Soldering & Surface Mount Technology: Volume 4 Issue 2

SMT ‐ Components and Capital Investment

Maurice Sage

By the year 2000 electronics will be the largest single industry the world has yet seen, with an output valued at around 1400 billion US dollars. Changes in technologies and…

Application of Experimental Design to the Solder Paste Screen Printing Process

T.A. Molamphy, M.I. Stephenson, E.A. Murphy

Experimental design has proved to be a useful statistical tool in reducing process variation. The technique has been applied to a wide range of processes, including electronics…

A Study of the Failure of Soldered SMT Joints during Thermal Cycling

J.H. Huang, W. Gao, Y.Y. Jian, Y.H. Jiang

An installation has been developed for carrying out thermal cycling experiments on soldered SMT joints. Using this thermal cycle installation (which was developed by the authors…

A Study of the Mechanical Behaviour of SnPb Solders using Viscoelasticity Theory

J.H. Huang, Y.H. Jiang, Y.Y. Qian, Q.L. Wang

This paper presents a viscoelastic model for analysing the mechanical behaviour of SnPb solders which has been developed by combining grain boundary slip with viscoelasticity…

Knowledge‐based Adhesive Selection for SMT Assemblies

A. Derebail, K. Srihari, G. Westby

The last decade witnessed the increasing use of Surface Mount Technology (SMT) in the assembly of Printed Circuit Boards (PCBs). This fact coupled with increasing component…

Stress Analysis of Component Attachments to Printed Circuit Boards

V. Prakash, P.A. Engel, J.M. Pitarresi, T. Albert, G. Westby

During the insertion of pin‐in‐hole (PIH) components in a printed circuit board (PCB), adhesively bonded and/or soldered surface mount components (SMCs) already on the board…

Calculation of Solder Joint Volume for TAB and MCR Components

M.J. Remmler, A. Mödl, F. Hermann

This paper describes ways of simplifying the equations characterising the equilibrium shape of reflowed solder in the interconnection of TAB (Tape Automated Bonding) and MCR…

Laser Trimming SMTs: Automating the Final Electrical Adjustments

W.P. Dobbins

In SMT manufacturing, automation is the key to achieving the highest throughput at the lowest cost. Complex devices of various shapes and sizes often require final electrical…

The Chemical Design and Optimisation of a Non‐rosin, Water‐soluble Flux Solder Paste

J. Frazier, R. Jackson, R. Reich, R. Enno, W. Ables, L. Bosworth

This paper describes the approach used by the authors to select the flux materials for a simple water‐soluble solder paste flux formulation, what those materials were, and how…

SMART group news

COLIN LEA, Cian O'Mathúna

The first results from two collaborative UK programmes assessing the performance of non‐CFC cleaning options for the electronics assembly industry were presented at a one‐day…

International association news

BABS AUTUMN CONFERENCE 1992 — The Joining Environment. Date: 14–15 October 1992 Venue: Post House, Coventry The BABS 1992 Autumn Conference The Joining Environment, to be held at…

Industry news

Chicago Laser Systems (CLS) have moved to new headquarters in Des Plaines, a suburb of Chicago, near O'Hare International Airport. The new facility, comprising 52,000ft2, embodies…

New Products

Robotic Process Systems has developed a new five‐axis, fully automated and articulated ‘Cartesian Robot’ for component lead tinning. This system combines the dexterity found in…