Soldering & Surface Mount Technology: Volume 35 Issue 2
Table of contents
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solderRizk Mostafa Shalaby, Musaeed Allzeleh
This study aims to study the impact of intermetallic compound on microstructure, mechanical characteristics and thermal behavior of the melt-spun Bi-Ag high-temperature…
Effect of the IMC layer geometry on a solder joint thermomechanical behaviorPaulina Araújo Capela, Maria Sabrina Souza, Sharlane Costa, Jose C. Teixeira, Miguel Fernandes, Hugo Figueiredo, Isabel Delgado, Delfim Soares
In a printed circuit board assembly (PCBA), the coefficient of thermal expansion (CTE) mismatch between the solder joint materials has a detrimental impact on reliability…
Parameter optimization for surface mounter using a self-alignment prediction modelMaitri Mistry, Rahul Gupta, Swati Jain, Jaiprakash V. Verma, Daehan Won
The purpose of this paper is to develop a machine learning model that predicts the component self-alignment offsets along the length and width of the component and in the…
Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directionsWangyun Li, Linqiang Liu, Xingmin Li
This study aims to experimentally assess the effect of thickness and preparation direction on the damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders.
Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperatureGuisheng Gan, Shiqi Chen, Liujie Jiang, Zhaoqi Jiang, Cong Liu, Peng Ma, Dayong Cheng, Xin Liu
This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Cu joints.
Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloysZilong Wang, JiaCheng Zhou, Fang Liu, Yuqin Wu, Nu Yan
The purpose of this paper is to study the microstructure and properties of Sn-3.5Ag and Sn-3.5Ag-0.5Sb lead-free solder alloys with and without a rotating magnetic field (RMF).
Mechanical testing and characterization of tin–zinc–antimony–lanthanum lead-free solders produced using mechanical alloying and furnace melting techniquesArthur Jebastine Sunderraj D., Ananthapadmanaban D., Arun Vasantha Geethan Kathiresan
The purpose of this paper is to investigate the effects of two different weight percentages of lanthanum on tin–zinc–antimony solder alloys. Two manufacturing techniques…
Online date, start – end:1989
Copyright Holder:Emerald Publishing Limited
- Professor Peng He
- Associate Professor Shuye Zhang