Table of contents
Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted
Guisheng Gan, Shi-qi Chen, Liujie Jiang, Cong Liu, Peng Ma, Tian Huang, Dayong Cheng, Xin LiuThis study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints with different bonding temperature under ultrasonic-assisted.
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact
Soufyane Belhenini, Imad El Fatmi, Caroline Richard, Abdellah TouguiThis study aims to contribute to the numerical modelling of drop impact on a flip-chip component assembled on printed circuit boards using solder micro-bumps. This contribution is…
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering
Muhammad Asyraf Abdullah, Siti Rabiatull Aisha IdrisPb-free solders have been developed to replace the standard Sn–Pb eutectic solder since the prohibition on Pb used in solders. The Sn–Ag–Cu series of lead-free solders is the most…
Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures
Wei Lin, Xuewen Li, Bing Tu, Chaohua Zhang, Yulong LiThis study aims to analyze the wettability of the self-developed Sn–Bi–Zn solder and to conduct a series of analysis on the wetting kinetics, diffusion phenomenon and interfacial…
Hot tear cracks on the suppression of Sn–Bi alloy for low-temperature assembly
Songtao Qu, Qingyu ShiIn the electronic assembly industry, low-temperature soldering holds great potential to be used in surface mounting technology. Tin–bismuth (Sn–Bi) eutectic alloys are lead-free…
Drop and impact reliability investigation of BGA and LGA interconnects
Tian Sang, Mohammad A. Gharaibeh, Luke Wentlent, James R. Wilcox, James M. PitarresiBecause of growing demand for slim, thin and cheap handheld devices, reduced-volume solder interconnects like land grid array (LGA) are becoming attractive and popular choices…

ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang