 2007

P.I. Nicholson and P. Wallace

To present an overview of the research and development carried out by an EC Framework 6 part funded consortium, known as MICROSCAN, for the implementation of an in‐line…

Abstract

Purpose

To present an overview of the research and development carried out by an EC Framework 6 part funded consortium, known as MICROSCAN, for the implementation of an in‐line PCB inspection prototype system that is capable of offering comprehensive defect detection.

Design/methodology/approach

Four non‐destructive testing inspection modules based on digital radiography (X‐ray) inspection, thermal inspection, automatedoptical inspection and acoustic inspection have been integrated to form a combined inspection system.

Findings

A proof in principle in‐line PCB inspection system, utilising four different inspection techniques, has been developed and demonstrated. The system is based on a generic mechanical, electrical and software communications platform culminating in a flexible system that enables the inspection modules to be used separately, together or interchanged to give the best results in terms of inspection coverage and inspection throughput.

Research limitations/implications

In its current embodiment, the prototype is suited to inspection of high‐return PCBs, particularly those used in medical and aerospace products, rather than high‐throughput PCB production work. The X‐ray inspection module is the slowest inspection technique and combining four different inspection techniques reduces the inspection throughput of the whole system to that of the X‐ray inspection module. Further, trials and investigations need to be carried out to improve inspection throughput.

Originality/value

The novelty of the system is that it is the first time that four inspection techniques have been combined to give the capability of 100 per cent defect coverage.

Details

Circuit World, vol. 33 no. 4
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 4 August 2021

Yuqiao Cen, Jingxi He and Daehan Won

This paper aims to study the component pick-and-place (P&P) defect patterns for different root causes based on automated optical inspection data and develop a root cause…

Abstract

Purpose

This paper aims to study the component pick-and-place (P&P) defect patterns for different root causes based on automated optical inspection data and develop a root cause identification model using machine learning.

Design/methodology/approach

This study conducts experiments to simulate the P&P machine errors including nozzle size and nozzle pick-up position. The component placement qualities with different errors are inspected. This study uses various machine learning methods to develop a root cause identification model based on the inspection result.

Findings

The experimental results revealed that the wrong nozzle size could increase the mean and the standard deviation of component placement offset and the probability of component drop during the transfer process. Moreover, nozzle pick-up position can affect the rotated component placement offset. These root causes of defects can be traced back using machine learning methods.

Practical implications

This study provides operators in surface mount technology assembly lines to understand the P&P machine error symptoms. The developed model can trace back the root causes of defects automatically in real line production.

Originality/value

The findings are expected to lead the regular preventive maintenance to data-driven predictive and reactive maintenance.

Details

Soldering & Surface Mount Technology, vol. 34 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 8 March 2022

Kumaraendran Purushothaman and Rosmaini Ahmad

This paper aims to present the development of an automated inspection system (AIS) using an image-based analysis mechanism, called i-AIS. The development process of i-AIS…

Abstract

Purpose

This paper aims to present the development of an automated inspection system (AIS) using an image-based analysis mechanism, called i-AIS. The development process of i-AIS used the Design Six Sigma (DSS) methodology. The steps of define, measure, analyze, design and verify (DMADV) are applied and integrated with specific analyses techniques of the quality function deployment (QFD), design failure mode effect analysis (DFMEA) and theory of inventive problem solving (TRIZ). The production process of adhesive tape is the focused case study in this research project, motivated by the high product defect rate complained by customers.

Design/methodology/approach

The development process of i-AIS was divided into five standard steps based on the DSS methodologies of DMADV. One of the key processes in this development was to systematically identify the right and intended features of i-AIS. This was carried out based on the application of the QFD technique. Another important process was to further investigate the possible causes of i-AIS failure, to function as intended. This investigative process was carried out based on the DFMEA technique, while the solution to minimize the risk of the identified failures was obtained from the TRIZ method. The final prototype of i-AIS was then presented in the design step.

Findings

Verification of the i-AIS prototype revealed its operation at an optimally intended mode that fulfilled the requirements of internal customers. Verification results also revealed that the sigma level has improved from 3.87 to 4.33. Meanwhile, the defect reduction rate is improved to 74.4% and downtime rate also recorded a significant improvement at 80.7% of reduction.

Research limitations/implications

The presented research work is carried out based on a customized case study. Although the proposed methodology can be applied to others cases towards design-based solution, some modifications maybe required based on to the unique features of the case study under consideration.

Practical implications

The presented research project indicated that the proposed methodology was successful to facilitate a structured and systematic process towards defect identification, classification, evaluation and generation of a solution.

Originality/value

The paper presents the development process of an AIS by considering comprehensive managerial aspects that are currently absent in the literature. An integrated DSS structure is proposed to systematically guide the development of i-AIS. The related managerial aspects such as identification of critical defects problem, customer requirement mapping, prototype design analysis and comparison measurements before and after i-AIS installation are considered in this research project.

Details

International Journal of Lean Six Sigma, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 2040-4166

Keywords

Article
Publication date: 1 March 1988

D. Thompson and T. Stroebel

Electronic packaging technologies, such as pin grid arrays, increasingly small pitch surface mount, and double‐sided assemblies are all aimed towards the highest possible…

Abstract

Electronic packaging technologies, such as pin grid arrays, increasingly small pitch surface mount, and double‐sided assemblies are all aimed towards the highest possible product density, with improved performance. The gap between inspection effectiveness and advances made in packaging technologies is becoming larger. As efforts proceed, to learn more about critical factors influencing reliability of solder joints, it is prudent to ensure that printed wiring assembly (PWA) design rules evolve to permit the broadest range of anticipated automated inspection requirements. The range of automated inspection technologies can all be made more effective through careful design of electronics for inspection. Significant opportunities lie in both PWA layout and design, as well as electronic component design, tolerancing, and standardisation. Many inspection issues are shared, but with increased recognition of digital radiography's unique capabilities; this discussion will emphasise X‐ray inspection issues.

Details

Circuit World, vol. 14 no. 4
Type: Research Article
ISSN: 0305-6120

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