Soldering & Surface Mount Technology: Volume 37 Issue 1

Subject:

Table of contents

Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages

Muhammad Aqil Azman, Mz Abdullah, Wei Keat Loh, Chun Keang Ooi

The purpose of this study is to investigate the dynamics of capillary underfill flow (CUF) in flip-chip packaging, particularly in a multi-chip configuration. The study aims to…

Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN

Calvin Ling, Cheng Kai Chew, Aizat Abas, Taufik Azahari

This paper aims to identify a suitable convolutional neural network (CNN) model to analyse where void(s) are formed in asymmetrical flip-chips with large amounts of the ball-grid…

Comparative study of machine learning method and response surface methodology in BGA solder joint parameter optimization

Fang Liu, Zhongwei Duan, Runze Gong, Jiacheng Zhou, Zhi Wu, Nu Yan

Ball grid array (BGA) package is prone to failure issues in a thermal vibration-coupled environment, such as deformation and fracture of solder joints. To predict the minimum…

Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling

Xu Long, Xianyi Zhao, Kainan Chong, Yutai Su, Kim S. Siow, Zhi Wang, Fengrui Jia, Xin Wan

The purpose of this paper is to analyze and compare the mechanical properties of sintered nanosilver with different porosities at both the mesoscopic and macroscopic scales and to…

Wettability and microstructure transformations of YAG ceramic brazing to kovar alloy with AgCuTi filler alloy

Wei Lin, Cheng Wang, Qingyi Zou, Min Lei, Yulong Li

This paper aims to conduct work to obtain high-quality brazed joint of YAG ceramic and kovar alloy.

Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder

Jiamin Zhang, Liang Zhang, Xi Huang, Chuanjiang Wu, Kai Deng, Wei-Min Long

This paper aims to investigate the improvement of Sn58Bi solder properties by Ni nanoparticle to provide theoretical support in the field of electronic packaging.

Application and practice of LILCEO sintering proportion optimization algorithm in sintering plant

Lingzhi Yi, Kai Ren, Yahui Wang, Wei He, Hui Zhang, Zongping Li

To ensure the stable operation of ironmaking process and the quality and output of sinter, the multi-objective optimization of sintering machine batching process was carried out.

Cover of Soldering & Surface Mount Technology

ISSN:

0954-0911

e-ISSN:

1758-6836

ISSN-L:

0954-0911

Online date, start – end:

1989

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editors:

  • Professor Peng He
  • Associate Professor Shuye Zhang