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Over the past decade, increased logistics costs, improved packaging technology, and enhanced environmental regulations have caused logistics managers to reevaluate their packaging decisions. The impact of packaging decisions on logistics costs illustrates the need for strategic thinking in the assessment of packaging options. In addition, the combination of more demanding technological and environmental requirements by customers and governmental legislation suggests that packaging decisions must be viewed strategically within the logistics planning process. This paper examines the relationship between strategic packaging elements and the competitive edges on which firms can compete in the marketplace. The effects of packaging associated costs, advances in packaging technology, and the environmental movement are explored to highlight their strategic impact. Finally, a conceptual framework for assessing strategic packaging decisions in relation to a firm's competitive edges is presented.

To provide an insight and view of the expected directions for microelectronic packaging, at chip level, that ties in current developments to the needs envisaged by emerging technology roadmaps.

The requirements for packaging semiconductor devices have become a new technology driver for the electronics “Final Manufacturing” industry. In line with forecasts and roadmaps, the expected multitude of options are being developed in order to meet the demand of an industry which requires ever more complex devices which exhibit both higher reliability and lower cost.

As application potentials develop, so package cost becomes the driver. In turn, low cost package solutions are becoming the drivers for new technologies such as “last‐mile” fibre optic Telecom systems, 3G phones, bluetooth and sensors. MEMS devices are a key example of how applications are pushing the technologies to create cost effective packaging.

The emerging packaging technologies, currently BGA's and chip size packaging's (CSP), continue to develop to meet the needs of electronic devices, driven by the “smaller, faster, cheaper” paradigm. However the final manufacturing and testing aspects of such needs are often overlooked and as such the test industry faces a number of severe challenges in terms of handling these new package technologies.

By looking at the market trends and how these new technologies are developing, especially with respect to emerging developments in CSP, flip chip and wafer level packaging, solutions for many of the challenges posed can be determined.

This paper provides a market analysis of the trends and directions of the chip packaging industry. It has taken data from a wide number of sources of market information and compared the expectations of each to actual emerging applications. The resulting information is expected to become a benchmark for this aspect of the semiconductor manufacturing industry.

The purpose of this paper is to present a comprehensive analysis on how the advanced work packaging (AWP) managerial paradigm could be advanced by incorporating and integrating the post-construction commissioning and startup (CSU) phases.

This study was implemented with the support of consolidated knowledge from industry subject matter experts and an exhaustive literature review to provide a knowledge foundation for the developments. The findings were further validated and strengthened by external subject matter experts.

A new operating system-oriented work package, systems work package (SWP), is devised with a set of definitions and models of how it relates to AWPs with three-dimensional visualizations. SWP-related constraints, key roles and responsibilities are thoroughly investigated.

A new SWP concept would pose potential challenges for its adoption because of inherent organizational culture and hesitation to change. A systematic reorganization of existing practices is considered as a key strategy to alleviate the limitation, and short- and long-term validity of SWP is currently being investigated by organizations.

This research provides practical implementation strategies on CSU integration which lead to benefits including: better alignment and collaboration of stakeholders, reduced costs for associating AWPs to SWP and improved predictability.

AWP-related studies have primarily focused on the construction phase, with minimal integration of CSU considerations. Highlighting the importance of the philosophy “start with the end in mind,” this research describes how the AWP managerial paradigm can be expanded to include CSU, by placing a strong emphasis on understanding CSU priorities, sequences and constraints.

Seminar (Italian/English): ‘Trends in Materials and Manufacturing of PCBs’

The purpose of this paper is to explore progress in electronic circuit miniaturisation, and study the new medical sensor devices emerging.

Circuit packaging advances in the mobile phone sector are examined. The products and expertise of a leading producer of non‐contact sensors and medical implants are described, followed by a series of medical applications of 3D circuitry.

Mobile phone enhancements are driving innovations in electronics that are transferable to other industries. Wafer‐thinning and 3D interconnection techniques shrink complex circuitry, enabling the construction of sensitive intelligent wireless sensors. Biologically inert packaging enables such devices to be implanted in the human body to improve sight and hearing, and monitor bone‐healing after surgery.

The paper shows how electronic packaging innovations are spinning out into non‐contact sensors and medical implants and will be of interest to engineers in these fields, and of general interest to a wider readership.

The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed.

Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process.

With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed.

This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process.

The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

This review paper aims to provide a better understanding of formulation and processing of anisotropic conductive adhesive film (ACF) material and to summarize the significant research and development work for the mechanical properties of ACF material and joints, which helps to the development and application of ACF joints with better reliability in microelectronic packaging systems.

The ACF material was cured at high temperature of 190°C, and the cured ACF was tested by conducting the tensile experiments with uniaxial and cyclic loads. The ACF joint was obtained with process of pre-bonding and final bonding. The impact tests and shear tests of ACF joints were completed with different aging conditions such as high temperature, thermal cycling and hygrothermal aging.

The cured ACF exhibited unique time-, temperature- and loading rate-dependent behaviors and a strong memory of loading history. Prior stress cycling with higher mean stress or stress amplitude restrained the ratcheting strain in subsequent cycling with lower mean stress or stress amplitude. The impact strength and adhesive strength of ACF joints increased with increase of bonding temperature, but they decreased with increase of environment temperature. The adhesive strength and life of ACF joints decreased with hygrothermal aging, whereas increased firstly and then decreased with thermal cycling.

This study is to review the recent investigations on the mechanical properties of ACF material and joints in microelectronic packaging applications.

The set of properties required for microwave packaging materials intended for aerospace applications is discussed in relation to the current range of materials that are commercially available. Initiatives are being taken to replace kovar, the established packaging material, with substitutes which are lighter, stiffer and offer superior heat‐sinking. Promising in this regard are new family of beryllium‐beryllia and also silicon‐aluminium (Si‐Al) alloys high in silicon, with ratios of constituents chosen such that they optimally complement gallium arsenide MMIC devices and alumina circuit boards. Both types of material are relatively easy to machine and electroplate. Demonstrator microwave amplifier modules incorporating the Si‐Al alloys have been designed for space applications and have been successfully produced and tested. The manufacturing technology that has been developed for this purpose is described.