Table of contents
What of 1992?
NORMAN HODSONWhat are the prospects for the electronics industry in Europe? What part do trade organisations have to play in the development of the electronics industry both today and in the…
Outer Lead Bonding (Flat‐pack Soldering)—A Precision Soldering Process Demanding High Standards
K. Lindner, T. ReindersOuter lead bonding and flat pack soldering are techniques which are becoming more and more important. Due to the fact that pitches decrease and chip sizes increase, the soldering…
Reliability Prediction Tools for SMD Solder Joints
D.C. WhalleyThere is continued concern over the ability of SMD solder joints to survive in the harsh operating environments endured, for example, by automotive and aerospace products. This…
The Use of Capillary Action Measurements for Solderability Improvement
M. Wolverton, B. AbiesThis paper describes the tests performed to evaluate the solder capillary action which occurs within a gap between two solderable surfaces during soldering. The goal was to…
The Influence of Solder Powder on the Properties and Storage Performance of an RMA Solder Paste
M. Warwick, H. SteenSolder pastes are complex products which are designed to meet the conflicting requirements of printability, slump resistance, good tack and a range of reflow conditions. This…
Evidence that Visual Inspection Criteria for Soldered Joints are no Indication of Reliability
C. LeaExemplary data are given that demonstrate unequivocally the inapplicability of commonly used visual inspection criteria for judging the long‐term service reliability of soldered…
Microstructural and Mechanical Characterisation of 43/43/14 Tin/Lead/Bismuth
J.L. Marshall, J. Calderon, J. SeesA mechanical and microstructural study was performed of 43/43/14 tin/lead/bismuth solder. This alloy melts lower than the commonly used tin/lead solders and therefore holds…
After CFCs: Option: Semi‐aqueous Non‐volatile Solvents
C. LeaThe demise of the CFC‐113/alcohol azeotropic solvent for de‐fluxing circuit assemblies after soldering has led, in recent years, to the electronics assembly industry being offered…
SMART group news
Bob Willis, Glyn Jackson, Colin Lea, C.O Mathuna, Padraig HealyElectronics exhibitions are the same the world over, very tiring affairs. If your stand is busy, time flies; if not, the strain is more noticeable.
International association news
M.A. WhitmoreThis, the first BABS meeting to be held at the Institute of Metals was well supported with over 60 delegates in attendance. The seminar Chairman, Dr Hector Steen of Multicore…
Industry news
Dr Wallace Rubin has retired from his post as Technical Director of Multicore Solders Ltd after a distinguished career spanning 37 years with the company. He will continue to act…
New Products
Universal Instruments' recently introduced 4785 HSP High Speed Placement system is capable of handling sizes ranging from 20 in. × 18 in. to 4 in. × 4 in. and assembling a wide…

ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang