Soldering & Surface Mount Technology: Volume 32 Issue 2

Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature aging

Bangyao Han, Fenglian Sun, Tianhui Li, Yang Liu

The purpose of this paper is to investigate the morphology evolution and the composition transformation of Au-Sn intermetallic compounds (IMCs) of the new…

Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder

Ramani Mayappan, Amirah Salleh, Nurul Atiqah Tokiran, N.A. Awang

The purpose of this study is to investigate the addition of 0.05 Wt.% carbon nanotube (CNT) into the Sn-1.0Ag-0.5Cu (SAC) solder on the intermetallic (IMC) growth. Lead-based…

Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint

Yun Liu, Weiyuan Yu, Xuemin Sun, Fengfeng Wang

This paper aims to investigate the effect of ultrasonic vibration (USV) on the evolution of intermetallic compounds (IMCs), grain morphology and shear strength of soldered…

Machine learning framework for predicting reliability of solder joints

Sung Yi, Robert Jones

This paper aims to present a machine learning framework for using big data analytics to predict the reliability of solder joints. The purpose of this study is to accurately…

Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability

Kamila Piotrowska, Feng Li, Rajan Ambat

The purpose of this paper is to investigate the decomposition behavior of binary mixtures of organic activators commonly used in the no-clean wave flux systems upon their exposure…

Investigation on effects of solder paste voids on thermal and optical performance of white high-power surface-mounted device LEDs

Muna Raypah, Mutharasu Devarajan, Shahrom Mahmud

The presence of voids in the solder layer has been considered as one of the main issues causing reliability problems in optoelectronic devices. Voids can be created due to trapped…

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Muhammad Aamir, Riaz Muhammad, Majid Tolouei-Rad, Khaled Giasin, Vadim V. Silberschmidt

The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the…