Table of contents
Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly
Yan Pan, Shuye Zhang, Pengli Zhu, Kyung W. PaikThe study aims to ascertain the influence of solder conductive particle types and substrate widths on the current carrying capability of flex-on-board (FOB) assemblies. By…
Influence of annealing temperature on 3D surface stereometric analysis in C-Ni films
Vali Dalouji, Nasim RahimiThe purpose of this paper is to study the correlation between the thicknesses of the C–Ni films that have been prepared by RF-magnetron sputtering on quartz substrates and their…
Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating
Zhang LiangThe purpose of this study is the formation and growth of nanoscale intermetallic compounds (IMCs) when laser is used as a heat source to form solder joints.
Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate
Jiacheng Zhou, Jinglin Shi, Lei Xu, Fuwen Zhang, Zhigang Wang, Qiang Hu, Huijun HeThe reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to…
Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping
Lina Syazwana Kamaruzzaman, Yingxin Goh, Yi Chung GohThis study aims to investigate the effect of incorporating cobalt (Co) into Sn-58Bi alloy on its phase composition, tensile properties, hardness and thermal aging performances…
Effect of different beam distances in laser soldering process: a numerical and experimental study
Muhammad Zaim Hanif Nazarudin, Mohamad Aizat Abas, Wan Maryam Wan Ahmad Kamil, Faiz Farhan Ahmad Nadzri, Saifulmajdy A. Zahiri, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani, Mohd Hafiz ZawawiThis paper aims to investigate the effect of different beam distance by understanding laser beam influence on solder joint quality. The utilisation numerical-based simulations and…
Numerical modeling and optimization of fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly
Rilwan Kayode Apalowo, Muhamed Abdul Fatah Muhamed Mukhtar, Mohamad Aizat Abas, Fakhrozi Che AniThis study aims to investigate the design configuration for an optimum solder height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly.

ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang