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The paper aims to study the friction behaviour of alumina and zirconia against steel DIN‐Ck45K under water lubricated conditions.

The tests were performed with a contact stress of 3.5 MPa and a constant sliding velocity of 0.5 m/s for 5.35 km of sliding distance, using a pin‐on‐disk tribometer.

The friction coefficient and the energy dissipated in the contact were considered in this comparative study. The zirconia ceramic present less friction coefficient and contact temperature than alumina ceramic. The zirconia present about 70 per cent of the energy dissipated against when compared with the alumina. Abrasive scars of the surface ploughing were observed on every wear track for two pairs in contact.

This research used only one test condition.

The paper describes the tribological conditions used and a new methodology based on the energy dissipated in the contact is proposed.

Advanced ceramics such as alumina are widely in use in the design of components for high engineering applications mainly because of their high wear resistance, high compressive strength, low specific density and high temperature capability. Processing and manufacturing of pure alumina products is a difficult and expensive task. Therefore, additional compounds are added to alumina to achieve a more complex component design and to minimise the product processing and manufacturing costs. This paper examines the effects of speed, load values and the addition of Cr₂O₃, SiO₂ and MnO₂ compounds on the friction and wear behaviour of alumina ceramic. Wear tests for alumina and alumina samples containing w1.5% Cr₂O₃ w3% SiO₂ and w1.5% MnO₂ compounds was carried out on a pin‐on‐disc machine. Tribological tests were under 2.5, 5 and 10N loads and at 0.5, 0.75 and 1m/Sec speeds. The specific wear rates were deduced from mass loss. The wear rate for alumina without additional compounds was in the order of 10^–8 to 10^–7mm²/N, while the wear rate values for alumina with additional compounds were in the order of 10^–6. Moreover, the wear rate showed more sensitivity to the applied load, particularly at low sliding speeds. Furthermore, it is concluded that a 20 per cent decrease in the sintering temperature resulted in 300 per cent increase in the specific wear rate of alumina ceramic material.

The purpose of this paper is to focus on a description of reliable bonding technique of zero-shrink low-temperature co-fired ceramic (LTCC) and alumina ceramics. LTCC is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the zero-shrink LTCC substrates, it is now possible to bond unfired substrates with other fired substrates, for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for usage in heating elements or packaging.

The test structure contains a thick-film pattern for verification of the compatibility of the bonding process. We have used two methods for bonding the substrates: cold chemical lamination (CCL) and thermo compression method, using a dielectric thick-film paste as the adhesive. Optical microscopy, scanning electron microscopy and electric testing of the screen-printed patterns were used for verification of the bonding quality.

The thermo-compression method gave poor results in comparison with the CCL method. The best quality of lamination was achieved at room temperature combined with low pressure for both types of bonding materials. In addition, a possibility of using this bonding method for sensor fabrication was investigated. The ceramic pressure sensor samples with a cavity were created.

The possibility of bonding two different ceramic materials was investigated. A new approach to ceramic bonding showed promising results with possible use in sensors.

The purpose of this paper is to assess a new powder metallurgy process to make alumina parts through indirect selective laser sintering (SLS). Density measurements, some geometrical assessments and scanning electron microscopy (SEM) microstructural analyses are performed after each stage of the process, allowing an objective overview to be provided of the challenges and possibilities for the processing of high density technical ceramic parts through SLS of ball milled alumina/polyamide powder agglomerates.

The powder production by ball milling, SLS, cold isostatic pressing (CIP) or quasi isostatic pressing (QIP), debinding and sintering (FS) stages of the powder metallurgy process were sequentially investigated.

Alumina parts with a density up to 94.1 per cent could be produced by a powder metallurgy process containing an SLS step. Microstructural investigation of the sintered samples reveals an alumina matrix with a grain size of ∼5 μm and two different kinds of pore morphologies, i.e. long elongated pores, which stem from the intergranular spacings during SLS, and intermediate pores, which likely originate from larger polyamide agglomerates in the ball milled powder. Also, QIPing at elevated temperatures is found to be a promising alternative for CIPing at room temperature to increase the final part density.

Cracks, long elongated pores and intermediate pores remained in the sintered parts. Homogenizing the microstructure of the parts through optimizing the composite starting powder, the deposition during SLS, the SLS parameters and QIPing parameters is essential to overcome these limitations.

Homogenizing the starting powder mixture and the microstructure of the SLS material is the key issue for producing ceramic parts through indirect SLS.

Indirect SLS of ceramics has hardly been reported and the combined use of SLS and QIPing is innovative in the field of indirect SLS of ceramics.

The purpose of this study is to prepare a state-of-the-art review on advanced ceramic materials including their fabrication techniques, characteristics, applications and wettability.

This review paper presents the various types of advanced ceramic materials according to their compounding elements, fabrication techniques of advanced ceramic powders as well as their consolidation, their characteristics, applications and wetting properties. Hydrophobic/hydrophilic properties of advanced ceramic materials are described in the paper with their state-of-the-art application areas. Optical properties of fine ceramics with their intrinsic characteristics are also presented within. Special focus is given to the brief description of application-based manipulation of wetting properties of advanced ceramics in the paper.

