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The opportunity for mutual benefit across Europe to develop low‐cost MCM technologies arose from recognition of the scientific skills and design and prototyping capabilities in organic and inorganic circuits in countries of Central Europe. As a result, the leading research institutions and small/medium‐size enterprises of Hungary, Romania and Slovenia together with relevant institutions of the UK and Belgium proposed and received approval for a European Union INCO‐Copernicus project “Cheap multichip models” to establish fast prototyping low cost multichip module (MCM) technology facilities. The project commenced in May 1997.

‘The Choice between Chip and Wire and High Density Surface Mount Packages (MCM‐X, COB, etc.)’ was the title of the above event. One of a regular series held by ISHM‐France, this technical seminar was attended by over 100 members and non‐members of ISHM who were eager to hear of the latest developments in the field of multichip modules. The eight papers presented are summarised below:

‘Soldering and Cleaning in Electronics’ international conference, including an exposition, took place in Brno on 12–13 October 1993. The conference was organised by SMT‐Info, together with the ISHM‐Czech and Slovak Chapter. The purpose of this common action was to bring together the professionals in surface mount technology and thick film technology. In the framework of the conference, in which 130 home and foreign delegates participated, the annual meeting of the ISHM‐Czech and Slovak Chapter took place.