Soldering & Surface Mount Technology: Volume 32 Issue 3

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Yansong Tan, Xin Li, Xu Chen, Zhenwen Yang, Guo-Quan Lu

This paper aims to use nano-silver paste to design a new bonding method for super-large-area direct-bonded-aluminum (DBA) plates. It compared several frequently used bonding…

Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloy

Sanaa Razzaq Abbas, Mohammed S. Gumaan, Rizk Mostafa Shalaby

This study aims to investigate the chromium (Cr) effects on the microstructural, mechanical and thermal properties of melt-spun Sn-3.5Ag alloy.

Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studies

Muhammad Naqib Nashrudin, Zhong Li Gan, Aizat Abas, M.H.H. Ishak, M. Yusuf Tura Ali

In line with the recent development of flip-chip reliability and underfill process, this paper aims to comprehensively investigate the effect of different hourglass shape solder…

Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu

Norliza Ismail, Azman Jalar, Maria Abu Bakar, Roslina Ismail, Najib Saedi Ibrahim

The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint according to the formulation of…

SMT assembly effects on organic substrate lifetime reduction

Seok-Hwan Huh

The purpose of this study is that the effects of surface mount technology (SMT) assembly process on the product lifetime of fine-pitch printed circuit boards (PCBs) were…

Prediction of viscosity of ternary tin-based lead-free solder melt using BP neural network

Min Wu, Bailin Lv

Viscosity is an important basic physical property of liquid solders. However, because of the very complex nonlinear relationship between the viscosity of the liquid ternary…

Experimental and numerical fatigue life assessment of SAC305 solders subjected to combined temperature and harmonic vibration loadings

Mohammad Gharaibeh

This paper aims to investigate the fatigue life performance of SAC305 ball grid array solders under combined temperature and harmonic vibration loading conditions.