The study of wetting/hydrophobicity/hydrophilicity of ceramic materials is important by which it can be further modified to achieve the required applications. It also makes some sense that the material should be tested for its wetting properties when it is going to be used in some important applications like biomedical and dental. Also, these advanced ceramics are now often used in the fabrication of filters and membranes to purify liquid/water so the study of wetting characteristics of these materials becomes essential. The optical properties of advanced ceramics are equally making them suitable for many state-of-the-art applications. Dental, medical, imaging and electronics are the few sectors that use advanced ceramics for their optical properties.

This review paper includes various advanced ceramic materials according to their compounding elements, different fabrication techniques of powders and their consolidation, their characteristics, various application area and hydrophobic/hydrophilic properties.

This paper gives a bibliographical review of the finite element methods (FEMs) applied to the analysis of ceramics and glass materials. The bibliography at the end of the paper contains references to papers, conference proceedings and theses/dissertations on the subject that were published between 1977‐1998. The following topics are included: ceramics – material and mechanical properties in general, ceramic coatings and joining problems, ceramic composites, ferrites, piezoceramics, ceramic tools and machining, material processing simulations, fracture mechanics and damage, applications of ceramic/composites in engineering; glass – material and mechanical properties in general, glass fiber composites, material processing simulations, fracture mechanics and damage, and applications of glasses in engineering.

The ability of light‐weight all fiber‐reinforced polymer‐matrix composite armor and hybrid composite‐based armor hard‐faced with ceramic tiles to withstand the impact of a non‐Armor‐ Piercing (non‐AP) and AP projectiles is investigated using a transient non‐linear dynamics computational analysis. The results obtained confirm experimental findings that the all‐composite armor, while being able to successfully defeat non‐AP threats, provides very little protection against AP projectiles. In the case of the hybrid armor, it is found that, at a fixed overall areal density of the armor, there is an optimal ratio of the ceramic‐to‐composite areal densities which is associated with a maximum ballistic armor performance against AP threats. The results obtained are rationalized using an analysis based on the shock/blast wave reflection and transmission behavior at the hard‐face/air, hard‐face/backing and backing/air interfaces, projectiles’ wear and erosion and the intrinsic properties of the constituent materials of the armor and the projectiles.

This paper presents the results of an investigation into alternative substrate materials to alumina and the associated techniques necessary to utilise them in microwave integrated circuits (MICs). The major driving force for this work was to reduce MIC processing costs without significantly degrading the RF performance. Different glass ceramic systems were assessed and 6–18 GHz gain modules were produced on the most promising of these materials. One glass ceramic material, CMA6, with a dielectric content of 6 • 4, showed a comparable measured gain to that obtained for alumina circuits between 6 and 15 GHz. Cost analysis indicated that, with the reductions in material costs and yield improvements on using glass ceramic substrates, a cost saving of approximately 12% per module is feasible.

Ceramic materials and glasses have become important in modern industry as well as in the consumer environment. Heat resistant ceramics are used in the metal forming processes or as welding and brazing fixtures, etc. Ceramic materials are frequently used in industries where a wear and chemical resistance are required criteria (seals, liners, grinding wheels, machining tools, etc.). Electrical, magnetic and optical properties of ceramic materials are important in electrical and electronic industries where these materials are used as sensors and actuators, integrated circuits, piezoelectric transducers, ultrasonic devices, microwave devices, magnetic tapes, and in other applications. A significant amount of literature is available on the finite element modelling (FEM) of ceramics and glass. This paper gives a listing of these published papers and is a continuation of the author's bibliography entitled “Finite element modelling of ceramics and glass” and published in Engineering Computations, Vol. 16, 1999, pp. 510‐71 for the period 1977‐1998.

The form of the paper is a bibliography. Listed references have been retrieved from the author's database, MAKEBASE. Also Compendex has been checked. The period is 1998‐2004.

Provides a listing of 1,432 references. The following topics are included: ceramics – material and mechanical properties in general, ceramic coatings and joining problems, ceramic composites, piezoceramics, ceramic tools and machining, material processing simulations, fracture mechanics and damage, applications of ceramic/composites in engineering; glass – material and mechanical properties in general, glass fiber composites, material processing simulations, fracture mechanics and damage, and applications of glasses in engineering.

This paper makes it easy for professionals working with the numerical methods with applications to ceramics and glasses to be up‐to‐date in an effective way.

In this research work thick‐film manufacturing technology on stainless steel baseplates was developed. Adequate adhesion of dielectric IP211 to the steel substrate was achieved only by sand blast roughening. Standard PdAg thick‐film conductors were not solderable to IP211. The solution was to have a separate multilayer dielectric under conductors to be soldered. The reliability of soft soldering and gold wire bonding of thick‐film metallisation on stainless steel and other baseplate materials was evaluated. The technology developed was applied to manufacturing an intelligent signal node. Present expertise enables the manufacture of thick‐film hybrids on stainless steel baseplates. Development of an industrial production line would, however, involve considerable effort.