Table of contents
Lead‐free solders — The next environmental challenge?
MARK WHITMOREThe electronics assembly industry has experienced many changes in recent years and continues to meet new challenges on technical, economic and environmental fronts. Throughout its…
Prospects of Solder Paste in the Ultra‐fine Pitch Era
M. Xiao, K.J. Lawless, N.‐C. Lee12 mil pitch processing is achievable with solder paste. It may also be the limit of solder paste printing technology, mainly due to the scooping problem associated with thin…
Predicting Scooping and Skipping in Solder Paste Printing for Reflow Soldering of SMT Devices
S.H. Mannan, N.N. Ekere, E.K. Lo, I. IsmailThis paper examines the rôle that the squeegee plays in the solder paste printing process. Although the printing of solder paste is only one stage of many in the surface mount…
The Influence of Metal Plating of Chip Carriers on Reliability of SMT Solder Joints under Thermal Cycling
J.H. Huang, H.Z. LiAn experimental set‐up and a simulated ceramic chip carrier to study SMT solder joint reliability under thermal cycling have been developed. The influence of metal plating of the…
Use of Nitrogen in Reflow Soldering
R.J. Klein Wassink, M.C. Seegers, M.M.F. VerguldSeveral effects of the atmosphere in the soldering oven on both the soldering process itself and the soldering results are discussed. Experiments have been undertaken to compare…
Metallurgical Evaluation of Steam Aged LCCC Devices following Solderability Testing
B.D. DunnSolderability testing, according to Military Standard 883, has evolved through four sets of different test conditions during the past ten years. These relate to the duration of…
Creep of 96.5Sn3.5Ag Solder Interconnects
J.H. LauAn exact analysis is presented for the creep deformation of solder interconnects subjected to the actions of bending moment, twisting moment and axial force. Dimensionless…
Numerical Analysis of the Ball Forming Process in Copper Ball Bonding
F. Hongyuan, Q. Yiyu, J. YihongIn this paper, the process of forming copper wire balls in copper ball bonding has been studied by numerical analysis. By calculating the temperature field, speed field and…
SM Placement Technology: Part 2
H. PawlischekThis paper, which will be published in two parts in consecutive issues of Soldering & Surface Mount Technology, reproduces a chapter of the recently published book ‘Handbook of…
Thickness Testing of Electroplated and Related Coatings
G.P. RayAfter obtaining his membership of the Institution of Metallurgists (now Institute of Materials), Dr Ray attended City of London Polytechnic, gaining an MSc degree in corrosion…
SMT/ASIC/Hybrid 1993
In its seventh year, SMT/ASIC/Hybrid 1993 continued its popularity and, despite the uncertain state of the west European economy, this year's event in Nuremberg attracted more…
SMART group news
Design for manufacture and testability seems to be a very hot topic. This seminar organised by Bob Willis was over‐subscribed within the first two weeks of announcement, and the…
International association news
R.A. ShacklefordDate: 20 October 1993 Venue: The Regency Hotel, Shirley, Solihull, West Midlands Introduction This conference will provide a forum for discussions on recent advances in high…
Industry news
B.D. DunnAs part of a global expansion programme, Alpha Metals have announced two senior personnel changes which will strengthen their sales operations both in the UK and in the USA.
New Products
Electrovert have announced the launch of the Atmos 1000CR reflow soldering system with nitrogen. It is a compact computer‐controlled 5‐zone, 10‐heater convection system that is…
ISSN:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang