Soldering & Surface Mount Technology: Volume 35 Issue 4

Subject:

Table of contents

Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted

Guisheng Gan, Shi-qi Chen, Liujie Jiang, Cong Liu, Peng Ma, Tian Huang, Dayong Cheng, Xin Liu

This study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints with different bonding temperature under ultrasonic-assisted.

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Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact

Soufyane Belhenini, Imad El Fatmi, Caroline Richard, Abdellah Tougui

This study aims to contribute to the numerical modelling of drop impact on a flip-chip component assembled on printed circuit boards using solder micro-bumps. This contribution is…

Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering

Muhammad Asyraf Abdullah, Siti Rabiatull Aisha Idris

Pb-free solders have been developed to replace the standard Sn–Pb eutectic solder since the prohibition on Pb used in solders. The Sn–Ag–Cu series of lead-free solders is the most…

Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures

Wei Lin, Xuewen Li, Bing Tu, Chaohua Zhang, Yulong Li

This study aims to analyze the wettability of the self-developed Sn–Bi–Zn solder and to conduct a series of analysis on the wetting kinetics, diffusion phenomenon and interfacial…

Hot tear cracks on the suppression of Sn–Bi alloy for low-temperature assembly

Songtao Qu, Qingyu Shi

In the electronic assembly industry, low-temperature soldering holds great potential to be used in surface mounting technology. Tin–bismuth (Sn–Bi) eutectic alloys are lead-free…

Drop and impact reliability investigation of BGA and LGA interconnects

Tian Sang, Mohammad A. Gharaibeh, Luke Wentlent, James R. Wilcox, James M. Pitarresi

Because of growing demand for slim, thin and cheap handheld devices, reduced-volume solder interconnects like land grid array (LGA) are becoming attractive and popular choices…

Cover of Soldering & Surface Mount Technology

ISSN:

0954-0911

e-ISSN:

1758-6836

ISSN-L:

0954-0911

Online date, start – end:

1989

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editors:

  • Professor Peng He
  • Associate Professor Shuye Zhang