Soldering & Surface Mount Technology: Volume 29 Issue 2

Wetting properties of Nd:YAG laser treated copper by SAC solders

József Hlinka, Miklós Berczeli, Gábor Buza, Zoltán Weltsch

This paper aims to discuss the effect of surface treatment on the wettability between copper and a lead-free solder paste. The industrial applications of laser technologies are…

Investigation and prediction of solder joint failure analysis for ball grid array package subject to mechanical bending environment

Mei-Ling Wu, Jia-Shen Lan

The purpose of this study was to investigate the changes in solder joint stress when subjected to mechanical bending. The analytical theory pertaining to the stresses in the…

Geometric size effect on IMC growth and elements diffusion in Cu/Sn/Cu solder joints

Yan Zhu, Fenglian Sun

The purpose of this paper is to investigate the effect of geometric size on intermetallic compound (IMC) growth and elements diffusion of Cu/Sn/Cu solder joint and establish the…

Effect of nano-Cu addition on microstructure evolution of Sn0.7Ag0.5Cu-BiNi/Cu solder joint

Gaofang Ban, Fenglian Sun, Yang Liu, Shaonan Cong

The purpose of this paper is to focus on the fabrication of SnAgCu (SAC) nanocomposites solder and study the effect of Cu nanopowders (nano-Cu) addition on the microstructure…

Solder paste volume effects on assembly yield and reliability for bottom terminated components

Sai Srinivas Sriperumbudur, Michael Meilunas, Martin Anselm

Solder paste printing is the most common method for attaching surface mount devices to printed circuit boards (PCB), and it has been reported that a majority of all assembly…

Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates

Izhan Abdullah, Muhammad Nubli Zulkifli, Azman Jalar, Roslina Ismail

The purpose of this paper is to investigate the relationship between microstructure and varied strain rates towards the mechanical properties and deformation behaviour of…