Soldering & Surface Mount Technology: Volume 29 Issue 4

CUF scaling effect on contact angle and threshold pressure

Fei Chong Ng, Mohamad Aizat Abas, MZ Abdullah, MHH Ishak, Gean Yuen Chong

This paper aims to present experimental and finite volume method (FVM)-based simulation studies on the scaling effect on the capillary contact angle and entrant pressure for a…

Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy

Muhammad Aamir, Izhar , Muhammad Waqas, Muhammad Iqbal, Muhammad Imran Hanif, Riaz Muhammad

This paper aims to develop a fuzzy logic-based algorithm to predict the intermetallic compound (IMC) size and mechanical properties of soldering material, Sn96.5-Ag3.0-Cu0.5…

Thermal cycling effect on the drop reliability of BGA lead-free solder joints

Fang Liu, Jiacheng Zhou, Nu Yan

The purpose of this paper is to study the drop reliability of ball-grid array (BGA) solder joints affected by thermal cycling.

Hardness testing of lead-free solders: a review

Muhamad Zamri Yahaya, Ahmad Azmin Mohamad

This paper aims to cover the recent (2010-2016) techniques for carrying out hardness evaluation on lead-free solders. Details testing configuration/design were compiled and…

Effect of fluxes on Sn-Zn-Bi solder alloys on copper substrate

Ervina Efzan Mhd Noor, Ayodeji Samson Ogundipe

This paper aims to investigate the effect different fluxes have on the mechanical properties of lead-free solders, specifically Sn-Zn-Bi solder alloy. The solder billets were…