Soldering & Surface Mount Technology: Volume 32 Issue 1

Defect minimization and process improvement in SMT lead-free solder paste printing: a comparative study

Rafiq Asghar, Faisal Rehman, Ali Aman, Kashif Iqbal, Agha Ali Nawaz

The purpose of this paper is to investigate and minimize the printing-related defects in the surface mount assembly (SMA) process.

Filling efficiency of flip-chip underfill encapsulation process

Fei Chong Ng, Mohamad Aizat Abas, Mohd Zulkifly Abdullah

This paper aims to introduce a new indicative parameter of filling efficiency to quantify the performance and productivity of the flip-chip underfill encapsulation process…

Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems

Ahmet Mustafa Erer, Serkan Oguz

This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250…

Pulse plated Sn-Cu solder coatings from stannate bath

Ashutosh Sharma, Byungmin Ahn

The purpose of this paper is to investigate the influence of pulse plating current density on the morphology and solderability of Pb-free Sn-Cu solder coatings prepared from…

Electro-thermal simulation and fabrication of LTCC hotplate with lead-free interconnects

D.K. Kharbanda, N. Suri, P.K. Khanna

The purpose of this paper is to explore a new possibility of providing high-temperature stable lead-free interconnections for low-temperature co-fired ceramics (LTCC) hotplate…

Stress analysis and structural optimization of 3-D IC package based on the Taguchi method

Ming-Yue Xiong, Liang Zhang, Peng He, Wei-Min Long

The transistor circuit based on Moore's Law is approaching the performance limit. The three-dimensional integrated circuit (3-D IC) is an important way to implement More than…

Low RH and temperature effect on 0201 sized passive components during SMT mounting

Rafiq Asghar, Faisal Rehman, Ali Aman, Kashif Iqbal

Low relative humidity (RH) effect surface mount devices in numerous ways. The smaller size (0201) capacitor and resistor start wasting when RH is low. Due to low RH, electrostatic…