Soldering & Surface Mount Technology: Volume 36 Issue 5

Subject:

Table of contents

Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly

Yan Pan, Shuye Zhang, Pengli Zhu, Kyung W. Paik

The study aims to ascertain the influence of solder conductive particle types and substrate widths on the current carrying capability of flex-on-board (FOB) assemblies. By…

Influence of annealing temperature on 3D surface stereometric analysis in C-Ni films

Vali Dalouji, Nasim Rahimi

The purpose of this paper is to study the correlation between the thicknesses of the C–Ni films that have been prepared by RF-magnetron sputtering on quartz substrates and their…

Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating

Zhang Liang

The purpose of this study is the formation and growth of nanoscale intermetallic compounds (IMCs) when laser is used as a heat source to form solder joints.

Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate

Jiacheng Zhou, Jinglin Shi, Lei Xu, Fuwen Zhang, Zhigang Wang, Qiang Hu, Huijun He

The reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to…

Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping

Lina Syazwana Kamaruzzaman, Yingxin Goh, Yi Chung Goh

This study aims to investigate the effect of incorporating cobalt (Co) into Sn-58Bi alloy on its phase composition, tensile properties, hardness and thermal aging performances…

Effect of different beam distances in laser soldering process: a numerical and experimental study

Muhammad Zaim Hanif Nazarudin, Mohamad Aizat Abas, Wan Maryam Wan Ahmad Kamil, Faiz Farhan Ahmad Nadzri, Saifulmajdy A. Zahiri, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani, Mohd Hafiz Zawawi

This paper aims to investigate the effect of different beam distance by understanding laser beam influence on solder joint quality. The utilisation numerical-based simulations and…

Numerical modeling and optimization of fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly

Rilwan Kayode Apalowo, Muhamed Abdul Fatah Muhamed Mukhtar, Mohamad Aizat Abas, Fakhrozi Che Ani

This study aims to investigate the design configuration for an optimum solder height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly.

Cover of Soldering & Surface Mount Technology

ISSN:

0954-0911

e-ISSN:

1758-6836

ISSN-L:

0954-0911

Online date, start – end:

1989

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editors:

  • Professor Peng He
  • Associate Professor Shuye Zhang