Soldering & Surface Mount Technology: Volume 30 Issue 4

Reliability studies of InnoLot and SnBi joints soldered on DBC substrate

Agata Skwarek, Balázs Illés, Krzysztof Witek, Tamás Hurtony, Jacek Tarasiuk, Sebastian Wronski, Beata Kinga Synkiewicz

This paper aims to investigate the quality and reliability of solder joints prepared from Pb-free alloys on direct bounded Cu (DBC) substrates. Two types of solder alloys were…

Bonding of Si chips to low carbon steel boards using electroplated Sn solder

Shou-Jen Hsu, Chin C. Lee

The purpose of this research was to develop a new process to bond silicon (Si) chips to low carbon steel substrates using pure tin (Sn) without any flux.

Applying the Taguchi parametric design to optimize the solder paste printing process and the quality loss function to define the specifications

Chien-Yi Huang

This research aims to study the stencil printing process of the quad flat package (QFP) component with a pin pitch of 0.4 mm. After the optimization of the printing process, the…

Solder joint inspection using eigensolder features

Hao Wu, Xiangrong Xu

The authors propose a solder joint recognition method based on eigenspace technology.

Effects of In and Sb addition on the thermal and wetting behavior of Sn-3.5Ag solder

Md Hasnine

This paper aims to investigate the effect of In and Sb additions on the thermal behavior and wettability of Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1…