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Article
Publication date: 9 February 2022

Agata Skwarek, Przemysław Piotr Ptak, Krzysztof Górecki, Krzysztof Witek and Balázs Illés

This paper aims to present the results of investigations that show the influence of ZnO composite soldering paste on the optical and thermal parameters of power light-emitting…

Abstract

Purpose

This paper aims to present the results of investigations that show the influence of ZnO composite soldering paste on the optical and thermal parameters of power light-emitting diodes (LEDs).

Design/methodology/approach

ZnO nanocomposite solder alloys were produced via the ball milling process from the solder paste Sn99Ag0.3Cu0.7 (SACX0307) and 1.0 wt% of ZnO nanoparticle reinforcements with different primary particle sizes (200 nm, 100 nm and 50 nm). Power LEDs were soldered onto a metal core printed circuit board. A self-designed LED test system was used to measure the thermal and optical characteristics of the LEDs.

Findings

The influence of the soldering paste on the thermal and optical parameters of LEDs was observed. In all solder alloys, ZnO ceramic reinforcement, at a level of 1 wt%, increased the thermal parameters of LEDs and decreased their luminous efficiency. Thermal resistance values were10% higher, and junction temperature change over ambient temperature was 20% higher for the samples soldered with composite solder pastes than the reference sample. At the same time, luminous efficiency dropped by 32%.

Originality/value

The results prove that ZnO ceramic reinforcement of solder paste influences the thermal properties of solder joints. As was proven, the quality of the solder joints influences the whole assembly.

Details

Soldering & Surface Mount Technology, vol. 34 no. 4
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 1 August 2016

Agata Skwarek

Abstract

Details

Microelectronics International, vol. 33 no. 3
Type: Research Article
ISSN: 1356-5362

Content available
Article
Publication date: 2 July 2018

Agata Skwarek

211

Abstract

Details

Microelectronics International, vol. 35 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 7 August 2017

Agata Skwarek

273

Abstract

Details

Microelectronics International, vol. 34 no. 3
Type: Research Article
ISSN: 1356-5362

Content available
Article
Publication date: 29 July 2019

Agata Skwarek

208

Abstract

Details

Microelectronics International, vol. 36 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 13 March 2018

Agata Skwarek

339

Abstract

Details

Circuit World, vol. 44 no. 1
Type: Research Article
ISSN: 0305-6120

Content available
Article
Publication date: 27 March 2018

Agata Skwarek

227

Abstract

Details

Soldering & Surface Mount Technology, vol. 30 no. 2
Type: Research Article
ISSN: 0954-0911

Content available
Article
Publication date: 23 August 2020

Agata Skwarek

214

Abstract

Details

Soldering & Surface Mount Technology, vol. 32 no. 4
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 20 June 2019

Agata Skwarek

238

Abstract

Details

Soldering & Surface Mount Technology, vol. 31 no. 3
Type: Research Article
ISSN: 0954-0911

Content available
Article
Publication date: 6 February 2017

Agata Skwarek

340

Abstract

Details

Circuit World, vol. 43 no. 1
Type: Research Article
ISSN: 0305-6120

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