Soldering & Surface Mount Technology: Volume 33 Issue 1

Device architecture optimization of solder ball joints fatigue lifetime under random vibration frequencies

Yang Gao, Fuwei Wang, Shaohu Ding, Bin Yang, Lin Liu, Mohammad Salmani

This study aims to investigate the vibration effects on ball grid array lifetime.

Mechanical reliability of self-aligned chip assembly after reflow soldering process

Mohd Najib Ali Mokhtar, M.Z. Abdullah, Abdullah Aziz Saad, Fakhrozi Cheani

This paper focuses on the reliability of the solder joint after the self-alignment phenomenon during reflow soldering. The aim of this study is to analyse the joint quality of the…

The effect of Bi addition on the electrical and microstructural properties of SAC405 soldered structure

Delfim Soares, Manuel Sarmento, Daniel Barros, Helder Peixoto, Hugo Figueiredo, Ricardo Alves, Isabel Delgado, José C. Teixeira, Fátima Cerqueira

This study aims to investigate the effect of bismuth addition (up to 30 Wt%) on the microstructure and electrical conductivity of a commercial lead-free alloy (SAC405) near the…

Reliability assessment of ball grid array joints under combined application of thermal and power cycling: solder geometry effect

Sathish Kumar, Oleg R. Kuzichkin, Ahmed Faisal Siddiqi, Inna Pustokhina, Aleksandr Yu Krasnopevtsev

This study aims to investigate simultaneous power and thermal loading.

Performance of 96.5Sn–3Ag–0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing

Guang Chen, Xinzhan Cui, Yaofeng Wu, Wei Li, Fengshun Wu

The purpose of this paper is to investigate the effect of fullerene (FNS) reinforcements on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free…

Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition

Norliza Ismail, Azman Jalar, Maria Abu Bakar, Nur Shafiqa Safee, Wan Yusmawati Wan Yusoff, Ariffin Ismail

The purpose of this paper is to investigate the effect of carbon nanotube (CNT) addition on microstructure, interfacial intermetallic compound (IMC) layer and micromechanical…

Influence of aging on microstructure and hardness of lead-free solder alloys

Carina Morando, Osvaldo Fornaro

The purpose of this paper is to carry out a study of the evolution of the microstructure and the microhardness of Sn-Cu-Ag alloys from as-cast condition and under artificial…