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Date: 26 October 1994 Venue: The Regency Hotel, Shirley, Solihull, West Midlands This conference will provide a forum for discussions on recent advances in high technology joining processes such as soldering, brazing, diffusion and adhesive bonding. Papers will cover a wide range of scientific and technical developments and latest advances in production techniques, particularly those which may involve environmental considerations, and highlight the technological advances being made as we approach the 21st century.

Although the subject discussed at this meeting is one in which I have a personal and commercial interest, I will try to report the meeting in an unbiased manner. I must, however, point out that I asked only one question at the meeting and that was when one of the speakers compared solder cream to sand. I believe this type of comment shows a complete misunderstanding of the sophisticated material that is today's solder cream and especially of solder cream designed for ‘fine‐pitch soldering’.

I was an invited speaker to the ISHM‐Benelux meeting. As I arrived early, I also sat in on the committee meeting as an observer. Jos B. Peeters was the outgoing president and the incoming committee was widened to about 15 members compared with the previous 6. Following the unanimous election of all those nominated, the committee reconvened and elected Mr Kwikkers as the new president of ISHM‐Benelux. He is a professor at the Technische Hogeschole in Delft.

Thirty‐six people attended this SMART Group Seminar at the Bowler Hat Hotel in Birkenhead, Merseyside, on 20 February 1990. The technical programme in the morning comprised five talks:

This year's Internepcon Production Exhibition and Conference (22–24 March 1988, National Exhibition Centre, Birmingham) promises to be the biggest ever in the event's twenty‐one year history and will host a number of special new features.

A flip chip on board technology fully compatible with current PCB facilities is reported. It used reflow soldering for chip attachment. It required electroless nickel/immersion gold finishing on the board pads as well as on the chip pads. A no‐clean solder paste was printed on the boards before chip placement. Thus, there was no requirement for solder deposition on the chip side. Assembly tests with various chip formats proved the feasibility of this technology. X‐ray inspection and cross‐sectioning revealed the good shape and alignment of the reflowed solder joints. The reliability of underfilled assemblies was studied by ‐40 to 125°C thermal cycling. This approach is especially suitable for prototype or low volume productions as it eliminates the solder bumping process on the chip side, which is usually performed on the wafer level.