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Article
Publication date: 1 February 1992

D.G. Whitehead, A.V. Polijanczuk and P.M. Beckett

The application of laser technology has recently become economically viable for microelectronics and surface mount technology. Semiconductor laser technology may prove to…

Abstract

The application of laser technology has recently become economically viable for microelectronics and surface mount technology. Semiconductor laser technology may prove to be the only technology capable of solving the assembly problems that will accompany further advances in microelectronics. Some characteristics of Nd‐YAG and CO2 lasers are compared with the performance of semiconductor diode lasers for soldering purposes. The early stages of evaluation of semiconductor diode lasers in an experimental soldering station at the University of Hull suggest that these lasers serve as an efficient selective, controllable and compact high power density heating source capable of meeting present and future microelectronics soldering requirements.

Details

Microelectronics International, vol. 9 no. 2
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 June 1995

D G Whitehead and R J Foster

With the ever‐decreasing size of electronic components, examinesthe use of laser soldering, particularly of fine‐pitch, high valuedevices. Discusses the advantages and…

Abstract

With the ever‐decreasing size of electronic components, examines the use of laser soldering, particularly of fine‐pitch, high value devices. Discusses the advantages and disadvantages of using lasers and the applications to which they are suited. Looks at the different types of lasers and how their different wavelength of operation affects the soldering process. Describes an experimental laser soldering station and its ability to solder circuit boards. Concludes that modern electronic component packaging technology is demanding new techniques for the interconnection of devices, and that the application of lasers to the traditional technique of soldering will enable this tested process to be applicable to the very fine pitch devices now being introduced.

Details

Assembly Automation, vol. 15 no. 2
Type: Research Article
ISSN: 0144-5154

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