Soldering & Surface Mount Technology: Volume 35 Issue 1

Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints

Meng Xu, Fenglian Sun, Zhen Pan, Yang Liu

The purpose of this paper is to study the temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints compared with Sn-5Sb/Cu and SAC305/Cu micro solder…

Thermal and mechanical analysis of low-temperature and low-pressure silver-based sintered thermal joints

Krzysztof Jakub Stojek, Jan Felba, Damian Nowak, Karol Malecha, Szymon Kaczmarek, Patryk Tomasz Tomasz Andrzejak

This paper aims to perform thermal and mechanical characterization for silver-based sintered thermal joints. Layer quality affects thermal and mechanical performance, and it is…

Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy

Hamed Al-sorory, Mohammed S. Gumaan, Rizk Mostafa Shalaby

This study aims to investigate the effect of a small amount of TiO₂ NPs addition on the microstructure, thermal, mechanical and electrical properties of environmentally friendly…

Investigation of ultrasound-assisted soldering of SiC ceramics by using Zn-Al-In solder for high-temperature applications

Igor Kostolný, Roman Kolenak, Paulina Babincova, Martin Kusý

This study aims to investigate soldering of SiC ceramics by using Zn-Al-In-based solders and ultrasonic soldering. The focus was on the quality of soldered joints, examining the…

Numerical simulation of reliability of single-sided/double-sided package interconnect structure under temperature cyclic load

Shuo Huang, Yang Liu, Ke Li

The purpose of this paper is to compare the single-sided packaging structure and double-sided packaging structure of high-power module and study the overall heat dissipation…

Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint

Gangli Yang, Xiaoyan Li, Xu Han, Shanshan Li

This study aims to analyse the changes in the microstructure and grain orientation of the full Cu₃Sn solder joint (Cu/Cu₃Sn/Cu) during isothermal aging at 420°C.

Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach

Wan Yusmawati Wan Yusoff, Norliza Ismail, Nur Farisa Nadia Mohmad Lehan, Azuraida Amat, Ku Zarina Ku Ahmad, Azman Jalar, Irman Abdul Rahman

This paper aims to investigate the effect of different doses of gamma radiation on the micromechanical response (hardness properties and creep behaviour) of 96.5Sn-3.0Ag-0.5Cu…